摘要:
The invention relates to a method for production of packaged electronic, in particular optoelectronic, components in a composite wafer, in which the packaging is carried out by fitting microframe structures of a cover substrate composed of glass, and the composite wafer is broken up along trenches which are produced in the cover substrate, and to packaged electronic components which can be produced using this method, comprising a composite of a mount substrate and a cover substrate, with at least one functional element and at least one bonding element, which makes contact with the functional element, being arranged on the mount substrate, with the cover substrate being a microstructured glass which is arranged on the mount substrate, and forms a cavity above the functional element, and with the bonding elements being located outside the cavity.
摘要:
A process for producing increased service life of organic, electro-optical elements is provided. The process includes the steps of: providing a substrate, applying a first conductive layer, applying at least one layer that includes at least one organic, electro-optical material, applying a second conductive layer, and depositing at least one layer with a vitreous structure.
摘要:
In the method for microstructuring flat glass substrates a substrate surface of a glass substrate is coated with at least one structured mask layer and subsequently exposed to a chemically reactive ion etching process (RIE) with at least one chemical etching gas. In order to provide the same or a higher quality etching and etching rate even for economical types of glass the chemical etching gas is mixed with at least one noble gas, so that the proportion of sputtering etching in the ion etching process is significantly increased.
摘要:
A method for the patterned coating of a substrate with at least one surface is provided. The method is suitable for the rapid and inexpensive production of precise patterns. The method includes the steps of: producing at least one negatively patterned first coating on the at least one surface, depositing at least one second layer, which includes a material with a vitreous structure, on the surface, and at least partially removing the first coating.
摘要:
The invention relates to optical parts, and in particular to a process for applying an optically active structuring to a substrate, and also to a component produced using a process of this type. The process for applying an optically active structuring to a substrate comprises in particular photolithographic techniques and the deposition of material via physical vapor deposition processes.
摘要:
The invention relates to a method for production of packaged electronic, in particular optoelectronic, components in a composite wafer, in which the packaging is carried out by fitting microframe structures of a cover substrate composed of glass, and the composite wafer is broken up along trenches which are produced in the cover substrate, and to packaged electronic components which can be produced using this method, comprising a composite of a mount substrate and a cover substrate, with at least one functional element and at least one bonding element, which makes contact with the functional element, being arranged on the mount substrate, with the cover substrate being a microstructured glass which is arranged on the mount substrate, and forms a cavity above the functional element, and with the bonding elements being located outside the cavity.
摘要:
A process for producing a coated substrate or a product having a coated substrate is provided. The process includes coating at least one metallic surface with a glass, the substrate being coated with an evaporation-coating glass at least on the metallic surface.
摘要:
A process for producing organic, electro-optical elements includes the steps of: providing a substrate, applying a first conductive layer, applying at least one layer which includes at least one organic, electro-optical material, applying a second conductive layer, and depositing at least one layer with a vitreous structure.
摘要:
To improve the radio-frequency properties of radio-frequency substrates or radio-frequency conductor arrangements, the invention proposes a glass material for producing insulation layers for radio-frequency substrates or radio-frequency conductor arrangements, which, as an applied layer, in particular with a layer thickness in the range between 0.05 μm and 5 mm, has a loss factor tan δ of less than or equal to 70*10−4 in at least a frequency range above 1 GHz.
摘要:
In the method for microstructuring flat glass substrates a substrate surface of a glass substrate is coated with at least one structured mask layer and subsequently exposed to a chemically reactive ion etching process (RIE) with at least one chemical etching gas. In order to provide the same or a higher quality etching and etching rate even for economical types of glass the chemical etching gas is mixed with at least one noble gas, so that the proportion of sputtering etching in the ion etching process is significantly increased.