Method of fabricating gate electrode of CMOS device
    1.
    发明授权
    Method of fabricating gate electrode of CMOS device 失效
    制造CMOS器件栅电极的方法

    公开(公告)号:US5567642A

    公开(公告)日:1996-10-22

    申请号:US554337

    申请日:1995-11-06

    摘要: A method of fabricating a gate electrode of a CMOS device is disclosed including the steps of: sequentially forming a gate insulating layer, first conductive layer and protective layer on a semiconductor substrate; selectively etching a predetermined portion of the protective layer in which a PMOS transistor will be formed; forming a second conductive layer on the overall surface of said substrate; removing the second conductive layer formed on the protective layer, and partially etching the protective layer to a predetermined thickness; and patterning the second conductive layer, the protective layer, the first conductive layer and the gate insulating layer using a gate electrode pattern.

    摘要翻译: 公开了一种制造CMOS器件的栅电极的方法,包括以下步骤:在半导体衬底上依次形成栅极绝缘层,第一导电层和保护层; 选择性地蚀刻其中将形成PMOS晶体管的保护层的预定部分; 在所述衬底的整个表面上形成第二导电层; 去除形成在保护层上的第二导电层,并将保护层部分蚀刻到预定厚度; 以及使用栅极电极图案来图案化第二导电层,保护层,第一导电层和栅极绝缘层。