公开(公告)号：US08344043B2

公开(公告)日：2013-01-01

申请号：US12971348

申请日：2010-12-17

申请人： Sung Hun Jin ,  Chang Min Hong ,  Dong Hui Chu ,  Tae Woog Jang ,  In Chol Kim ,  Yu Ho Kim ,  Don Keun Lee

发明人： Sung Hun Jin ,  Chang Min Hong ,  Dong Hui Chu ,  Tae Woog Jang ,  In Chol Kim ,  Yu Ho Kim ,  Don Keun Lee

IPC分类号： C08K3/00 ,  C08L51/04 ,  C08F290/04

CPC分类号： C08L25/14 ,  C08L33/12 ,  C08L2205/03 ,  C08L55/02

摘要： The present invention provides a thermoplastic resin composition that can have improved scratch resistance comprising: (A) about 10 to about 20% by weight of a rubber modified aromatic vinyl graft copolymer resin; (B) about 30 to about 50% by weight of polymethylmethacrylate (PMMA) resin; and (C) about 40 to about 60% by weight of an aromatic vinyl copolymer resin including about 5 to about 50% by weight of a (meth)acrylate alkyl ester. The thermoplastic resin composition of the present invention can have a good balance of various properties such as scratch resistance, impact strength, colorability, gloss, and injection molding properties.

摘要翻译： 本发明提供一种具有改善的耐刮擦性的热塑性树脂组合物，其包含：（A）约10至约20重量％的橡胶改性的芳族乙烯基接枝共聚物树脂; （B）约30至约50重量％的聚甲基丙烯酸甲酯（PMMA）树脂; 和（C）约40至约60重量％的包含约5至约50重量％的（甲基）丙烯酸烷基酯的芳族乙烯基共聚物树脂。 本发明的热塑性树脂组合物可以具有耐刮擦性，冲击强度，着色性，光泽和注射成型性等各种性能的良好平衡。

公开(公告)号：US20100152320A1

公开(公告)日：2010-06-17

申请号：US12633875

申请日：2009-12-09

申请人： Bum Seok Youn ,  Lee Kun Cho ,  Young Sik Ryu ,  Chang Min Hong ,  Young Sil Lee ,  Young Jun Lee

发明人： Bum Seok Youn ,  Lee Kun Cho ,  Young Sik Ryu ,  Chang Min Hong ,  Young Sil Lee ,  Young Jun Lee

IPC分类号： C08L53/02 ,  C09D5/16 ,  C08K3/26 ,  C08K3/34 ,  C08K3/36 ,  C08K3/08

CPC分类号： C08L53/025 ,  C08L23/02 ,  C08L53/02 ,  C08L71/12 ,  C08L2666/02 ,  C08L2666/14 ,  C08L2666/06 ,  C08L2666/22 ,  C08L2666/04 ,  C08L23/12 ,  C08L91/00

摘要： A thermoplastic elastomer composition comprises (A) about 25 to about 55 parts by weight of a block terpolymer including an aromatic vinyl compound and an alkene compound; (B) about 20 to about 50 parts by weight of a paraffin oil; (C) about 5 to about 15 parts by weight of a polyolefin resin; (D) about 5 to about 20 parts by weight of an inorganic additive; and (E) about 3 to about 15 parts by weight of a polyphenylene ether. The thermoplastic elastomer composition can have excellent physical properties, such as flexibility (or resilience), surface hardness, and restoring force at high temperatures.

摘要翻译： 热塑性弹性体组合物包含（A）约25至约55重量份的包含芳族乙烯基化合物和烯烃化合物的嵌段三元共聚物; （B）约20至约50重量份的石蜡油; （C）约5至约15重量份的聚烯烃树脂; （D）约5至约20重量份的无机添加剂; 和（E）约3至约15重量份的聚苯醚。 热塑性弹性体组合物可以具有优异的物理性能，例如柔软性（或弹性），表面硬度和高温下的恢复力。

公开(公告)号：US20060237725A1

公开(公告)日：2006-10-26

申请号：US11364773

申请日：2006-02-28

申请人： Jae-Hun Jeong ,  Soon-Moon Jung ,  Hoon Lim ,  Won-Seok Cho ,  Jin-Ho Kim ,  Chang-Min Hong ,  Jong-Hyuk Kim ,  Kun-Ho Kwak

发明人： Jae-Hun Jeong ,  Soon-Moon Jung ,  Hoon Lim ,  Won-Seok Cho ,  Jin-Ho Kim ,  Chang-Min Hong ,  Jong-Hyuk Kim ,  Kun-Ho Kwak

IPC分类号： H01L29/76 ,  H01L29/00

CPC分类号： H01L27/0688 ,  H01L23/485 ,  H01L29/78 ,  H01L2924/0002 ,  H01L2924/00

摘要： Semiconductor devices having thin film transistors (TFTs) and methods of fabricating the same are provided. The semiconductor devices include a semiconductor substrate and a lower interlayer insulating layer disposed on the semiconductor substrate. A lower semiconductor body disposed on or in the lower interlayer insulating layer. A lower TFT includes a lower source region and a lower drain region, which are disposed in the lower semiconductor body, and a lower gate electrode, which covers and crosses at least portions of at least two surfaces of the lower semiconductor body disposed between the lower source and drain regions.

摘要翻译： 提供具有薄膜晶体管（TFT）的半导体器件及其制造方法。 半导体器件包括设置在半导体衬底上的半导体衬底和下层间绝缘层。 下部半导体本体设置在下部层间绝缘层上或下部层间绝缘层中。 下部TFT包括设置在下部半导体本体中的下部源极区域和下部漏极区域以及下部栅极电极，该下部栅极电极覆盖并交叉配置在下部半导体器件的下部半导体本体的至少两个表面的至少一部分 源极和漏极区域。

公开(公告)号：US08173723B2

公开(公告)日：2012-05-08

申请号：US12621580

申请日：2009-11-19

申请人： Sung-Jun Kim ,  Chang-Min Hong

发明人： Sung-Jun Kim ,  Chang-Min Hong

IPC分类号： G21F1/10

CPC分类号： H01B1/22 ,  C08K3/08 ,  C08K7/06 ,  C08K7/14 ,  C08K2003/0812 ,  C08K2003/085 ,  C08K2201/001 ,  H01L23/295 ,  H01L2924/0002 ,  H01L2924/3025 ,  H05K9/0083 ,  H01L2924/00 ,  C08L81/04

摘要： Disclosed is an electromagnetic wave EMI/RFI shielding resin composite material that includes a thermoplastic polymer resin, an electrically conductive filler having a polyhedral shape or being capable of forming a polyhedral shape, and a low-melting point metal, and a molded product made using the EMI/RFI shielding resin composite material.

摘要翻译： 公开了一种电磁波EMI / RFI屏蔽树脂复合材料，其包括热塑性聚合物树脂，具有多面体形状或能够形成多面体形状的导电填料和低熔点金属，以及使用 EMI / RFI屏蔽树脂复合材料。

公开(公告)号：US08029876B2

公开(公告)日：2011-10-04

申请号：US12491383

申请日：2009-06-25

申请人： Sun Ho Park ,  Chang Min Hong

发明人： Sun Ho Park ,  Chang Min Hong

IPC分类号： C08L101/12

CPC分类号： C08L101/12 ,  C08K3/04 ,  C08K3/10 ,  C08L81/00 ,  Y10T428/10 ,  Y10T428/24994 ,  Y10T428/249952 ,  Y10T428/26 ,  Y10T428/269 ,  C08L81/02

摘要： A thermal-conductive resin composition and a plastic article are provided. The thermal-conductive resin composition comprises about 30 to about 60% by weight of a thermoplastic resin and about 40 to about 70% by weight of a thermal-conductive filler comprising about 10% by weight or more of a thermal-conductive filler with a height-to-length ratio (length/height) of about 7,000 to about 40,000 and about 10% by weight or more of a thermal-conductive filler with a height-to-length ratio of about 10 to about 1,000.

摘要翻译： 提供导热性树脂组合物和塑料制品。 导热树脂组合物包含约30至约60重量％的热塑性树脂和约40至约70重量％的导热填料，其包含约10重量％或更多的导热填料，其具有 高度与长度之比（长/高）为约7,000至约40,000，约10重量％或更多的高 - 长比为约10至约1,000的导热填料。

公开(公告)号：US08022128B2

公开(公告)日：2011-09-20

申请号：US12633875

申请日：2009-12-09

申请人： Bum Seok Youn ,  Lee Kun Cho ,  Young Sik Ryu ,  Chang Min Hong ,  Young Sil Lee ,  Young Jun Lee

发明人： Bum Seok Youn ,  Lee Kun Cho ,  Young Sik Ryu ,  Chang Min Hong ,  Young Sil Lee ,  Young Jun Lee

IPC分类号： C08K3/04 ,  C08K3/08 ,  C08K3/10 ,  C08K3/20 ,  C08K3/34 ,  C08K5/21 ,  C08L53/00

CPC分类号： C08L53/025 ,  C08L23/02 ,  C08L53/02 ,  C08L71/12 ,  C08L2666/02 ,  C08L2666/14 ,  C08L2666/06 ,  C08L2666/22 ,  C08L2666/04 ,  C08L23/12 ,  C08L91/00

摘要： A thermoplastic elastomer composition comprises (A) about 25 to about 55 parts by weight of a block terpolymer including an aromatic vinyl compound and an alkene compound; (B) about 20 to about 50 parts by weight of a paraffin oil; (C) about 5 to about 15 parts by weight of a polyolefin resin; (D) about 5 to about 20 parts by weight of an inorganic additive; and (E) about 3 to about 15 parts by weight of a polyphenylene ether. The thermoplastic elastomer composition can have excellent physical properties, such as flexibility (or resilience), surface hardness, and restoring force at high temperatures.

摘要翻译： 热塑性弹性体组合物包含（A）约25至约55重量份的包含芳族乙烯基化合物和烯烃化合物的嵌段三元共聚物; （B）约20至约50重量份的石蜡油; （C）约5至约15重量份的聚烯烃树脂; （D）约5至约20重量份的无机添加剂; 和（E）约3至约15重量份的聚苯醚。 热塑性弹性体组合物可以具有优异的物理性能，例如柔软性（或弹性），表面硬度和高温下的恢复力。

公开(公告)号：US20110206933A1

公开(公告)日：2011-08-25

申请号：US13100443

申请日：2011-05-04

申请人： Sung-Jun KIM ,  Chang-Min HONG

发明人： Sung-Jun KIM ,  Chang-Min HONG

IPC分类号： C09K5/08 ,  C08K3/08

CPC分类号： C08K7/06 ,  C08K3/08 ,  Y10T428/298

摘要： An electrically insulating highly thermally conductive resin composition includes (A) 100 parts by weight of a polyamide-based resin, and (B) 10 to 80 parts by weight of a long metal fiber including a metal comprising copper, nickel, aluminum, iron, chromium, molybdenum, an alloys thereof, or a combination thereof. The electrically insulating highly thermally conductive resin composition can exhibit high hardness and high strength as well as excellent electrically insulating and thermal conductivity properties, and can be useful for various molded products requiring high thermal conductivity and excellent mechanical characteristics.

摘要翻译： 电绝缘性高导热性树脂组合物包含（A）100重量份的聚酰胺类树脂，（B）10〜80重量份的包含铜，镍，铝，铁， 铬，钼，它们的合金，或其组合。 电绝缘性高导热性树脂组合物可以表现出高的硬度和高强度以及优异的电绝缘和导热性能，并且可用于需要高导热性和优异的机械特性的各种模制产品。

公开(公告)号：US07927932B2

公开(公告)日：2011-04-19

申请号：US12923471

申请日：2010-09-23

申请人： Han-Byung Park ,  Soon-Moon Jung ,  Hoon Lim ,  Cha-Dong Yeo ,  Byoung-Keun Son ,  Jae-Joo Shim ,  Chang-Min Hong

发明人： Han-Byung Park ,  Soon-Moon Jung ,  Hoon Lim ,  Cha-Dong Yeo ,  Byoung-Keun Son ,  Jae-Joo Shim ,  Chang-Min Hong

IPC分类号： H01L21/84

CPC分类号： H01L21/8221 ,  H01L27/0688 ,  H01L27/1108 ,  H01L27/1207

摘要： A semiconductor device according to example embodiments may have a plurality of stacked transistors. The semiconductor device may have a lower insulating layer formed on a semiconductor substrate and an upper channel body pattern formed on the lower insulating layer. A source region and a drain region may be formed within the upper channel body pattern, and a non-metal transfer gate electrode may be disposed on the upper channel body pattern between the source and drain regions. The non-metal transfer gate electrode, the upper channel body pattern, and the lower insulating layer may be covered by an intermediate insulating layer. A metal word line may be disposed within the intermediate insulating layer to contact at least an upper surface of the non-metal transfer gate electrode. An insulating spacer may be disposed on a sidewall of the metal word line. A metal node plug may be disposed within the intermediate insulating layer and the lower insulating layer to contact the source region of the upper channel body pattern. Example embodiments also relate to a method of fabricating the above semiconductor device.

摘要翻译： 根据示例性实施例的半导体器件可以具有多个堆叠的晶体管。 半导体器件可以具有形成在半导体衬底上的下绝缘层和形成在下绝缘层上的上沟道体图案。 源极区域和漏极区域可以形成在上部通道主体图案内，并且非金属转移栅极电极可以设置在源极和漏极区域之间的上部通道主体图案上。 非金属转移栅电极，上通道体图案和下绝缘层可以被中间绝缘层覆盖。 金属字线可以设置在中间绝缘层内以接触非金属转移栅电极的至少上表面。 绝缘间隔物可以设置在金属字线的侧壁上。 金属节点插头可以设置在中间绝缘层和下绝缘层内以接触上通道主体图案的源区域。 示例性实施例还涉及制造上述半导体器件的方法。

公开(公告)号：US20110014754A1

公开(公告)日：2011-01-20

申请号：US12923471

申请日：2010-09-23

申请人： Han-Byung Park ,  Soon-Moon Jung ,  Hoon Lim ,  Cha-Dong Yeo ,  Byoung-Keun Son ,  Jae-Joo Shim ,  Chang-Min Hong

发明人： Han-Byung Park ,  Soon-Moon Jung ,  Hoon Lim ,  Cha-Dong Yeo ,  Byoung-Keun Son ,  Jae-Joo Shim ,  Chang-Min Hong

IPC分类号： H01L21/8234

CPC分类号： H01L21/8221 ,  H01L27/0688 ,  H01L27/1108 ,  H01L27/1207

摘要： A semiconductor device according to example embodiments may have a plurality of stacked transistors. The semiconductor device may have a lower insulating layer formed on a semiconductor substrate and an upper channel body pattern formed on the lower insulating layer. A source region and a drain region may be formed within the upper channel body pattern, and a non-metal transfer gate electrode may be disposed on the upper channel body pattern between the source and drain regions. The non-metal transfer gate electrode, the upper channel body pattern, and the lower insulating layer may be covered by an intermediate insulating layer. A metal word line may be disposed within the intermediate insulating layer to contact at least an upper surface of the non-metal transfer gate electrode. An insulating spacer may be disposed on a sidewall of the metal word line. A metal node plug may be disposed within the intermediate insulating layer and the lower insulating layer to contact the source region of the upper channel body pattern. Example embodiments also relate to a method of fabricating the above semiconductor device.

公开(公告)号：US20090275683A1

公开(公告)日：2009-11-05

申请号：US12431825

申请日：2009-04-29

申请人： Eun-Joo LEE ,  Chang-Min HONG

发明人： Eun-Joo LEE ,  Chang-Min HONG

IPC分类号： C08K5/5313

CPC分类号： C08L77/00 ,  C08K3/013 ,  C08K5/5313 ,  C08L77/06 ,  C08L81/02 ,  C08L81/00 ,  C08L2666/20

摘要： Disclosed is a flame retardant thermoplastic resin composition that includes about 100 parts by weight of a mixed resin (A) including about 10 to about 90 wt % of an aromatic polyamide resin (A-1) and about 10 to about 90 wt % of a polyphenylene sulfide resin (A-2), about 0.5 to about 30 parts by weight of a phosphinic acid metal salt flame retardant (B), and about 10 to about 100 parts by weight of a filler (C).

摘要翻译： 公开了一种阻燃热塑性树脂组合物，其包含约100重量份的包含约10至约90重量％的芳族聚酰胺树脂（A-1）的混合树脂（A）和约10至约90重量％的 聚苯硫醚树脂（A-2），约0.5至约30重量份的次膦酸金属盐阻燃剂（B）和约10至约100重量份的填料（C）。