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公开(公告)号：US07735952B2
公开(公告)日：2010-06-15
申请号：US11734283
申请日：2007-04-12
CPC分类号： B41J2/16 , B41J2/1623
摘要： A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is covalently bound to a substantially planar support material, and a method of making the same.
摘要翻译： 基本上平面的微流体喷射装置，其中微流体喷射头共价结合到基本平坦的支撑材料上，以及制造该微流体喷射装置的方法。
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公开(公告)号：US07479203B2
公开(公告)日：2009-01-20
申请号：US11208815
申请日：2005-08-22
CPC分类号： B41J2/162 , B32B37/0023 , B41J2/1628 , B41J2/1629 , B41J2/1631 , Y10T156/10
摘要： A method of making a micro-fluid ejection head structure and structures made by the method. The method includes planarizing a heated substrate component of a micro-fluid ejection head structure by applying a clamping voltage to an electrostatic chuck sufficient to hold the substrate component in a planarized orientation. A polymeric nozzle layer is laminated to the heated substrate component in a manner sufficient to provide a planarized nozzle layer on the substrate component.
摘要翻译： 一种通过该方法制造微流体喷射头结构和结构的方法。 该方法包括通过向足以将基板部件保持平坦化取向的静电卡盘施加钳位电压来平坦化加热的微流体喷射头结构的衬底部件。 聚合物喷嘴层以足以在基底部件上提供平坦化喷嘴层的方式层压到加热的基底部件上。
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3.发明授权公开(公告)号：US08491095B2
公开(公告)日：2013-07-23
申请号：US13041793
申请日：2011-03-07
IPC分类号： B41J2/16
CPC分类号： B41J2/1404 , B41J2002/14403 , Y10T29/49401
摘要： Disclosed is a fluid ejection device that includes a nozzle plate. The nozzle plate includes a plurality of nozzles for fluid ejection. Further, the fluid ejection device includes a substrate disposed below the nozzle plate. The substrate includes a top surface adapted to adhere to the nozzle plate. The substrate also includes at least one fluid via configured within the substrate for providing fluid to the plurality of nozzles of the nozzle plate. Furthermore, the fluid ejection device includes at least one supporting structure configured within each fluid via of the at least one fluid via. The at least one supporting structure is further configured at a predetermined depth from the top surface of the substrate to regulate the flow of the fluid from the at least one fluid via to the plurality of nozzles. Further, disclosed is a method to fabricate the fluid ejection device.
摘要翻译： 公开了一种包括喷嘴板的流体喷射装置。 喷嘴板包括用于流体喷射的多个喷嘴。 此外，流体喷射装置包括设置在喷嘴板下方的基板。 衬底包括适于粘附到喷嘴板的顶表面。 衬底还包括至少一个流体通路，该流体通孔被配置在衬底内，用于向喷嘴板的多个喷嘴提供流体。 此外，流体喷射装置包括至少一个配置在至少一个流体通路的每个流体通路内的支撑结构。 所述至少一个支撑结构进一步构造在距离所述基板的顶表面的预定深度处以调节所述流体从所述至少一个流体通道到所述多个喷嘴的流动。 此外，公开了制造流体喷射装置的方法。
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公开(公告)号：US07767103B2
公开(公告)日：2010-08-03
申请号：US10940917
申请日：2004-09-14
申请人： David L. Bernard , John W. Krawczyk , Christopher J. Money , Andrew L. McNees , Girish S. Patil , Karthik Vaideeswaran , Richard L. Warner
发明人： David L. Bernard , John W. Krawczyk , Christopher J. Money , Andrew L. McNees , Girish S. Patil , Karthik Vaideeswaran , Richard L. Warner
CPC分类号： B41J2/1603 , B41J2/14129 , B41J2/1628 , B41J2/1631 , B41J2/1642 , B41J2/1645 , B41J2/1646
摘要： A micro-fluid ejection assembly and method therefor. The micro-fluid ejection assembly includes a silicon substrate having a fluid supply slot therein. The fluid supply slot is formed by an etch process conducted on a substrate using, a first etch mask circumscribing the fluid supply slot, and a second etch mask applied over a functional layer on the substrate.
摘要翻译： 微流体喷射组件及其方法。 微流体喷射组件包括其中具有流体供应槽的硅衬底。 流体供应槽由在衬底上进行的蚀刻工艺形成，使用限定流体供应槽的第一蚀刻掩模和施加在衬底上的功能层上的第二蚀刻掩模。
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公开(公告)号：US10582835B2
公开(公告)日：2020-03-10
申请号：US15445318
申请日：2017-02-28
摘要： A scope system is provided including an elongate tube with a distal portion and a lumen extending therethrough. The scope system also includes at least one accessory channel including a tubular structure with an accessory lumen extending therethrough, the at least one accessory channel movably disposed at least partially within the lumen of the elongate tube. The at least one accessory channel includes a distal section and a forward-viewing configuration and a side-viewing configuration. In the forward-viewing configuration, the distal section of the at least one accessory channel is substantially parallel to the distal portion of the elongate tube and in the side-viewing configuration, the distal section of the at least one accessory channel is arced at a radius greater than a radius of the distal portion of the elongate tube.
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公开(公告)号：US20100206840A1
公开(公告)日：2010-08-19
申请号：US12770939
申请日：2010-04-30
申请人： David L Bernard , Paul W. Dryer , Andrew L. McNees
发明人： David L Bernard , Paul W. Dryer , Andrew L. McNees
CPC分类号： B41J2/16 , B41J2/1623
摘要： A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is covalently bound to a substantially planar support material, and a method of making the same.
摘要翻译： 基本上平面的微流体喷射装置，其中微流体喷射头共价结合到基本上平面的支撑材料上，以及制造该微流体喷射装置的方法。
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公开(公告)号：US07560223B2
公开(公告)日：2009-07-14
申请号：US11026353
申请日：2004-12-30
IPC分类号： B41J2/16
CPC分类号： B41J2/1603 , B41J2/1628 , B41J2/1631 , G01D15/00
摘要： Methods of forming a fluid channel in a semiconductor substrate may include providing a semiconductor substrate having a backside and a device side, wherein the device side is configured to secure ink ejecting devices thereon and applying a material layer to the backside of the semiconductor substrate. The method may further include providing a gray scale mask configured with a pattern corresponding to a fluid channel having a plurality of slots, exposing the material layer to sufficient light radiation energy through the gray scale mask and etching the exposed material layer and the semiconductor substrate through to the device side of the semiconductor substrate.
摘要翻译： 在半导体衬底中形成流体通道的方法可以包括提供具有背面和器件侧的半导体衬底，其中器件侧被配置为在其上固定墨水喷射装置，并将材料层施加到半导体衬底的背面。 该方法还可以包括提供一个配置有与具有多个槽的流体通道相对应的图案的灰度掩模，该材料层通过灰度级掩模暴露于足够的光辐射能量，并通过暴露的材料层和半导体衬底 到半导体衬底的器件侧。
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公开(公告)号：US4405725A
公开(公告)日：1983-09-20
申请号：US817308
申请日：1977-07-20
CPC分类号： C08G18/79 , C08G18/092 , C08G18/1825 , C08G18/6492 , C08G18/7664 , C08G2101/0025
摘要： Foams having improved flammability characteristics are prepared by reacting a polyaryl polyalkylene polyisocyanate with 2 to 15 parts of an active hydrogen compound having a molecular weight of from about 350 to about 10,000 and from one to six active hydrogen containing groups as determined by the Zerewitinoff method in the presence of a blowing agent, a stabilizer and a catalyst.
摘要翻译： 具有改进的可燃性特征的泡沫通过聚芳基聚亚烷基多异氰酸酯与2至15份分子量为约350至约10,000的活性氢化合物和1至6个含有活性氢的基团反应制备，通过Zerewitinoff方法测定 发泡剂，稳定剂和催化剂的存在。
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9.发明申请公开(公告)号：US20120229569A1
公开(公告)日：2012-09-13
申请号：US13041793
申请日：2011-03-07
CPC分类号： B41J2/1404 , B41J2002/14403 , Y10T29/49401
摘要： Disclosed is a fluid ejection device that includes a nozzle plate. The nozzle plate includes a plurality of nozzles for fluid ejection. Further, the fluid ejection device includes a substrate disposed below the nozzle plate. The substrate includes a top surface adapted to adhere to the nozzle plate. The substrate also includes at least one fluid via configured within the substrate for providing fluid to the plurality of nozzles of the nozzle plate. Furthermore, the fluid ejection device includes at least one supporting structure configured within each fluid via of the at least one fluid via. The at least one supporting structure is further configured at a predetermined depth from the top surface of the substrate to regulate the flow of the fluid from the at least one fluid via to the plurality of nozzles. Further, disclosed is a method to fabricate the fluid ejection device.
摘要翻译： 公开了一种包括喷嘴板的流体喷射装置。 喷嘴板包括用于流体喷射的多个喷嘴。 此外，流体喷射装置包括设置在喷嘴板下方的基板。 衬底包括适于粘附到喷嘴板的顶表面。 衬底还包括至少一个流体通路，该流体通孔被配置在衬底内，用于向喷嘴板的多个喷嘴提供流体。 此外，流体喷射装置包括至少一个配置在至少一个流体通路的每个流体通路内的支撑结构。 所述至少一个支撑结构进一步构造在距离所述基板的顶表面的预定深度处以调节所述流体从所述至少一个流体通道到所述多个喷嘴的流动。 此外，公开了制造流体喷射装置的方法。
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公开(公告)号：US07850284B2
公开(公告)日：2010-12-14
申请号：US11779085
申请日：2007-07-17
IPC分类号： B41J2/05
CPC分类号： B41J2/1603 , B41J2/1628 , B81B2201/052 , B81C1/00087
摘要： A method of micro-machining a semiconductor substrate to form one or more through slots therein. The semiconductor substrate has a device side and a fluid side opposite the device side. The method includes diffusing a p-type doping material into the device side of the semiconductor substrate in one or more through slot locations to be etched through a thickness of the substrates. The semiconductor substrate is then etched with a dry etch process from the device side of the substrate to the fluid side of the substrate so that one or more through slots having a reentrant profile are formed in the substrate.
摘要翻译： 一种微加工半导体衬底以在其中形成一个或多个通孔的方法。 半导体衬底具有与器件侧相对的器件侧和流体侧。 该方法包括将p型掺杂材料扩散到半导体衬底的一个或多个通孔位置的器件侧，以通过衬底的厚度进行蚀刻。 然后用干蚀刻工艺将半导体衬底从衬底的器件侧蚀刻到衬底的流体侧，使得在衬底中形成具有折入轮廓的一个或多个通槽。
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