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公开(公告)号：US20120120138A1
公开(公告)日：2012-05-17
申请号：US13384358
申请日：2010-03-12
IPC分类号： B41J29/38
CPC分类号： B41J2/04525 , B41J2/04573 , B41J2/04581 , B41J2/04588 , B41J2/04591
摘要： Crosstalk in a piezo printhead is reduced by selecting an actuation signal for a nozzle, determining a time delay and a pulse width extension based on adjacent actuation signals of adjacent nozzles, and applying the time delay and pulse width extension to the actuation signal.
摘要翻译： 通过选择喷嘴的致动信号，基于相邻喷嘴的相邻致动信号来确定时间延迟和脉冲宽度延伸，以及将时间延迟和脉冲宽度延伸到致动信号来减小压电打印头中的串扰。
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公开(公告)号：US07922302B2
公开(公告)日：2011-04-12
申请号：US11831905
申请日：2007-07-31
IPC分类号： B41J2/045
CPC分类号： B41J2/14233 , B41J2002/14266
摘要： Embodiments of the present disclosure are disclosed.
摘要翻译： 公开了本公开的实施例。
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公开(公告)号：US10305529B2
公开(公告)日：2019-05-28
申请号：US15021511
申请日：2013-12-26
申请人： David Pidwerbecki , Mark Gallina , Mark Hemmeyer , Steven Lofland , Ponniah Ilavarasan , Michael Stewart , Kevin Byrd
发明人： David Pidwerbecki , Mark Gallina , Mark Hemmeyer , Steven Lofland , Ponniah Ilavarasan , Michael Stewart , Kevin Byrd
IPC分类号： H04B1/3888 , H05K3/28 , H05K1/02 , H05K1/03 , G06F1/16 , G06F1/18 , G06F1/20 , H04M1/02 , H04M1/18
摘要： Systems and methods may provide for a device including a housing, one or more electronic components positioned within the housing, and a first cured resin composition positioned within the housing, the first cured resin composition including a thermal energy storage material and a first filler material. The device may also include a second cured resin composition positioned within the housing, the second cured resin composition including the thermal energy storage material and a second filler material. The first filler material and the second filler material may be different, wherein the first cured resin composition and the second cured resin composition may encompass at least one of the one or more electronic components. In other examples, the electronic components include a power supply and the device complies with an ATEX equipment directive for explosive atmospheres. Moreover, component underfill and/or assembly overmold processes may be used to fabricate the device.
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公开(公告)号：US20180091987A1
公开(公告)日：2018-03-29
申请号：US15280986
申请日：2016-09-29
申请人： Ralph V. Miele , Eduardo Escamilla , James Utz , James M. Yoder , Tongyan Zhai , Baomin Liu , Meenakshi Gupta , Brian R. Peil , Venkat R. Gaurav , Drew G. Damm , Andrew Larson , Ricky O. Branner , Steven J. Lofland , George H. Daskalakis , James C. Raupp , Michael Ahrens , David Pidwerbecki , Bo Qiu , Stacy L. Yee
发明人： Ralph V. Miele , Eduardo Escamilla , James Utz , James M. Yoder , Tongyan Zhai , Baomin Liu , Meenakshi Gupta , Brian R. Peil , Venkat R. Gaurav , Drew G. Damm , Andrew Larson , Ricky O. Branner , Steven J. Lofland , George H. Daskalakis , James C. Raupp , Michael Ahrens , David Pidwerbecki , Bo Qiu , Stacy L. Yee
CPC分类号： H04W4/50 , G06F1/1613
摘要： Disclosed is a mobile device. The mobile device may be located proximate a mobile terminal and controlled by the mobile terminal. The mobile device may include a processor and a memory. The memory may store instructions that, when executed by the processor, cause the processor to: determine a mode of operation of the mobile device, determine a thermal profile for the mode of operation of the mobile device, and implement a power profile to achieve the thermal profile.
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5.发明申请USING MATERIALS TO INCREASE STRUCTURAL RIGIDITY, DECREASE SIZE, IMPROVE SAFETY, ENHANCE THERMAL PERFORMANCE AND SPEED CHARGING IN SMALL FORM FACTOR DEVICES 审中-公开使用材料增加结构刚度，减小尺寸，提高安全性，提高小型表面因素设备中的热性能和速度充电公开(公告)号：US20160269067A1
公开(公告)日：2016-09-15
申请号：US15021511
申请日：2013-12-26
申请人： David PIDWERBECKI , Mark GALLINA , Mark HEMMEYER , Steven LOFLAND , Ponniah ILAVARASAN , Michael STEWART , Kevin BYRD
发明人： David Pidwerbecki , Mark Gallina , Mark Hemmeyer , Steven Lofland , Ponniah Ilavarasan , Michael Stewart , Kevin Byrd
CPC分类号： H04B1/3888 , G06F1/1626 , G06F1/1658 , G06F1/18 , G06F1/182 , G06F1/203 , H04M1/0202 , H04M1/026 , H04M1/0262 , H04M1/0277 , H04M1/185 , H05K1/0256 , H05K1/0373 , H05K3/284 , H05K2203/1327
摘要： Systems and methods may provide for a device including a housing, one or more electronic components positioned within the housing, and a first cured resin composition positioned within the housing, the first cured resin composition including a thermal energy storage material and a first filler material. The device may also include a second cured resin composition positioned within the housing, the second cured resin composition including the thermal energy storage material and a second filler material. The first filler material and the second filler material may be different, wherein the first cured resin composition and the second cured resin composition may encompass at least one of the one or more electronic components. In other examples, the electronic components include a power supply and the device complies with an ATEX equipment directive for explosive atmospheres. Moreover, component underfill and/or assembly overmold processes may be used to fabricate the device.
摘要翻译： 系统和方法可以提供包括壳体，定位在壳体内的一个或多个电子部件和定位在壳体内的第一固化树脂组合物的装置，第一固化树脂组合物包括热能储存材料和第一填充材料。 该装置还可以包括定位在壳体内的第二固化树脂组合物，第二固化树脂组合物包括热能储存材料和第二填料。 第一填充材料和第二填充材料可以不同，其中第一固化树脂组合物和第二固化树脂组合物可以包含一种或多种电子部件中的至少一种。 在其他示例中，电子元件包括电源，该设备符合爆炸性环境的ATEX设备指令。 此外，可以使用组件底部填充和/或组装过模制过程来制造该装置。
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公开(公告)号：US20150375472A1
公开(公告)日：2015-12-31
申请号：US14318343
申请日：2014-06-27
申请人： MARK SPRENGER , PAUL GWIN , DAVID PIDWERBECKI , ALEKSANDER MAGI
发明人： MARK SPRENGER , PAUL GWIN , DAVID PIDWERBECKI , ALEKSANDER MAGI
CPC分类号： H05K5/02 , B32B3/30 , B32B7/10 , B32B7/12 , B32B2307/51 , B32B2307/744 , B32B2457/00
摘要： Techniques for forming a surface to attach a biomimetic material are described herein. The techniques include a method including forming a surface of a computing device, wherein the surface of the computing device comprises a feature to receive a biomimetic material. A biomimetic material is attached to the surface of the computing device via the feature of the surface.
摘要翻译： 本文描述了用于形成附着仿生材料的表面的技术。 这些技术包括形成计算设备的表面的方法，其中计算设备的表面包括接收仿生材料的特征。 仿生材料通过表面的特征附着到计算装置的表面。
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公开(公告)号：US20130293628A1
公开(公告)日：2013-11-07
申请号：US13978564
申请日：2011-01-31
CPC分类号： B41J2/14 , B41J2/161 , B41J2/1623 , B41J2/1626 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1642 , B41J2/1645 , B41J2/1646
摘要： A printhead is disclosed herein. The printhead includes a die substrate having a surface. A trench is defined in the die substrate surface, and a support is positioned in the trench. A compliant membrane is attached to the die substrate surface, and a gap is defined between a distal end of the support and the compliant membrane.
摘要翻译： 本文公开了打印头。 打印头包括具有表面的模具基板。 在模具衬底表面中限定沟槽，并且支撑件定位在沟槽中。 柔性膜附接到模具基板表面，并且在支撑件的远端和柔顺膜之间限定间隙。
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公开(公告)号：US06402296B1
公开(公告)日：2002-06-11
申请号：US09183549
申请日：1998-10-29
申请人： Todd A. Cleland , Rio Rivas , David Pidwerbecki
发明人： Todd A. Cleland , Rio Rivas , David Pidwerbecki
IPC分类号： B41J2145
CPC分类号： B41J2/1404 , B41J2/1433 , B41J2/15 , B41J2002/14387 , B41J2002/14475
摘要： A high resolution printer includes a printhead having optimized features including 12 to 14 micron diameter orifices spaced apart from adjacent orifices by a distance of between 76 to 94 microns. The orifice plate is electroformed and plated to a thickness ranging from 20 to 25 microns. A polymeric barrier layer secures the orifice plate to a printhead substrate.
摘要翻译： 高分辨率打印机包括具有优化特征的打印头，其特征包括从相邻孔间隔开76至94微米距离的12至14微米直径的孔。 孔板电铸并镀覆到20至25微米的厚度。 聚合物阻挡层将孔板固定到打印头基底。
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公开(公告)号：US20180004252A1
公开(公告)日：2018-01-04
申请号：US15201097
申请日：2016-07-01
申请人： Michael Ahrens , George H. Daskalakis , Steven J. Lofland , David Pidwerbecki , Bo Qiu , James C. Raupp , Stacy L. Yee
发明人： Michael Ahrens , George H. Daskalakis , Steven J. Lofland , David Pidwerbecki , Bo Qiu , James C. Raupp , Stacy L. Yee
CPC分类号： G06F1/1652 , E05D3/022 , E05Y2900/606 , G06F1/1616 , G06F1/1641 , G06F1/1681 , H04M1/0214 , H04M1/0247 , H04M1/0268 , H04M2250/16 , H05K5/0226
摘要： Systems, methods and apparatuses may provide for a flexible display assembly including a flexible display and a backplane coupled to the flexible display, wherein at least a portion of the backplane comprises a super elastic sheet. In one example, the backplane includes a first rigid sheet metal portion and a second rigid sheet metal portion, wherein the super-elastic sheet is joined between the first and second rigid sheet metal portions.
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公开(公告)号：US09199455B2
公开(公告)日：2015-12-01
申请号：US13978564
申请日：2011-01-31
CPC分类号： B41J2/14 , B41J2/161 , B41J2/1623 , B41J2/1626 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1642 , B41J2/1645 , B41J2/1646
摘要： A printhead is disclosed herein. The printhead includes a die substrate having a surface. A trench is defined in the die substrate surface, and a support is positioned in the trench. A compliant membrane is attached to the die substrate surface, and a gap is defined between a distal end of the support and the compliant membrane.
摘要翻译： 本文公开了打印头。 打印头包括具有表面的模具基板。 在模具衬底表面中限定沟槽，并且支撑件定位在沟槽中。 柔性膜附接到模具基板表面，并且在支撑件的远端和柔顺膜之间限定间隙。
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