Abstract:
A flip-top washing device for vegetables and fruits has a housing assembly, a cover assembly pivotally connected to the housing assembly, a driving assembly mounted on the cover assembly, a washing basket mounted in the housing assembly, and an agitating panel assembly mounted on and connected with the washing basket. With multiple driving blocks of a driving member on the cover assembly and multiple connecting blocks on the agitating panel assembly and with an inclined surface and an vertical surface of each of the driving and connecting blocks, the driving member is able to be securely connected with the agitating panel assembly when closing the cover assembly onto the housing assembly. As the agitating panel assembly and the washing basket rotate, water inside the housing assembly is, strongly agitated so as to wash the vegetables and the fruits in the housing assembly.
Abstract:
A flip-top washing device for vegetables and fruits has a housing assembly, a cover assembly pivotally connected to the housing assembly, a driving assembly mounted on the cover assembly, a washing basket mounted in the housing assembly, and an agitating panel assembly mounted on and connected with the washing basket. With multiple driving blocks of a driving member on the cover assembly and multiple connecting blocks on the agitating panel assembly and with an inclined surface and an vertical surface of each of the driving and connecting blocks, the driving member is able to be securely connected with the agitating panel assembly when closing the cover assembly onto the housing assembly. As the agitating panel assembly and the washing basket rotate, water inside the housing assembly is, strongly agitated so as to wash the vegetables and the fruits in the housing assembly.
Abstract:
A fruit and vegetable washer includes a housing, an upper cover, a spin-and-turbulence unit, a power unit, a control assembly, a cleaning basket and a stabilizing shaft. A polygonal accommodating chamber is formed in the housing. The cleaning basket is cylindrical and is mounted rotatably in the accommodating chamber. Because of the polygonal cross section of the accommodating chamber of the housing and the circular cross section of the cleaning basket, the space between the accommodating chamber and the cleaning basket has a circular inner surface and a rectangular outer surface. When water fills up the space and the power unit starts to rotate the cleaning basket, the water will flow between the rectangular outer surface and the circular inner surface and keep pushing the inner surface of the accommodating chamber, producing complex turbulent flows and fully cleaning the fruits and vegetables inside the cleaning basket.
Abstract:
An adhesive transfer method includes depositing an adhesive on a first substrate, transferring a layer of the adhesive from the first substrate to an intermediate substrate, and transferring adhesive from the layer of the adhesive to at least one area of a second substrate.
Abstract:
Disclosed is a switch device including a housing, a plurality of components (including a conductive member, a conducting member, a switch member and an actuating member) accommodated in the housing, and a lid body disposed on the housing. Two vertical boards are disposed on a bottom portion of the housing, and a receiving space is formed in a middle part of the bottom portion. The conductive member has an electrode that is disposed on an upper side in the receiving space adjacent to the two vertical boards. A plurality of grooves are disposed on the bottom portion outside the two vertical boards. The switch member is disposed in the receiving space. A contact pad corresponding to the electrode is disposed between a bottom portion of the switch member and the actuating member at a top portion of the switch member, and is linearly aligned with the actuating member.
Abstract:
In one example, a method for making diagonal openings in photodefinable glass includes exposing part of a body of photodefinable glass to a beam of light oriented diagonally to a surface of the body at an angle of 5° or greater measured with respect to a normal to the surface of the body and removing some or all of the part of the body exposed to the light beam to form a diagonal opening in the body.
Abstract:
A drop detector assembly is provided including an ejection element to eject a fluid drop, a light guide to selectively receive light scattered off of the fluid drop, and a light detector formed in the light guide to detect light received by the light guide.
Abstract:
The present invention relates to a semiconductor package and a method for making the same. The method includes the steps of: (a) providing a base material; (b) forming a first metal layer on the base material, wherein the first metal layer comprises a first inductor and a first lower electrode; (c) forming a first dielectric layer and a first upper electrode on the first lower electrode, wherein the first dielectric layer is disposed between the first upper electrode and the first lower electrode, and the first upper electrode, the first dielectric layer and the first lower electrode form a first capacitor; and (d) forming a first protective layer, so as to encapsulate the first inductor and the first capacitor.
Abstract:
The present invention relates to a silicon chip including a silicon substrate, a passivation layer, at least one electrical device and at least one through via. The passivation layer is disposed on a first surface of the silicon substrate. The electrical device is disposed in the silicon substrate, and exposed to a second surface of the silicon substrate. The through via includes a barrier layer and a conductor, and penetrates the silicon substrate and the passivation layer. A first end of the through via is exposed to the surface of the passivation layer, and a second end of the through via connects the electrical device. When a redistribution layer is formed on the surface of the passivation layer, the redistribution layer will not contact the silicon substrate, thus avoiding a short circuit.
Abstract:
The present invention relates to a semiconductor structure having an integrated passive network and a method for making the same. The semiconductor structure includes a substrate which can be an interposer. The substrate can include a plurality of conductive vias. In various embodiments, the substrate includes a dielectric layer disposed thereon, the dielectric layer having an opening forming a straight hole allowing electrical connection between the passive network and the conductive via. The passive network includes a series of patterned dielectric and conductive layers, forming passive electronic components. In an embodiment, the passive device includes a common resistor coupled to a pair of inductors, each of the inductors coupled to a capacitor. In another embodiment, the passive device includes a resistor and an inductor electrically connected to each other, a bottom surface of the inductor coplanar with a bottom surface of the resistor.