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    System and process for manufacturing application specific printable circuits (ASPC'S) and other custom electronic devices
    3.
    发明申请
    System and process for manufacturing application specific printable circuits (ASPC'S) and other custom electronic devices 审中-公开
    用于制造应用特定可打印电路（ASPC'S）和其他定制电子设备的系统和过程

    公开(公告)号：US20060190917A1

    公开(公告)日：2006-08-24

    申请号：US11331189

    申请日：2006-01-13

    Applicant: Chuck Edwards

    Inventor： Chuck Edwards

    IPC: G06F17/50

    CPC classification number: H01L21/485 ,  H01L21/6715 ,  H01L23/5382 ,  H01L24/95 ,  H01L2224/95101 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3011 ,  H05K1/0286 ,  H05K1/16 ,  H05K3/0005 ,  H05K3/125 ,  H05K3/32 ,  H05K3/4664 ,  H05K2201/10166 ,  H05K2201/10212 ,  H05K2203/013 ,  H05K2203/1469 ,  H01L2924/00

    Abstract: A system and process for manufacturing custom printed circuit boards on pre-provided substrates, wherein the substrate can be pre-provided with electronic devices. The electronic devices can be pre-provided on the substrate by direct printing, or in a more conventional manner, such as by standard integrated circuit technologies, in many different packing technologies. The user designs the custom printed circuit board using a design tool to perform one or more specific electronic functions, based on the pre-provided electronic devices, and/or custom designed and direct printed electronic devices. The electronic devices includes transistors, resistors, capacitors, among other types of devices. Examples of the electronic functions that can realized using the system and process described herein include, but are not limited to, include an RFID device, and a PROM.

    Abstract translation: 用于在预先提供的基板上制造定制印刷电路板的系统和工艺，其中所述基板可以预先设置有电子设备。 电子设备可以通过直接印刷或以更常规的方式例如通过标准集成电路技术在许多不同的包装技术中预先提供在基板上。 用户使用设计工具设计定制印刷电路板，以基于预先提供的电子设备和/或定制设计和直接印刷的电子设备来执行一个或多个特定的电子功能。 电子设备包括晶体管，电阻器，电容器以及其它类型的器件。 可以使用本文描述的系统和过程实现的电子功能的示例包括但不限于包括RFID设备和PROM。

    Optimized multi-layer printing of electronics and displays
    7.
    发明申请
    Optimized multi-layer printing of electronics and displays 失效
    电子和显示器的优化多层印刷

    公开(公告)号：US20060159899A1

    公开(公告)日：2006-07-20

    申请号：US11331187

    申请日：2006-01-13

    Applicant: Chuck Edwards ,  James Howarth ,  Karel Vanheusden

    Inventor： Chuck Edwards ,  James Howarth ,  Karel Vanheusden

    IPC: B32B3/00 ,  B32B18/00

    CPC classification number: H05K3/1275 ,  H05K1/095 ,  H05K1/16 ,  H05K3/12 ,  H05K3/1216 ,  H05K3/125 ,  H05K3/4664 ,  H05K2201/0326 ,  H05K2203/0113 ,  H05K2203/013 ,  H05K2203/0143 ,  H05K2203/0534 ,  H05K2203/1476 ,  Y10T428/24917 ,  Y10T428/24926

    Abstract: An apparatus and method for making a printed circuit board comprising a substrate and an electrical circuit is provided. The circuit is formed by deposition of a plurality of electronic inks onto the substrate and curing of each of the electronic inks. The deposition may be performed using an ink-jet printing process. The inkjet printing process may include the step of printing a plurality of layers, wherein a first layer includes at least one electronic ink deposited directly onto the substrate, and wherein each subsequent layer includes at least one electronic ink deposited on top of at least a portion of a previous layer when the previous layer has been cured. One or more of the layers may include at least two of the electronic inks.

    Abstract translation: 提供一种用于制造包括基板和电路的印刷电路板的装置和方法。 电路通过将多个电子墨水沉积到基板上并固化每个电子墨水而形成。 可以使用喷墨印刷方法进行沉积。 喷墨印刷方法可以包括打印多个层的步骤，其中第一层包括直接沉积到基材上的至少一个电子油墨，并且其中每个后续层包括沉积在至少一部分的顶部上的至少一个电子油墨 的上一层已经被治愈了。 一个或多个层可以包括至少两个电子墨水。

    Circuit modeling and selective deposition
    8.
    发明申请
    Circuit modeling and selective deposition 审中-公开
    电路建模和选择性沉积

    公开(公告)号：US20060158478A1

    公开(公告)日：2006-07-20

    申请号：US11331188

    申请日：2006-01-13

    Applicant: James Howarth ,  Chuck Edwards ,  Karel Vanheusden

    Inventor： James Howarth ,  Chuck Edwards ,  Karel Vanheusden

    IPC: B41J29/393

    CPC classification number: H05K3/125 ,  H05K1/16 ,  H05K3/0005 ,  H05K2203/013 ,  H05K2203/163

    Abstract: A process for fabricating an electrical component using an ink-jet printing process is provided. The process includes the steps of selecting at least one electronic ink having at least a first functionality when cured; determining a positional layout for a plurality of droplets of the electronic ink(s) such that, based at least on the first functionality, the positional layout provides a desired response for the electrical component; providing at least a first characteristic that relates to the electrical component; comparing the determined positional layout to at least one corresponding entry in a lookup table of empirical data relating to the first characteristic and to the determined positional layout; adjusting the determined positional layout accordingly; and printing each of the droplets of the electronic ink(s) onto a substrate according to the adjusted positional layout. The step of determining a positional layout may include determining a volume of ink to be deposited.

    Abstract translation: 提供了一种使用喷墨打印方法制造电气部件的工艺。 该方法包括在固化时选择至少一种具有至少第一功能性的电子墨水的步骤; 确定电子墨水的多个液滴的位置布局，使得至少基于第一功能性，位置布局为电气部件提供期望的响应; 提供至少与电气部件相关的第一特性; 将确定的位置布局与有关第一特征和确定的位置布局的经验数据的查找表中的至少一个对应条目进行比较; 相应调整确定的位置布局; 并且根据调整的位置布局将电子墨水的每个液滴印刷到基底上。 确定位置布局的步骤可以包括确定要沉积的墨水的体积。

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