公开(公告)号：US08717763B2

公开(公告)日：2014-05-06

申请号：US13439865

申请日：2012-04-05

Applicant: Tai-Wei Lin ,  Chin-Hui Chen

Inventor： Tai-Wei Lin ,  Chin-Hui Chen

IPC: H05K7/20 ,  F24F7/06

CPC classification number: H05K7/20563

Abstract: A cooling system includes a first group of fans, a second group of fans, and an air conducting cover. The air conducting cover includes a first partition, a second partition, a third partition. The first partition is connected between the second partition and the third partition to define a first space, a second space and a third space. Wherein the first group of fans directs air flow to enter the first space and the second space, the second group of fans directs air flow to enter the third space.

Abstract translation: 冷却系统包括第一组风扇，第二组风扇和导气罩。 导气盖包括第一隔板，第二隔板，第三隔板。 第一分区连接在第二分区和第三分区之间，以限定第一空间，第二空间和第三空间。 其中第一组风扇引导空气流进入第一空间和第二空间，第二组风扇引导空气流进入第三空间。

公开(公告)号：US20140049913A1

公开(公告)日：2014-02-20

申请号：US13596070

申请日：2012-08-28

Applicant: CHIN-HUI CHEN

Inventor： CHIN-HUI CHEN

IPC: G06F1/20 ,  H05K5/02 ,  H05K7/20

CPC classification number: H05K7/20836 ,  H05K7/20736

Abstract: A container data center includes a container having a raised floor defining a number of vents, a server system including a cabinet supported on the raised floor adjacent to the vents, a cooling device, an adjusting plate movably installed to the cabinet for covering or uncovering the vents, a driving member, a temperature sensor mounted to the cabinet, and a micro control unit (MCU) electrically connected to the driving member and the temperature sensor. The cooling device releases cooling air into the container under the raised floor. The temperature sensor senses the temperature in the cabinet. The MCU receives the sensed temperature and compares the sensed temperature with a preset temperature, to direct the driving member to drive the adjusting plate to move relative to the vents.

Abstract translation: 容器数据中心包括具有限定多个通风口的高架地板的容器，包括支撑在与出风口相邻的高架地板上的柜的服务器系统，冷却装置，可移动地安装到机柜的调节板，用于覆盖或露出 通风口，驱动构件，安装到机壳的温度传感器，以及电连接到驱动构件和温度传感器的微控制单元（MCU）。 冷却装置将冷却空气释放到高架地板下方的容器中。 温度传感器检测机柜内的温度。 MCU接收感测到的温度并将感测到的温度与预设温度进行比较，以引导驱动构件驱动调节板相对于通风口移动。

公开(公告)号：US08498115B2

公开(公告)日：2013-07-30

申请号：US13205622

申请日：2011-08-09

Applicant: Chin-Hui Chen

Inventor： Chin-Hui Chen

IPC: H05K7/20 ,  H05K7/00

CPC classification number: H05K7/20172 ,  G06F1/20

Abstract: An electronic device includes a case having a vent defining a plurality of holes. The electronic device further includes an adjusting plate movably mounted on the case and aligning with the vent, and the adjusting plate defines a plurality of holes. A plurality of vent regions are defined on the vent, at least one hollow region and at least one tangible region are defined on the adjusting plate. The adjusting plate is movable relative to the vent such that the plurality of the holes of the adjusting plate aligns with, or the adjusting plate partially blocks or totally blocks, the plurality of holes of the vent.

Abstract translation: 电子设备包括具有限定多个孔的通气口的壳体。 电子设备还包括可移动地安装在壳体上并与排气口对准的调节板，调节板限定多个孔。 多个通气区域限定在通气口上，至少一个中空区域和至少一个有形区域被限定在调节板上。 调节板相对于通气孔是可移动的，使得调节板的多个孔与排气孔的多个孔对准或调节板部分地阻挡或完全阻挡通气孔的多个孔。

公开(公告)号：US20130155614A1

公开(公告)日：2013-06-20

申请号：US13439865

申请日：2012-04-05

Applicant: TAI-WEI LIN ,  CHIN-HUI CHEN

Inventor： TAI-WEI LIN ,  CHIN-HUI CHEN

IPC: H05K7/20 ,  F24F7/06

CPC classification number: H05K7/20563

Abstract: A cooling system includes a first group of fans, a second group of fans, and an air conducting cover. The air conducting cover includes a first partition, a second partition, a third partition. The first partition is connected between the second partition and the third partition to define a first space, a second space and a third space. Wherein the first group of fans directs air flow to enter the first space and the second space, the second group of fans directs air flow to enter the third space.

Abstract translation: 冷却系统包括第一组风扇，第二组风扇和导气罩。 导气盖包括第一隔板，第二隔板，第三隔板。 第一分区连接在第二分区和第三分区之间，以限定第一空间，第二空间和第三空间。 其中第一组风扇引导空气流进入第一空间和第二空间，第二组风扇引导空气流进入第三空间。

公开(公告)号：US20120126673A1

公开(公告)日：2012-05-24

申请号：US13044554

申请日：2011-03-10

Applicant: CHIN-HUI CHEN ,  WEN-HUNG HUANG

Inventor： CHIN-HUI CHEN ,  WEN-HUNG HUANG

IPC: H05K5/02

CPC classification number: H05K7/20736

Abstract: A server rack includes a main body, a pair of rails, and a pair of air guiding members. The main body includes two opposite sidewalls, each of which include a first flange defining a number of first through holes and define an air hole. The rails define a channel communicating with the air holes in the main body. Each air guiding member covers the corresponding air hole and includes a second flange that contacts corresponding first flange and defines a number of second through holes. A portion of the second though holes in each second flange and the corresponding first through holes are inserted by fasteners and the other second through holes and the corresponding first through holes without the fasteners inserted are reserved for directing cooling air to the channel via the air guiding members and the air holes.

Abstract translation: 服务器机架包括主体，一对导轨和一对引导构件。 主体包括两个相对的侧壁，每个侧壁包括限定多个第一通孔并限定空气孔的第一凸缘。 导轨限定与主体中的气孔连通的通道。 每个空气引导构件覆盖对应的空气孔，并且包括接触相应的第一凸缘并限定多个第二通孔的第二凸缘。 每个第二凸缘中的第二通孔的一部分和相应的第一通孔被紧固件插入，并且另外的第二通孔和相应的第一通孔未被插入，预留用于通过空气导向将冷却空气引导到通道 会员和气孔。

公开(公告)号：US07825681B2

公开(公告)日：2010-11-02

申请号：US11819114

申请日：2007-06-25

Applicant: Chin-Hui Chen ,  Hou-Yuan Lin

Inventor： Chin-Hui Chen ,  Hou-Yuan Lin

IPC: H03K17/16 ,  H03K19/003

CPC classification number: G11C5/00 ,  G06F13/4086 ,  G11C5/04 ,  G11C5/063 ,  G11C7/1066 ,  H05K1/0246 ,  H05K1/14 ,  H05K2201/10022 ,  H05K2201/10159 ,  Y02D10/14 ,  Y02D10/151

Abstract: A common module for a double data rate-synchronous II synchronous dynamic random access memory (DDRII SDRAM) and a DDRIII SDRAM applied in a computer is provided. The common module includes a first bus, a termination circuit card, a first slot, and a second slot. The first bus transmits a plurality of signals. The termination circuit card comprises a plurality of termination resistors. The first slot is disposed on the common module and coupled to the first bus. The DDRII SDRAM is installed in the first slot. The second slot is disposed on the common module and coupled to the first bus. The DDRIII SDRAM or the termination circuit card is installed in the second slot. When the DDRII SDRAM is installed in the first slot, the termination circuit card is installed in the second slot.

Abstract translation: 提供了一种用于计算机中应用的双数据速率同步II同步动态随机存取存储器（DDRII SDRAM）和DDRIII SDRAM的通用模块。 公共模块包括第一总线，终端电路卡，第一时隙和第二时隙。 第一总线发送多个信号。 终端电路卡包括多个终端电阻器。 第一槽被布置在公共模块上并且耦合到第一总线。 DDRII SDRAM安装在第一个插槽中。 第二槽被布置在公共模块上并且耦合到第一总线。 DDRIII SDRAM或终端电路卡安装在第二个插槽中。 当DDRII SDRAM安装在第一个插槽中时，终端电路卡安装在第二个插槽中。

公开(公告)号：US07576295B2

公开(公告)日：2009-08-18

申请号：US11747724

申请日：2007-05-11

Applicant: Ming-Ji Chen ,  Jui-Kuan Lin ,  Chin-Hui Chen ,  Chao-Chuang Mai

Inventor： Ming-Ji Chen ,  Jui-Kuan Lin ,  Chin-Hui Chen ,  Chao-Chuang Mai

IPC: B23H7/20

CPC classification number: B23H7/20 ,  B23H7/02 ,  B23H7/265 ,  B23H7/30 ,  B23H9/14

Abstract: A method for detecting and compensating electrode wear of electric discharge machining (EDM) is disclosed, which comprises the steps of: defining a calibration node; calculating a wear length of a tool electrode by an edge-finding algorithm; using the calculated wear length of the tool electrode as a cut compensation for compensating a machining depth of next new tool electrode replacing the previously machined tool electrode; whereas the machining depth is obtained according to the following formula: the machining depth=designed depth of cut+predicted wear of the tool electrode for machining to desire depth−calculated wear length of the previously machined tool electrode+a through hole offset. With the aforesaid method, the wear of an used tool electrode can be detected automatically for compensating the machining depth of an unused tool electrode without ant additional equipment while achieving accurate machining.

Abstract translation: 公开了一种用于检测和补偿放电加工（EDM）的电极磨损的方法，其包括以下步骤：定义校准节点; 通过边缘求解算法计算工具电极的磨损长度; 使用计算的刀具电极的磨损长度作为切削补偿来补偿下一个新刀具电极的加工深度，以代替先前加工的刀具电极; 而加工深度根据以下公式获得：加工深度=设计的切削深度+用于加工的刀具电极的预期磨损，以期望先前加工的刀具电极的深度计算磨损长度+通孔偏移。 利用上述方法，可以自动检测使用过的工具电极的磨损，以便在实现精确加工的同时不用蚂蚁附加设备补偿未使用的工具电极的加工深度。

公开(公告)号：US20080316220A1

公开(公告)日：2008-12-25

申请号：US11819114

申请日：2007-06-25

Applicant: Chin-Hui Chen ,  Hou-Yuan Lin

Inventor： Chin-Hui Chen ,  Hou-Yuan Lin

IPC: G06F12/02

CPC classification number: G11C5/00 ,  G06F13/4086 ,  G11C5/04 ,  G11C5/063 ,  G11C7/1066 ,  H05K1/0246 ,  H05K1/14 ,  H05K2201/10022 ,  H05K2201/10159 ,  Y02D10/14 ,  Y02D10/151

Abstract: A common module for a double data rate-synchronous II synchronous dynamic random access memory (DDRII SDRAM) and a DDRIII SDRAM applied in a computer is provided. The common module includes a first bus, a termination circuit card, a first slot, and a second slot. The first bus transmits a plurality of signals. The termination circuit card comprises a plurality of termination resistors. The first slot is disposed on the common module and coupled to the first bus. The DDRII SDRAM is installed in the first slot. The second slot is disposed on the common module and coupled to the first bus. The DDRIII SDRAM or the termination circuit card is installed in the second slot. When the DDRII SDRAM is installed in the first slot, the termination circuit card is installed in the second slot.

Abstract translation: 提供了一种用于计算机中应用的双数据速率同步II同步动态随机存取存储器（DDRII SDRAM）和DDRIII SDRAM的通用模块。 公共模块包括第一总线，终端电路卡，第一时隙和第二时隙。 第一总线发送多个信号。 终端电路卡包括多个终端电阻器。 第一槽被布置在公共模块上并且耦合到第一总线。 DDRII SDRAM安装在第一个插槽中。 第二槽被布置在公共模块上并且耦合到第一总线。 DDRIII SDRAM或终端电路卡安装在第二个插槽中。 当DDRII SDRAM安装在第一个插槽中时，终端电路卡安装在第二个插槽中。

公开(公告)号：US07447021B2

公开(公告)日：2008-11-04

申请号：US11306592

申请日：2006-01-04

Applicant: Chin-Hui Chen

Inventor： Chin-Hui Chen

IPC: H05K7/20

CPC classification number: G06F1/20 ,  H05K7/20727

Abstract: An air conducting cover for a server includes a recess portion, a guiding portion, and a connecting portion. The guiding portion upwardly and outwardly extends from an end of the recess portion. The connecting portion horizontally extends from an end of the guiding portion and is attached to the server. The server includes a server motherboard bracket and a server motherboard installed on the server motherboard bracket. The air conducting cover is disposed on the server motherboard bracket and combined with the server motherboard bracket as an airflow channel. The airflow channel is a diverging duct and gradually narrowed from two ends to a middle. Thus, a blowing speed of a cooling air insufflated into the server is accelerated. The air conducting cover can improve heat dissipation efficiency of the server without additional room and will not produce more noise.

Abstract translation: 用于服务器的导气盖包括凹部，引导部和连接部。 引导部分从凹部的一端向上和向外延伸。 连接部分从引导部分的一端水平延伸并附接到服务器。 该服务器包括服务器主板支架和服务器主板安装在服务器主板支架上。 导气盖设置在服务器主板支架上，并与服务器主板支架结合作为气流通道。 气流通道为发散管，从两端逐渐变窄为中间。 因此，吹入吹入服务器的冷却空气的吹入速度加快。 导气罩可以提高服务器的散热效率，无需额外的空间，不会产生更多的噪音。

公开(公告)号：US20080127599A1

公开(公告)日：2008-06-05

申请号：US11607056

申请日：2006-12-01

Applicant: Chin-Hui Chen

Inventor： Chin-Hui Chen

IPC: E04C5/07

CPC classification number: E04C5/07

Abstract: A reinforced structural member is disclosed that includes a composite matrix formed of plastics reinforced with wood fibers (or glass fibers) and additives including calcium carbonate and ashes; and a reinforcing element (e.g., aluminum alloy or steel) as skeleton with the composite matrix formed therearound. The structural member has the advantages of being not susceptible to deform due to direct sunlight, and a great increase of structural strength. In one embodiment the reinforcing element has a hollow, axial tube. In another embodiment the structural member is shaped as either a rod or a plate.

Abstract translation: 公开了一种加强结构构件，其包括由用木纤维（或玻璃纤维）增强的塑料和包括碳酸钙和灰分的添加剂形成的复合基体; 以及作为骨架的增强元件（例如，铝合金或钢），其周围形成复合基体。 该结构件具有由于阳光直射而不易变形，结构强度大的优点。 在一个实施例中，加强元件具有中空轴向管。 在另一个实施例中，结构构件被成形为杆或板。