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公开(公告)号：US20140024465A1
公开(公告)日：2014-01-23
申请号：US13551693
申请日：2012-07-18
CPC分类号： H05K1/0203 , H05K7/20127 , Y10T29/49002
摘要： An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.
摘要翻译： 电子设备控制台包括容纳芯片封装的控制台主体和从控制台主体延伸的导管。 管道的内部容积与控制台主体的内部容积流体连通。 第一个排气口位于管道的远端。 第二个通风口位于控制台的墙壁上。 控制台可以在第一方向和第二方向上定向。 当控制台在第一方向上定向时，管道用作烟囱用于芯片封装的自然对流冷却。 当控制台朝向第二方位时，控制台主体用作烟囱用于芯片封装的自然对流冷却。
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公开(公告)号：US09226426B2
公开(公告)日：2015-12-29
申请号：US13551693
申请日：2012-07-18
CPC分类号： H05K1/0203 , H05K7/20127 , Y10T29/49002
摘要： An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.
摘要翻译： 电子设备控制台包括容纳芯片封装的控制台主体和从控制台主体延伸的导管。 管道的内部容积与控制台主体的内部容积流体连通。 第一个排气口位于管道的远端。 第二个通风口位于控制台的墙壁上。 控制台可以以第一方向和第二方向定向。 当控制台在第一方向上定向时，管道用作烟囱用于芯片封装的自然对流冷却。 当控制台朝向第二方位时，控制台主体用作烟囱用于芯片封装的自然对流冷却。
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公开(公告)号：US08444043B1
公开(公告)日：2013-05-21
申请号：US13362228
申请日：2012-01-31
申请人： William E. Bernier , Marcus E. Interrante , Rajneesh Kumar , Chenzhou Lian , Janak G. Patel , Peter Slota, Jr.
发明人： William E. Bernier , Marcus E. Interrante , Rajneesh Kumar , Chenzhou Lian , Janak G. Patel , Peter Slota, Jr.
CPC分类号： H01L23/49816 , B23K1/0016 , B23K1/008 , B23K1/203 , B23K3/0623 , B23K2101/42 , H01L23/13 , H01L24/13 , H01L24/16 , H01L24/75 , H01L24/81 , H01L25/0652 , H01L25/0657 , H01L2224/13111 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/75101 , H01L2224/75252 , H01L2224/755 , H01L2224/75501 , H01L2224/81005 , H01L2224/81191 , H01L2224/81192 , H01L2224/81204 , H01L2224/81815 , H01L2225/06513 , H01L2924/10253 , H01L2924/1305 , H01L2924/15787 , H01L2924/351 , H01L2924/3511 , H01L2924/01047 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： An array of solder balls is attached to solder pads of one of a first substrate and a second substrate. After aligning the array of solder balls relative to solder pads of the other of the first substrate and the second substrate, a thermal-mass-increasing fixture is placed on a surface of the second substrate to form an assembly of the first substrate, the second substrate, and the array of the solder balls therebetween, and the thermal-mass-increasing fixture. The thermal-mass-increasing fixture is in physical contact with at least a surface of a periphery of the second substrate. The thermal-mass-increasing fixture reduces the cool-down rate of peripheral solder balls after a reflow step, thereby increasing time for deformation of peripheral solder balls during the cool-down and reducing the mechanical stress on the solder balls after the cool-down.
摘要翻译： 一组焊球附着到第一衬底和第二衬底之一的焊盘上。 在相对于第一基板和第二基板中的另一个的焊盘对准焊球的阵列之后，将热质量增加的夹具放置在第二基板的表面上以形成第一基板的组件，第二基板 基板以及它们之间的焊球的阵列，以及热质量增加夹具。 热质量增加夹具与第二基板的周边的至少一个表面物理接触。 热质量增加夹具降低了回流步骤后外围焊球的冷却速率，从而增加了冷却期间外围焊球变形的时间，并降低了冷却后焊锡球上的机械应力 。
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