公开(公告)号：US20130087199A1

公开(公告)日：2013-04-11

申请号：US13703639

申请日：2011-06-15

申请人： John A. Naumovitz ,  Debra H. Neimann ,  Rajen M. Patel ,  Shaofu Wu

发明人： John A. Naumovitz ,  Debra H. Neimann ,  Rajen M. Patel ,  Shaofu Wu

IPC分类号： H01L31/0203 ,  H05K1/03

CPC分类号： H01L31/0203 ,  B32B17/10018 ,  B32B17/1055 ,  B32B17/10678 ,  B32B17/10697 ,  H01L23/293 ,  H01L31/0481 ,  H01L2924/0002 ,  H05K1/032 ,  Y02E10/50 ,  H01L2924/00

摘要： An electronic device module is disclosed comprising: A. at least one electronic device, and B. a polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) An ethylenic polymer comprising at least 0.1 amyl branches per 1000 carbon atoms as determined by Nuclear Magnetic Resonance and both a highest peak melting temperature, Tm, in ° C., and a heat of fusion, Hf, in J/g, as determined by DSC Crystallinity, where the numerical values of Tm and Hf correspond to the relationship: Tm≧(0.2143*Hf)+79.643, and wherein the ethylenic polymer has less than about 1 mole percent ctane comonomer, and less than about 0.5 mole percent ctane, pentene, or ctane comonomer. (2) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt % based on the weight of the copolymer, (3) optionally, a co-agent in an amount of at least about 0.05 wt % based upon the weight of the copolymer, and (4) optionally, a vinyl silane compound.

摘要翻译： 公开了一种电子设备模块，包括：A.至少一个电子设备，以及B.与所述电子设备的至少一个表面紧密接触的聚合物材料，所述聚合物材料包含（1）包含至少0.1个戊基 通过核磁共振确定的每1000个碳原子的分支，并且通过DSC结晶度测定的最高峰值熔融温度Tm，℃和熔融热Hf（J / g），其中数值 Tm和Hf对应于Tm≥（0.2143×Hf）+79.643的关系，并且其中乙烯类聚合物具有小于约1摩尔％的正丁烯共聚单体，和小于约0.5摩尔％的正丁烯，戊烯或者正庚烷共聚单体。 （2）任选地，基于共聚物重量的至少约0.05重量％的自由基引发剂或光引发剂，（3）任选地，基于以下物质的至少约0.05重量％的量的助剂： 共聚物的重量，和（4）任选的乙烯基硅烷化合物。

公开(公告)号：US20130233383A1

公开(公告)日：2013-09-12

申请号：US13701534

申请日：2011-06-06

申请人： John A. Naumovitz ,  Rajen M. Patel ,  Shaofu Wu ,  Debra H. Neimann

发明人： John A. Naumovitz ,  Rajen M. Patel ,  Shaofu Wu ,  Debra H. Neimann

IPC分类号： H01L31/0203 ,  H01L23/29

CPC分类号： H01L31/0203 ,  B32B17/10018 ,  B32B17/1055 ,  C08F210/16 ,  C08F255/02 ,  C08L23/08 ,  H01L23/293 ,  H01L31/0481 ,  H01L2924/0002 ,  Y02E10/50 ,  C08L2666/24 ,  C08F210/14 ,  C08F2500/02 ,  C08F2500/09 ,  C08F2500/11 ,  C08F2500/26 ,  H01L2924/00 ,  C08F230/08

摘要： An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) an ethylene interpolymer comprising an overall polymer density of not more than 0.905 g/cm3; total unsaturation of not more than 125 per 100,000 carbons; up to 3 long chain branches/1000 carbons; vinyl-3 content of less than 5 per 100,000 carbons; and a total number of vinyl groups/1000 carbons of less than the quantity (8000/Mn), wherein the vinyl-3 content and vinyl group measurements are measured by gel permeation chromatography (145° C.) and 1H-NMR (125° C.), (2) grafted vinyl silane, (3) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt % based on the weight of the copolymer, and (3) optionally, a co-agent in an amount of at least about 0.05 wt % based upon the weight of the copolymer.

摘要翻译： 一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合物材料，所述聚合物材料包含（1）乙烯互聚物，其包含 总聚合物密度不大于0.905g / cm3; 总不饱和度不超过125 / 100,000个碳; 最多3条长支链/ 1000个碳; 乙烯基-3含量小于5 / 100,000碳; 和总数（1000 / Mn）的乙烯基/ 1000个碳的总数，其中通过凝胶渗透色谱（145℃）和1 H-NMR（125°）测量乙烯基-3含量和乙烯基测量值 C.），（2）接枝的乙烯基硅烷，（3）任选的自由基引发剂或光引发剂，其量为基于共聚物重量的至少约0.05重量％，和（3）任选的助剂 其量为基于共聚物重量的至少约0.05重量％。