公开(公告)号：US09331045B2

公开(公告)日：2016-05-03

申请号：US14399495

申请日：2012-05-07

Applicant: Wei Gu ,  Zhong Lu ,  Cheeman Yu ,  Chin-Tien Chiu ,  En-Yong Tai ,  Min Ni

Inventor： Wei Gu ,  Zhong Lu ,  Cheeman Yu ,  Chin-Tien Chiu ,  En-Yong Tai ,  Min Ni

IPC: H01L23/00 ,  H01L23/544 ,  H01L23/31 ,  H01L21/56 ,  H01L25/065

CPC classification number: H01L24/75 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/544 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/0657 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/753 ,  H01L2224/75301 ,  H01L2224/75702 ,  H01L2224/75753 ,  H01L2224/7598 ,  H01L2224/83132 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A laminating device (230) and method are disclosed for laminating semiconductor die (220) on substrates on a panel (200) of substrates. The laminating device (230) includes lamination units (234,236,238,240) that operate independently of each other so that a row or column of semiconductor die (220) may be independently laminated onto a row or column of substrates simultaneously.

Abstract translation: 公开了用于将基板上的半导体管芯（220）层压在基板（200）上的层压装置（230）和方法。 层压装置（230）包括层叠单元（234,236,238,240），其彼此独立地操作，使得半导体管芯（220）的行或列可以独立地层压到基板的行或列上。

公开(公告)号：US08653653B2

公开(公告)日：2014-02-18

申请号：US12648697

申请日：2009-12-29

Applicant: Cheeman Yu ,  Chih-Chin Liao ,  Hem Takiar

Inventor： Cheeman Yu ,  Chih-Chin Liao ,  Hem Takiar

IPC: H01L23/34

CPC classification number: H01L25/0657 ,  G11C5/02 ,  G11C5/04 ,  G11C5/143 ,  G11C8/12 ,  H01L21/485 ,  H01L23/5382 ,  H01L25/50 ,  H01L2225/06527 ,  H01L2225/06579 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor package is disclosed including a plurality semiconductor die mounted on stacked and bonded layers of substrate, for example polyimide tape used in tape automated bonding processes. The tape may have a plurality of repeating patterns of traces and contact pads formed thereon. The traces each include aligned interconnect pads on the respective top and bottom surfaces of the substrate for bonding the traces of one pattern to the traces of another pattern after the patterns have been singulated from the substrate, aligned and stacked. Semiconductor die such as flash memory and a controller die are mounted on the traces of the respective patterns on the substrate. In order for the controller die to uniquely address a specific flash memory die in the stack, a group of traces on each substrate supporting the memory die are used as address pins and punched in a unique layout relative to the layout of the traces other substrates. By providing each flash memory semiconductor die on a substrate with a unique layout of address traces, each memory die may be selectively addressed by the controller die.

Abstract translation: 公开了一种半导体封装，其包括安装在基板的堆叠和接合层上的多个半导体管芯，例如在带自动焊接工艺中使用的聚酰亚胺带。 带可以具有多个重复图案的迹线和形成在其上的接触垫。 每个迹线包括在衬底的相应顶部和底部表面上的对准的互连焊盘，用于在将图案从基板切割成对准和堆叠之后将一个图案的迹线粘合到另一图案的迹线。 诸如闪速存储器和控制器管芯的半导体管芯安装在衬底上各个图案的迹线上。 为了使控制器裸片独特地寻址堆叠中的特定闪存芯片，支持存储芯片的每个衬底上的一组迹线被用作地址引脚，并相对于其它衬底的迹线的布局以独特的布局冲压。 通过在基板上提供具有唯一的地址迹线布局的每个闪速存储器半导体管芯，每个存储管芯可以被控制器管芯选择性地寻址。

公开(公告)号：US20110316164A1

公开(公告)日：2011-12-29

申请号：US12825617

申请日：2010-06-29

Applicant: Chih-Chin Liao ,  Cheeman Yu

Inventor： Chih-Chin Liao ,  Cheeman Yu

IPC: H01L25/065 ,  H01L21/60 ,  H01L23/538

CPC classification number: H01L25/0657 ,  H01L23/3121 ,  H01L23/50 ,  H01L24/04 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/18 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/06155 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49176 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/01013 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor die and semiconductor package formed therefrom, and methods of fabricating the semiconductor die and package, are disclosed. The semiconductor die includes an edge formed with a plurality of corrugations defined by protrusions between recesses. Bond pads may be formed on the protrusions. The semiconductor die formed in this manner may be stacked in the semiconductor package in staggered pairs so that the die bond pads on the protrusions of a lower die are positioned in the recesses of the upper die.

Abstract translation: 公开了一种由其形成的半导体管芯和半导体封装以及半导体管芯和封装件的制造方法。 半导体管芯包括形成有由凹陷之间的突起限定的多个波纹的边缘。 接合焊盘可以形成在突起上。 以这种方式形成的半导体管芯可以以交错对堆叠在半导体封装中，使得下模具的突起上的管芯接合焊盘定位在上模的凹部中。

公开(公告)号：US20100055836A1

公开(公告)日：2010-03-04

申请号：US12614998

申请日：2009-11-09

Applicant: Cheeman Yu ,  Chih-Chin Liao ,  Hem Takiar

Inventor： Cheeman Yu ,  Chih-Chin Liao ,  Hem Takiar

IPC: H01L21/56

CPC classification number: H01L24/49 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49174 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1064 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10S438/977 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: An electronic component is disclosed including a plurality of stacked semiconductor packages. A first such embodiment includes an internal connector for electrically coupling the stacked semiconductor packages. A second such embodiment includes an external connector for electrically coupling the stacked semiconductor packages.

Abstract translation: 公开了一种包括多个堆叠的半导体封装的电子部件。 第一个这样的实施例包括用于电耦合堆叠的半导体封装的内部连接器。 第二个这样的实施例包括用于电耦合堆叠的半导体封装的外部连接器。

公开(公告)号：US20150115479A1

公开(公告)日：2015-04-30

申请号：US14399495

申请日：2012-05-07

Applicant: Wei Gu ,  Zhong Lu ,  Cheeman Yu ,  Chin-Tien Chiu ,  En-Yong Tai ,  Min Ni

Inventor： Wei Gu ,  Zhong Lu ,  Cheeman Yu ,  Chin-Tien Chiu ,  En-Yong Tai ,  Min Ni

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L24/75 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/544 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/0657 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/753 ,  H01L2224/75301 ,  H01L2224/75702 ,  H01L2224/75753 ,  H01L2224/7598 ,  H01L2224/83132 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A laminating device (230) and method are disclosed for laminating semiconductor die (220) on substrates on a panel (200) of substrates. The laminating device (230) includes lamination units (234,236,238,240) that operate independently of each other so that a row or column of semiconductor die (220) may be independently laminated onto a row or column of substrates simultaneously.

Abstract translation: 公开了用于将基板上的半导体管芯（220）层压在基板（200）上的层压装置（230）和方法。 层压装置（230）包括层叠单元（234,236,238,240），其彼此独立地操作，使得半导体管芯（220）的行或列可以独立地层压到基板的行或列上。

公开(公告)号：US20140346686A1

公开(公告)日：2014-11-27

申请号：US14342157

申请日：2011-09-02

Applicant: Fu Peng ,  Zhong Lu ,  Chin Tien Chiu ,  Cheeman Yu ,  Matthew Chen ,  Weiting Jiang

Inventor： Fu Peng ,  Zhong Lu ,  Chin Tien Chiu ,  Cheeman Yu ,  Matthew Chen ,  Weiting Jiang

IPC: H01L23/544 ,  H01L23/28 ,  H01L21/56

CPC classification number: H01L21/565 ,  H01L21/56 ,  H01L21/561 ,  H01L21/566 ,  H01L23/28 ,  H01L23/544 ,  H01L23/552 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/54406 ,  H01L2223/5442 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A memory device including graphical content and a method of making the memory device with graphical content are disclosed. The graphical content is formed on a release media. The release media and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the graphical content is transferred from the release media to the encapsulated memory device.

Abstract translation: 公开了一种包括图形内容的存储设备和使具有图形内容的存储设备的方法。 图形内容形成在释放介质上。 将释放介质和未封装的存储器件放置在模具中并封装。 在模塑料的包封和固化期间，图形内容从释放介质转移到封装的存储器件。

公开(公告)号：US20120081860A1

公开(公告)日：2012-04-05

申请号：US13129510

申请日：2010-10-04

Applicant: Itzhak Pomerantz ,  Shiv Kumar ,  Robert Miller ,  Chin-Tien Chiu ,  Peng Fu ,  Cheeman Yu ,  Hem Takiar ,  Chih Chiang Tung ,  Kaiyou Qian

Inventor： Itzhak Pomerantz ,  Shiv Kumar ,  Robert Miller ,  Chin-Tien Chiu ,  Peng Fu ,  Cheeman Yu ,  Hem Takiar ,  Chih Chiang Tung ,  Kaiyou Qian

IPC: H05K1/14 ,  B32B3/10 ,  B32B3/02 ,  H05K7/00 ,  B32B3/30

CPC classification number: H05K5/0252 ,  G06K19/07 ,  Y10T428/239 ,  Y10T428/24479 ,  Y10T428/2457 ,  Y10T428/24802

Abstract: A memory device is disclosed including at least one surface pre-treated to roughen the surface for better adhesion of ink on the surface. The surface of the memory device may be pre-treated by scoring lines in the surface with a laser or by forming discrete deformations with a particle blaster. The surface may also be roughened by providing a roughened pattern on a mold plate during an encapsulation process. In further examples, the surface may be chemically pre-treated to roughen the surface and/or increase the adhesion energy of the surface.

Abstract translation: 公开了一种记录装置，其包括至少一个预处理表面的表面，以便更好地粘附在表面上的墨。 存储器件的表面可以通过用激光在表面上刻划线或者通过用粒子喷射器形成离散的变形来预处理。 在封装过程中，通过在模板上提供粗糙图案也可以使表面粗糙化。 在另外的实施例中，表面可以被化学预处理以使表面粗糙化和/或增加表面的粘附能。

公开(公告)号：US08110439B2

公开(公告)日：2012-02-07

申请号：US12614998

申请日：2009-11-09

Applicant: Cheeman Yu ,  Chi-Chin Liao ,  Hem Takiar

Inventor： Cheeman Yu ,  Chi-Chin Liao ,  Hem Takiar

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/30

CPC classification number: H01L24/49 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49174 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1064 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10S438/977 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: An electronic component is disclosed including a plurality of stacked semiconductor packages. A first such embodiment includes an internal connector for electrically coupling the stacked semiconductor packages. A second such embodiment includes an external connector for electrically coupling the stacked semiconductor packages.

Abstract translation: 公开了一种包括多个堆叠的半导体封装的电子部件。 第一个这样的实施例包括用于电耦合堆叠的半导体封装的内部连接器。 第二个这样的实施例包括用于电耦合堆叠的半导体封装的外部连接器。

公开(公告)号：US20100052155A1

公开(公告)日：2010-03-04

申请号：US12614945

申请日：2009-11-09

Applicant: Che-Jung Chang ,  Chin-Tien Chiu ,  Cheeman Yu ,  Hem Takiar ,  Jack Chang Chien ,  Ning Liu

Inventor： Che-Jung Chang ,  Chin-Tien Chiu ,  Cheeman Yu ,  Hem Takiar ,  Jack Chang Chien ,  Ning Liu

IPC: H01L23/04

CPC classification number: G06K19/077 ,  B29C45/14311 ,  B29C45/14647 ,  B29C2045/14327 ,  G06K19/07724 ,  G06K19/07732 ,  H01L23/10 ,  H01L23/544 ,  H01L24/48 ,  H01L24/97 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.

Abstract translation: 公开了一种闪存卡及其制造方法。 卡包括制造成接收单面或双面盖的半导体封装。 半导体封装的表面可以形成有孔，沟槽和/或戳记。 在形成孔，沟和/或标记之后，可以在注射成型工艺中将盖子附接到包装表面。 在注射成型过程中，熔融的塑料流入与半导体封装的表面互连的孔，沟槽和/或戳痕。 因此，当熔融塑料硬化时，孔，沟槽和/或戳痕确保盖保持牢固地附接到半导体封装。

公开(公告)号：US20140183727A1

公开(公告)日：2014-07-03

申请号：US14118485

申请日：2011-05-18

Applicant: Zhong Lu ,  Fen Yu ,  Chin Tien Chiu ,  Cheeman Yu ,  Fuqiang Xiao

Inventor： Zhong Lu ,  Fen Yu ,  Chin Tien Chiu ,  Cheeman Yu ,  Fuqiang Xiao

IPC: H01L23/498 ,  H01L21/768

CPC classification number: H01L23/49866 ,  H01L21/768 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/03013 ,  H01L2224/03614 ,  H01L2224/04042 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06145 ,  H01L2224/06155 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48096 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48456 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48471 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78349 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2224/85948 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48095

Abstract: A wire bonded structure for a semiconductor device is disclosed. The wire bonded structure comprises a bonding pad; and a continuous length of wire mutually diffused with the bonding pad, the wire electrically coupling the bonding pad with a first electrical contact and a second electrical contact different from the first electrical contact.

Abstract translation: 公开了一种用于半导体器件的引线接合结构。 引线接合结构包括接合焊盘; 以及与所述接合焊盘相互扩散的连续长度的导线，所述线将所述接合焊盘与第一电接触和与所述第一电接触不同的第二电接触电耦合。