公开(公告)号：US20130065376A1

公开(公告)日：2013-03-14

申请号：US13616882

申请日：2012-09-14

申请人： David Vaclav Horak ,  Shom Ponoth ,  Hosadurga Shobha ,  Chih-Chao Yang

发明人： David Vaclav Horak ,  Shom Ponoth ,  Hosadurga Shobha ,  Chih-Chao Yang

IPC分类号： H01L21/02

CPC分类号： H01L28/88 ,  H01L21/3105 ,  H01L21/31111 ,  H01L21/3212

摘要： A semiconductor capacitor and its method of fabrication are disclosed. A non-linear nitride layer is used to increase the surface area of a capacitor plate, resulting in increased capacitance without increase in chip area used for the capacitor.

摘要翻译： 公开了一种半导体电容器及其制造方法。 使用非线性氮化物层来增加电容器板的表面积，导致增加的电容，而不增加用于电容器的芯片面积。

公开(公告)号：US07791145B2

公开(公告)日：2010-09-07

申请号：US11764571

申请日：2007-06-18

申请人： Toshiharu Furukawa ,  Robert J. Gauthier, Jr. ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

发明人： Toshiharu Furukawa ,  Robert J. Gauthier, Jr. ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

IPC分类号： H01L27/092

CPC分类号： H01L21/76237 ,  H01L21/26533 ,  H01L21/76213 ,  H01L21/76229 ,  H01L21/76232 ,  H01L21/823878 ,  H01L27/0921 ,  H01L29/1087 ,  H01L29/78

摘要： Semiconductor structures and methods for suppressing latch-up in bulk CMOS devices. The semiconductor structure comprises a shaped-modified isolation region that is formed in a trench generally between two doped wells of the substrate in which the bulk CMOS devices are fabricated. The shaped-modified isolation region may comprise a widened dielectric-filled portion of the trench, which may optionally include a nearby damage region, or a narrowed dielectric-filled portion of the trench that partitions a damage region between the two doped wells. Latch-up may also be suppressed by providing a lattice-mismatched layer between the trench base and the dielectric filler in the trench.

摘要翻译： 用于抑制大量CMOS器件中的闩锁的半导体结构和方法。 该半导体结构包括成形修饰的隔离区，其形成在通常在制造本体CMOS器件的衬底的两个掺杂阱之间的沟槽中。 成形改进的隔离区域可以包括沟槽的加宽的电介质填充部分，其可以可选地包括分隔两个掺杂阱之间的损伤区域的沟槽的附近损伤区域或狭窄的电介质填充部分。 也可以通过在沟槽中的沟槽基底和介电填料之间提供晶格不匹配的层来抑制闩锁。

公开(公告)号：US07737504B2

公开(公告)日：2010-06-15

申请号：US11759981

申请日：2007-06-08

申请人： Toshiharu Furukawa ,  Mark Charles Hakey ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

发明人： Toshiharu Furukawa ,  Mark Charles Hakey ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

IPC分类号： H01L29/772

CPC分类号： H01L21/823892 ,  H01L21/76229 ,  H01L21/823878 ,  H01L27/11

摘要： A well isolation trenches for a CMOS device and the method for forming the same. The CMOS device includes (a) a semiconductor substrate, (b) a P well and an N well in the semiconductor substrate, (c) a well isolation region sandwiched between and in direct physical contact with the P well and the N well. The P well comprises a first shallow trench isolation (STI) region, and the N well comprises a second STI region. A bottom surface of the well isolation region is at a lower level than bottom surfaces of the first and second STI regions. When going from top to bottom of the well isolation region, an area of a horizontal cross section of the well isolation region is an essentially continuous function.

摘要翻译： CMOS器件的良好隔离沟槽及其形成方法。 CMOS器件包括（a）半导体衬底，（b）半导体衬底中的P阱和N阱，（c）夹在P阱和N阱之间并与P阱和N阱直接物理接触的阱隔离区域。 P阱包括第一浅沟槽隔离（STI）区域，并且N阱包括第二STI区域。 阱隔离区域的底表面处于比第一和第二STI区域的底表面更低的水平面。 当从隔离区域的顶部到底部进行时，阱隔离区域的水平横截面的区域是基本上连续的函数。

公开(公告)号：US07668004B2

公开(公告)日：2010-02-23

申请号：US12019746

申请日：2008-01-25

申请人： Toshiharu Furukawa ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger, III

发明人： Toshiharu Furukawa ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger, III

IPC分类号： G11C11/50

CPC分类号： G11C13/025 ,  B82Y10/00 ,  G11C2213/16 ,  G11C2213/77 ,  Y10S977/742 ,  Y10S977/939 ,  Y10S977/943

摘要： Non-volatile and radiation-hard switching and memory devices using vertical nano-tubes and reversibly held in state by van der Waals' forces and methods of fabricating the devices. Means for sensing the state of the devices include measuring capacitance, and tunneling and field emission currents.

摘要翻译： 使用垂直纳米管的非易失性和辐射硬的开关和存储器件，并通过范德华力力可逆地保持状态和制造器件的方法。 用于感测装置状态的装置包括测量电容，以及隧穿和场发射电流。

公开(公告)号：US07655985B2

公开(公告)日：2010-02-02

申请号：US12125381

申请日：2008-05-22

申请人： Toshiharu Furukawa ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

发明人： Toshiharu Furukawa ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

IPC分类号： H01L21/8238

CPC分类号： H01L27/0921 ,  H01L21/823878 ,  H01L29/78

摘要： Semiconductor structures and methods for suppressing latch-up in bulk CMOS devices. The semiconductor structure comprises first and second adjacent doped wells formed in the semiconductor material of a substrate. A trench, which includes a base and first sidewalls between the base and the top surface, is defined in the substrate between the first and second doped wells. The trench is partially filled with a conductor material that is electrically coupled with the first and second doped wells. Highly-doped conductive regions may be provided in the semiconductor material bordering the trench at a location adjacent to the conductive material in the trench.

公开(公告)号：US07651902B2

公开(公告)日：2010-01-26

申请号：US11737989

申请日：2007-04-20

申请人： Ethan Harrison Cannon ,  Toshiharu Furukawa ,  John Gerard Gaudiello ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

发明人： Ethan Harrison Cannon ,  Toshiharu Furukawa ,  John Gerard Gaudiello ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

IPC分类号： H01L21/338 ,  H01L23/62

CPC分类号： H01L21/76243 ,  H01L21/76251 ,  H01L21/823807 ,  H01L21/823878 ,  H01L21/84 ,  H01L27/1203 ,  H01L27/1207

摘要： Hybrid substrates characterized by semiconductor islands of different crystal orientations and methods of forming such hybrid substrates. The methods involve using a SIMOX process to form an insulating layer. The insulating layer may divide the islands of at least one of the different crystal orientations into mutually aligned device and body regions. The body regions may be electrically floating relative to the device regions.

摘要翻译： 以不同晶体取向的半导体岛为特征的混合基板和形成这种混合基板的方法。 该方法涉及使用SIMOX工艺来形成绝缘层。 绝缘层可以将不同晶体取向中的至少一个的岛分成相互排列的器件和体区。 身体区域可以相对于装置区域电浮动。

公开(公告)号：US20090035708A1

公开(公告)日：2009-02-05

申请号：US11831099

申请日：2007-07-31

申请人： Toshiharu Furukawa ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger, III

发明人： Toshiharu Furukawa ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger, III

IPC分类号： G03F7/20

CPC分类号： G03F7/2024 ,  G03F7/38 ,  G03F7/40 ,  G03F7/70425

摘要： A structure and a method for forming the same. The method includes providing a structure which includes (a) a to-be-patterned layer, (b) a photoresist layer on top of the to-be-patterned layer wherein the photoresist layer includes a first opening, and (c) a cap region on side walls of the first opening. A first top surface of the to-be-patterned layer is exposed to a surrounding ambient through the first opening. The method further includes performing a first lithography process resulting in a second opening in the photoresist layer. The second opening is different from the first opening. A second top surface of the to-be-patterned layer is exposed to a surrounding ambient through the second opening.

摘要翻译： 一种结构及其形成方法。 该方法包括提供一种结构，其包括（a）待图案化层，（b）在待图案化层的顶部上的光致抗蚀剂层，其中光致抗蚀剂层包括第一开口，和（c）帽 区域在第一开口的侧壁上。 待图案化层的第一顶表面通过第一开口暴露于周围环境。 该方法还包括执行在光致抗蚀剂层中产生第二开口的第一光刻工艺。 第二个开口与第一个开口不同。 待图案化层的第二顶表面通过第二开口暴露于周围环境。

公开(公告)号：US07435653B2

公开(公告)日：2008-10-14

申请号：US11735075

申请日：2007-04-13

申请人： Toshiharu Furukawa ,  Mark Charles Hakey ,  David Vaclav Horak ,  Charles William Koburger, III ,  Peter H. Mitchell

发明人： Toshiharu Furukawa ,  Mark Charles Hakey ,  David Vaclav Horak ,  Charles William Koburger, III ,  Peter H. Mitchell

IPC分类号： H01L21/336

CPC分类号： H01L29/66772 ,  H01L29/42384 ,  H01L29/42392 ,  H01L29/78645 ,  H01L29/78648

摘要： A field effect transistor is formed having wrap-around, vertically-aligned, dual gate electrodes. Starting with a silicon-on-insulator (SOI) structure having a buried silicon island, a vertical reference edge is defined, by creating a cavity within the SOI structure, and used during two etch-back steps that can be reliably performed. The first etch-back removes a portion of an oxide layer for a first distance over which a gate conductor material is then applied. The second etch-back removes a portion of the gate conductor material for a second distance. The difference between the first and second distances defines the gate length of the eventual device. After stripping away the oxide layers, a vertical gate electrode is revealed that surrounds the buried silicon island on all four side surfaces.

摘要翻译： 形成具有环绕，垂直排列的双栅电极的场效应晶体管。 从具有掩埋硅岛的绝缘体上硅（SOI）结构开始，通过在SOI结构内产生空腔并在可以可靠地执行的两个回蚀步骤期间使用垂直参考边缘。 第一次回蚀将氧化物层的一部分去除第一距离，然后施加栅极导体材料。 第二次回蚀将栅极导体材料的一部分移除第二距离。 第一和第二距离之间的差异定义了最终设备的栅极长度。 剥离氧化物层后，显示出在所有四个侧表面上包围掩埋硅岛的垂直栅电极。

公开(公告)号：US20080206996A1

公开(公告)日：2008-08-28

申请号：US11680204

申请日：2007-02-28

申请人： Toshiharu Furukawa ,  John G. Gaudiello ,  Mark Charles Hakey ,  David Vaclav Horak ,  Charles William Koburger

发明人： Toshiharu Furukawa ,  John G. Gaudiello ,  Mark Charles Hakey ,  David Vaclav Horak ,  Charles William Koburger

IPC分类号： H01L21/302

CPC分类号： H01L21/32139 ,  H01L21/0337 ,  H01L21/0338 ,  H01L21/28123

摘要： A method for simultaneously forming multiple line-widths, one of which is less than that achievable employing conventional lithographic techniques. The method includes providing a structure which includes a memory layer and a sidewall image transfer (SIT) layer on top of the memory layer. Then, the SIT layer is patterned resulting in a SIT region. Then, the SIT region is used as a blocking mask during directional etching of the memory layer resulting in a first memory region. Then, a side wall of the SIT region is retreated a retreating distance D in a reference direction resulting in a SIT portion. Said patterning comprises a lithographic process. The retreating distance D is less than a critical dimension CD associated with the lithographic process. The SIT region includes a first dimension W2 and a second dimension W3 in the reference direction, wherein CD

摘要翻译： 同时形成多个线宽的方法，其中之一小于使用常规光刻技术可实现的线宽。 该方法包括提供在存储层顶部包括存储层和侧壁图像传输（SIT）层的结构。 然后，对SIT层进行图案化，形成SIT区域。 然后，在存储层的定向蚀刻期间，将SIT区域用作阻挡掩模，产生第一存储区域。 然后，SIT区域的侧壁在参考方向上退回退避距离D，导致SIT部分。 所述图案化包括光刻工艺。 退回距离D小于与光刻工艺相关联的关键尺寸CD。 SIT区域包括参考方向上的第一维W 2和第二维W 3，其中CD

公开(公告)号：US07282423B2

公开(公告)日：2007-10-16

申请号：US11005659

申请日：2004-12-07

申请人： Toshiharu Furukawa ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Edward Joseph Nowak

发明人： Toshiharu Furukawa ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Edward Joseph Nowak

IPC分类号： H01L21/76

CPC分类号： H01L29/6659 ,  H01L21/26586 ,  H01L21/2807 ,  H01L21/28114 ,  H01L21/28123 ,  H01L29/1045 ,  H01L29/42376 ,  H01L29/4966 ,  H01L29/4991 ,  H01L29/7833

摘要： An FET has a T-shaped gate. The FET has a halo diffusion self-aligned to the bottom portion of the T and an extension diffusion self aligned to the top portion. The halo is thereby separated from the extension implant, and this provides significant advantages. The top and bottom portions of the T-shaped gate can be formed of layers of two different materials, such as germanium and silicon. The two layers are patterned together. Then exposed edges of the bottom layer are selectively chemically reacted and the reaction products are etched away to provide the notch. In another embodiment, the gate is formed of a single gate conductor. A metal is conformally deposited along sidewalls, recess etched to expose a top portion of the sidewalls, and heated to form silicide along bottom portions. The silicide is etched to provide the notch.

摘要翻译： FET具有T形门。 FET具有与T的底部自对准的晕圈扩散，并且与顶部自对准的延伸扩散。 因此，光环与延伸植入物分离，这提供了显着的优点。 T形门的顶部和底部可以由两种不同材料的层形成，例如锗和硅。 两层被图案化在一起。 然后，底层的暴露边缘被选择性地化学反应，并且蚀刻掉反应产物以提供凹口。 在另一个实施例中，栅极由单个栅极导体形成。 金属沿着侧壁共形沉积，凹陷蚀刻以暴露侧壁的顶部，并且被加热以沿底部形成硅化物。 蚀刻硅化物以提供凹口。