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公开(公告)号:US20140335669A1
公开(公告)日:2014-11-13
申请号:US14306801
申请日:2014-06-17
IPC分类号: H01L27/24 , H01L45/00 , H01L21/8238
CPC分类号: H01L27/2463 , H01L21/8238 , H01L27/04 , H01L27/1021 , H01L27/2409 , H01L27/2436 , H01L45/06 , H01L45/1233 , H01L45/1253 , H01L45/14 , H01L45/141 , H01L45/144 , H01L45/16 , H01L45/1683
摘要: The present invention is a method of incorporating a non-volatile memory into a CMOS process that requires four or fewer masks and limited additional processing steps. The present invention is an epi-silicon or poly-silicon process sequence that is introduced into a standard CMOS process (i) after the MOS transistors' gate oxide is formed and the gate poly-silicon is deposited (thereby protecting the delicate surface areas of the MOS transistors) and (ii) before the salicided contacts to those MOS transistors are formed (thereby performing any newly introduced steps having an elevated temperature, such as any epi-silicon or poly-silicon deposition for the formation of diodes, prior to the formation of that salicide). A 4F2 memory array is achieved with a diode matrix wherein the diodes are formed in the vertical orientation.
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公开(公告)号:US08325556B2
公开(公告)日:2012-12-04
申请号:US12575055
申请日:2009-10-07
申请人: Daniel R. Shepard
发明人: Daniel R. Shepard
IPC分类号: G11C8/00
CPC分类号: G11C8/10
摘要: A memory-array decoder operably coupled to a memory array comprising a sequence of rows and receiving as input a plurality of address bits includes first and second decoder stages. The first decoder stage selects one or more first rows by decoding a first subset of the address bits, and the second decoder stage selects one or more second rows based on locations, within the sequence, of one or more third rows different from the one or more second rows.
摘要翻译: 可操作地耦合到存储器阵列的存储器阵列解码器,该存储器阵列包括一系列行并作为输入接收多个地址位,包括第一和第二解码器级。 第一解码器级通过解码地址位的第一子集来选择一个或多个第一行,并且第二解码器级基于序列内的与一个或多个第三行不同的一个或多个第三行中的位置来选择一个或多个第二行, 更多第二排。
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公开(公告)号:US20110019455A1
公开(公告)日:2011-01-27
申请号:US12898205
申请日:2010-10-05
申请人: Daniel R. Shepard
发明人: Daniel R. Shepard
IPC分类号: G11C5/02
CPC分类号: G11C5/02 , G06K5/04 , G11C5/025 , G11C7/00 , G11C16/04 , G11C29/006 , G11C29/02 , G11C29/025 , G11C2029/5006 , H01L21/84 , H01L22/32 , H01L27/10 , H01L27/105 , H01L27/1052 , H01L27/12 , H01L2924/0002 , H01L2924/00
摘要: A high density memory device is fabricated three dimensionally in layers. To keep points of failure low, address decoding circuits are included within each layer so that, in addition to power and data lines, only the address signal lines need be interconnected between the layers.
摘要翻译: 三维地制造高密度存储器件。 为了使故障点保持低电平,地址解码电路被包括在每个层内,使得除了功率和数据线之外,只有地址信号线需要在层之间互连。
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公开(公告)号:US20100232200A1
公开(公告)日:2010-09-16
申请号:US12720843
申请日:2010-03-10
申请人: Daniel R. Shepard
发明人: Daniel R. Shepard
IPC分类号: G11C5/02 , H01L21/336 , G11C5/06
CPC分类号: G11C8/10 , G11C13/0002 , G11C13/0004 , G11C13/0023 , G11C17/12 , G11C17/16 , G11C17/18 , G11C2213/71 , H01L27/1021 , H01L27/1027 , H01L27/105 , H01L27/112 , H01L27/11206 , H01L27/11517 , H01L27/2445 , H01L27/2454 , H01L27/2463 , H01L27/2481 , H01L29/7827 , H01L29/87 , H01L45/04 , H01L45/06 , H01L45/124 , H01L45/144
摘要: A memory device includes a substrate, and, disposed thereover, an array of vertical memory switches. In some embodiments, each switch has at least three terminals and a cross-sectional area less than 6F2.
摘要翻译: 存储器件包括衬底,并且在其上设置有垂直存储器开关阵列。 在一些实施例中,每个开关具有至少三个端子和小于6F2的横截面面积。
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公开(公告)号:US20090225579A1
公开(公告)日:2009-09-10
申请号:US12265456
申请日:2008-11-05
CPC分类号: G11C5/02 , G11C5/06 , G11C13/00 , G11C13/0004 , G11C17/06 , G11C17/16 , G11C2213/71 , G11C2213/72 , H01L27/105
摘要: A high-density memory device is fabricated three-dimensionally in layers. To keep points of failure low, address decoding circuits are included within each layer so that, in addition to power and data lines, only the address signal lines need be interconnected between the layers.
摘要翻译: 高密度存储器件是三维地制造的。 为了使故障点保持低电平,地址解码电路被包括在每个层内,使得除了功率和数据线之外,只有地址信号线需要在层之间互连。
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公开(公告)号:US5889694A
公开(公告)日:1999-03-30
申请号:US863156
申请日:1997-05-27
申请人: Daniel R. Shepard
发明人: Daniel R. Shepard
IPC分类号: G11C8/04 , G11C17/06 , H01L27/102 , H01L27/112
CPC分类号: G11C8/04 , G11C17/06 , G11C17/10 , H01L27/1021 , H01L27/112
摘要: A read-only data storage and retrieval device is presented having no moving parts and requiring very low power. Addressing can be accomplished sequentially where the address increments automatically or can be accomplished randomly. High density storage is achieved through the use of a highly symmetric diode matrix that is addressed in both coordinate directions; its symmetry makes the Dual-addressed Rectifier Storage (DRS) Array very scaleable, particularly when made as an integrated circuit. For even greater storage flexibility, multiple digital rectifier storage arrays can be incorporated into the device, one or more of which can be made removable and interchangeable.
摘要翻译: 提供了只读数据存储和检索装置,其没有移动部件并且需要非常低的功率。 可以顺序完成寻址,其中地址自动增加或可以随机完成。 通过使用在两个坐标方向上寻址的高度对称的二极管矩阵来实现高密度存储; 其对称性使得双寻址整流器存储(DRS)阵列非常可扩展,特别是当作为集成电路时。 为了获得更大的存储灵活性,可将多个数字整流器存储阵列并入设备中,其中一个或多个可以被制造为可移除和可互换的。
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公开(公告)号:US20150171864A1
公开(公告)日:2015-06-18
申请号:US14628925
申请日:2015-02-23
申请人: Daniel R. Shepard
发明人: Daniel R. Shepard
IPC分类号: H03K19/00 , H03K19/0948 , H03K19/082 , G11C5/06
CPC分类号: H03K19/0013 , G11C5/06 , G11C11/06007 , G11C11/22 , G11C11/4097 , G11C11/412 , H01L29/66234 , H03K19/001 , H03K19/082 , H03K19/094 , H03K19/0948
摘要: The present invention relates to electronic memory circuits, and more particularly, to low power electronic memory circuits having low manufacturing costs. The present invention is a circuit design that utilizes two transistor types—bipolar and MOS (but, not both NMOS and PMOS) one of which can be manufactured together with the memory cell's non-linear conductive elements (such as a diode) thereby reducing the number of processing steps and masks and resulting in lower cost.
摘要翻译: 电子存储器电路技术领域本发明涉及电子存储器电路,更具体地涉及低成本的低功率电子存储器电路。 本发明是利用双极和MOS(但不是NMOS和PMOS两者)的两种晶体管类型的电路设计,其中一个可以与存储单元的非线性导电元件(例如二极管)一起制造,从而减少 加工步骤和掩模的数量,并导致较低的成本。
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公开(公告)号:US08351238B2
公开(公告)日:2013-01-08
申请号:US12417245
申请日:2009-04-02
申请人: Daniel R. Shepard
发明人: Daniel R. Shepard
IPC分类号: G11C11/00
CPC分类号: G11C11/412
摘要: An electronic circuit such as a latch or a sequencer includes a plurality of transistors, all of the transistors being either NMOS transistors or PMOS transistors, and dissipates less than or approximately the same amount of power as an equivalent CMOS circuit.
摘要翻译: 诸如锁存器或定序器的电子电路包括多个晶体管,所有晶体管都是NMOS晶体管或PMOS晶体管,并且耗散小于或大致相等量的功率作为等效CMOS电路。
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公开(公告)号:US08116109B2
公开(公告)日:2012-02-14
申请号:US13065755
申请日:2011-03-29
CPC分类号: G11C5/02 , G11C5/06 , G11C13/00 , G11C13/0004 , G11C17/06 , G11C17/16 , G11C2213/71 , G11C2213/72 , H01L27/105
摘要: A high-density memory device is fabricated three-dimensionally in layers. To keep points of failure low, address decoding circuits are included within each layer so that, in addition to power and data lines, only the address signal lines need be interconnected between the layers.
摘要翻译: 高密度存储器件是三维地制造的。 为了使故障点保持低电平,地址解码电路被包括在每个层内,使得除了功率和数据线之外,只有地址信号线需要在层之间互连。
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公开(公告)号:US07933133B2
公开(公告)日:2011-04-26
申请号:US12265456
申请日:2008-11-05
CPC分类号: G11C5/02 , G11C5/06 , G11C13/00 , G11C13/0004 , G11C17/06 , G11C17/16 , G11C2213/71 , G11C2213/72 , H01L27/105
摘要: A high-density memory device is fabricated three-dimensionally in layers. To keep points of failure low, address decoding circuits are included within each layer so that, in addition to power and data lines, only the address signal lines need be interconnected between the layers.
摘要翻译: 高密度存储器件是三维地制造的。 为了使故障点保持低电平,地址解码电路被包括在每个层内,使得除了功率和数据线之外,只有地址信号线需要在层之间互连。
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