Abstract:
A method for manufacturing a micro-electro-mechanical system (MEMS) device is provided. The method comprises: providing a semiconductor substrate, the semiconductor substrate having a metal interconnection structure (100) formed therein; forming a first sacrificial layer (201) on the surface of the semiconductor substrate, the material of the first sacrificial layer is amorphous carbon; etching the first sacrificial layer to form a first recess (301); covering and forming a first dielectric layer (401) on the surface of the first sacrificial layer; thinning the first dielectric layer by a chemical mechanical polishing (CMP) process, until exposing the first sacrificial layer; forming a micromechanical structure layer (500) on the surface of the first sacrificial layer and exposing the first sacrificial layer, wherein a part of the micromechanical structure layer is connected to the first dielectric layer. The method avoids polishing the amorphous carbon, shortens the period of production, and improves the production efficiency.
Abstract:
An optical projection engine device uses a symmetrical wire grid polarizing beam splitter (PBS) that splits incident illumination to a symmetrical pair of polarized light beams in two orthogonal polarization states, one by reflection and the other by transmission, for illuminating a pair of reflective modulation imagers respectively. In identical geometric configuration, the two synchronized reflective modulation imagers polarization modulate polarized light beams as received, and reflect them back towards the PBS, which through transmission and reflection respectively, combines and projects two modulated light beams through a projection lens system to form a pair of spatially overlapped illumination images of aligned pixels with the same image in two orthogonal polarization states on a projection screen. The device jointly provides improvement optical efficiency and expanded function to three dimensional stereoscopic displays.
Abstract:
A spatial optical modulation array device includes regularly packed micro optical-electrical-mechanical pixels in a planner configuration on a semiconductor substrate, each pixel electrically actuated independently and thus operated optically in the binary modes, reflection and diffraction to incident illumination. Subject to the electrostatic contraction or compulsion driven by a pixel circuitry, the top metal reflector is placed accurately at the minimum or maximum spacing from the static bottom metal reflector in an odd or even integral multiple of a quarter wavelength within visual light spectrum, so that diffraction or reflection in destructive or constructive interference is achieved respectively and thus incident illumination modulated independently in closely binary modes at each micro optical-electrical-mechanical pixel.
Abstract:
A spatial optical modulation array device includes regularly packed micro optical-electrical-mechanical pixels in a planner configuration on a semiconductor substrate, each pixel electrically actuated independently and thus operated optically in the binary modes, reflection and diffraction to incident illumination. Subject to the electrostatic contraction or compulsion driven by a pixel circuitry, the top metal reflector is placed accurately at the minimum or maximum spacing from the static bottom metal reflector in an odd or even integral multiple of a quarter wavelength within visual light spectrum, so that diffraction or reflection in destructive or constructive interference is achieved respectively and thus incident illumination modulated independently in closely binary modes at each micro optical-electrical-mechanical pixel.
Abstract:
A light modulator pixel unit and the manufacturing method thereof are provided. The pixel unit includes a top electrode formed on a substrate, a movable electrode and a bottom electrode. Under the control of a control circuit, the position of the movable electrode would deflect. When the movable electrode is positioned in a first position, a first light is diffracted on the top electrode; when the movable electrode is positioned in a second position, a second light is diffracted on the top electrode; when the movable electrode is positioned in a third position, a third light is diffracted on the top electrode. The said first light, second light and third light are lights of three primary colors. The light modulator pixel unit of the present invention can modulate lights of three colors and is applicable in the field of micro-display system.
Abstract:
A light modulator pixel unit and a method for manufacturing the same are provided. The light modulator pixel unit includes top, movable and bottom electrodes. Under control of a control circuit, the movable electrode may shift to first, second and third positions corresponding to modulations of first, second and third monochromatic lights, respectively. When the movable electrode is at a certain position, the incident light corresponding to the position may be divided into two parts, one is reflected by the top electrode, and the other one may bypass the top electrode and be reflected by the movable electrode. The two parts may interfere destructively. The light modulator pixel unit of the present invention can control monochromatic lights of three special wavelengths by time division, and enable color control and gray control. The unit is applicable in the field of projection display and panel system.
Abstract:
A charge pump includes a first voltage input node, a second voltage input node, a voltage output node, at least a flying capacitor, an energy reserve capacitor, a first MEMS switches group controlled by a controlling signal, a second MEMS switches group controlled by the controlling signal, a third MEMS switches group controlled by the controlling signal and a forth MEMS switches group controlled by the controlling signal. The flying capacitor is connected with the first voltage input node and the second voltage input node via the first MEMS switches group. The flying capacitor is connected with the first voltage input node or the second voltage input node via the second MEMS switches group. The energy reserve capacitor is connected with the flying capacitor via the third MEMS switches group. The energy reserve capacitor is connected with the voltage output node and the second voltage input node. When a clock controls the first MEMS switches group to turn on, and the second MEMS switches group and the third MEMS switches group to turn off, the flying capacitor is charged up through the first voltage input node and the second voltage input node. When the clock controls the first MEMS switches group to turn off, and the second MEMS switches group and the third MEMS switches group to turn on, the energy reserve capacitor is charged up through the flying capacitor and the second voltage input node. Through MEMS technology, miniaturization and integration of the charge pump are achieved, and power consumption is reduced, and energy conversion efficiency is improved.
Abstract:
A gas mixture comprised of nitric oxide and one or more impurities selected from nitrous oxide, nitrogen dioxide, nitrous acid, sulfur dioxide, carbonyl sulfide, water vapor and carbon dioxide is purified by pressure swing adsorption or temperature swing adsorption using a porous, metal-free polymer adsorbent that does not promote the disproportionation of nitric oxide to nitrogen dioxide and nitrogen or nitrous oxide. The adsorption step is preferably carried out at tempereatures in the range of about −120 to about 0° C.
Abstract:
A micro-electro-mechanical microphone and manufacturing method thereof are provided. The micro-electro-mechanical microphone includes a diaphragm, which is formed on a surface of one side of a semiconductor substrate, exposed to the outside surroundings, and can vibrate freely under the pressure generated by sound waves; an electrode plate with air holes, which is under the diaphragm; an isolation structure for fixing the diaphragm and the electrode plate; an air gap cavity between the diaphragm and the electrode plate, and a back cavity under the electrode plate and in the semiconductor substrate; and a second cavity formed on the surface of the same side of the semiconductor substrate and in an open manner The air gap cavity is connected with the back cavity through the air holes of the electrode plate The back cavity is connected with the second cavity through an air groove formed in the semiconductor substrate.
Abstract:
A method for manufacturing a micro-electro-mechanical system (MEMS) device is provided. The method comprises: providing a semiconductor substrate, the semiconductor substrate having a metal interconnection structure (100) formed therein; forming a first sacrificial layer (201) on the surface of the semiconductor substrate, the material of the first sacrificial layer is amorphous carbon; etching the first sacrificial layer to form a first recess (301); covering and forming a first dielectric layer (401) on the surface of the first sacrificial layer; thinning the first dielectric layer by a chemical mechanical polishing (CMP) process, until exposing the first sacrificial layer; forming a micromechanical structure layer (500) on the surface of the first sacrificial layer and exposing the first sacrificial layer, wherein a part of the micromechanical structure layer is connected to the first dielectric layer. The method avoids polishing the amorphous carbon, shortens the period of production, and improves the production efficiency.