-
公开(公告)号：US12221714B2
公开(公告)日：2025-02-11
申请号：US17674276
申请日：2022-02-17
Applicant: EBARA CORPORATION
Inventor： Ryuya Koizumi , Masashi Shimoyama , Mizuki Nagai
Abstract: A plating method capable of saving a substrate in an event of a failure of a transporter, a plating tank, or other component when the substrate is being plated is disclosed. The plating method includes: transporting a plurality of substrates to a plurality of plating tanks, respectively, with a transporter; immersing the plurality of substrates in a plating solution held in the plurality of plating tanks to plate the plurality of substrates; detecting a failure that has occurred in the transporter or a post-processing tank; and replacing the plating solution in the plurality of plating tanks with a preservative liquid to thereby immerse the plurality of substrates in the preservative liquid.
-
公开(公告)号：US12221712B2
公开(公告)日：2025-02-11
申请号：US18030235
申请日：2022-06-01
Applicant: EBARA CORPORATION
Inventor： Shigeyuki Nakahama
Abstract: Provided is a technique that allows suppressing a film thickness on an outer peripheral edge of a substrate becoming non-uniform.
A plating apparatus 1 includes a plating tank, an anode, a substrate holder, at least one auxiliary anode 60a to 60d, a busbar 61 having a power feeding part 62, to which electricity is supplied, and a plurality of connecting parts 63 connected to the at least one auxiliary anode and arrayed in an extending direction of the auxiliary anode, and at least one ionically resistive element 80a to 80d. The ionically resistive element is configured to increase in resistivity of the ionically resistive element as approaching the power feeding part in an extending direction of the ionically resistive element.-
公开(公告)号：USD1060213S1
公开(公告)日：2025-02-04
申请号：US29853469
申请日：2022-09-15
Applicant: EBARA CORPORATION
Designer： Hiromi Tamura , Takashi Sekiguchi , Yasumasa Yamada
-
公开(公告)号：US20250035105A1
公开(公告)日：2025-01-30
申请号：US18715788
申请日：2022-09-26
Applicant: EBARA CORPORATION
Inventor： Kazuhiko SUGIYAMA , Yosuke HARADA , Hideyuki IWAMOTO , Shigeru OKAMOTO
Abstract: A water-discharge pump apparatus includes: a pump controller configured to control operation of a pump based on a water level detected by a water level detector. The pump controller includes: a weather information acquisition section configured to acquire weather information on the monitoring site; an abnormality determining section configured to determine whether an abnormality has occurred in the water level detector or the pump; a water-level-detector abnormality processing section configured to control operation of the pump based on the weather information when it is determined that an abnormality has occurred in the water level detector; and a pump abnormality processing section configured to output support request information requesting support for water-discharge operation by at least one of the pump vehicle and the worker based on at least one of the water level detected by the water level detector and the weather information when it is determined that an abnormality has occurred in the pump.
-
公开(公告)号：US12211733B2
公开(公告)日：2025-01-28
申请号：US17759932
申请日：2021-01-13
Applicant: EBARA CORPORATION
Inventor： Nobuyuki Takada , Hozumi Yasuda
IPC: H01L21/687 , B24B37/005 , B24B37/10 , B24B41/06 , B24B49/02 , H01L21/304 , H01L21/67 , H01L21/68
Abstract: A substrate processing apparatus includes a table, a pad holder, an elevating mechanism, and at least three centering mechanisms. The table is for supporting a substrate. The pad holder is for holding a polishing pad for polishing the substrate supported by the table. The elevating mechanism is for elevating the pad holder with respect to the substrate. The at least three centering mechanisms are for pushing the substrate supported by the table in a center direction of the table to position the substrate. The at least three centering mechanisms each include a rotation shaft arranged in a peripheral area of the table and a centering member mounted to the rotation shaft.
-
Patent Agency Ranking
公开(公告)号：US20250025984A1
公开(公告)日：2025-01-23
申请号：US18716460
申请日：2022-11-08
Applicant: EBARA CORPORATION
Inventor： Masayuki FUJIKI , Nobuhito KIYOSAWA
Abstract: The present invention relates to a substrate polishing method of polishing a substrate, such as a wafer, by pressing a polishing tape against the substrate. The substrate polishing method includes: storing an actual polishing condition for a substrate that has been polished in the past and an actual amount of use of a polishing tape under the actual polishing condition in a database (21a), with the actual polishing condition and the actual amount of use associated with each other, searching the database (21a) for an actual polishing condition that matches a preset polishing condition for a polishing-target substrate before polishing of the polishing-target substrate, determining a predicted amount of use of the polishing tape necessary for polishing the polishing-target substrate which is an actual amount of use of the polishing tape associated with the actual polishing condition that matches the preset polishing condition; comparing a remaining amount of the polishing tape to be used for polishing of the polishing-target substrate with the determined predicted amount of use; and when the remaining amount of the polishing tape is equal to or larger than the predicted amount of use, polishing the polishing-target substrate by a polishing module (4A, 4B).
-
公开(公告)号：USD1056841S1
公开(公告)日：2025-01-07
申请号：US29865746
申请日：2022-08-10
Applicant: EBARA CORPORATION
Designer： Akihiro Ochiai , Kazuma Nishimura , Yohei Oishi , Takahide Ozawa , Masayuki Nagai , Shin Takahashi , Yuhei Shinchi
-
8.发明授权公开(公告)号：US12183642B2
公开(公告)日：2024-12-31
申请号：US17694125
申请日：2022-03-14
Applicant: EBARA CORPORATION
Inventor： Osamu Nabeya , Shingo Togashi , Keisuke Namiki
IPC: H01L21/304 , H01L21/66 , H01L21/67 , H01L21/687
Abstract: A polishing method capable of accurately determining a polishing end point of a substrate is disclosed. The method is a film-thickness measuring method for a substrate W using a film-thickness measuring device, at least a part of which being mounted in a polishing table configured to support the polishing pad. The method includes measuring film thicknesses of the substrate W, while rotating the substrate W on a polishing surface of the polishing pad by a polishing head and controlling a position of the film-thickness measuring device relative to the polishing head.
-
公开(公告)号：US12179310B2
公开(公告)日：2024-12-31
申请号：US17410099
申请日：2021-08-24
Applicant: EBARA CORPORATION
Inventor： Atsushi Abe , Taro Takahashi , Hiroaki Shibue , Shinpei Tokunaga , Katsuhide Watanabe
IPC: G01B7/06 , B24B49/10 , B24B37/013
Abstract: An eddy current sensor has an exciting coil and a detection coil. A holding circuit holds reference data indicating a characteristic of an output signal output from the detection coil at a reference state and outputs the reference data at a state other than the reference state. A pseudo signal generating circuit generates and outputs a balance coil pseudo signal corresponding to the output signal output from the detection coil at the reference state from the reference data output from the holding circuit. A bridge circuit, at the state other than the reference state, receives the output signal output from the detection coil and the balance coil pseudo signal and outputs a bridge output signal corresponding to a difference between the output signal and the balance coil pseudo signal as a bridge output signal.
-
公开(公告)号：US12163244B2
公开(公告)日：2024-12-10
申请号：US17781363
申请日：2021-03-05
Applicant: EBARA CORPORATION
Inventor： Yasuyuki Masuda , Ryosuke Hiwatashi , Masashi Shimoyama
Abstract: There is provided a method of adjusting a plating module, wherein the plating module comprises a substrate holder configured to hold a substrate, an anode placed to be opposed to the substrate holder, and a plate placed between the substrate holder and the anode to serve as an ionically resistive element. The method comprises: providing a plating module of initial setting, which is initially set in such a state that a porosity in an outer circumferential portion of the plate is adjusted to reduce a plating film thickness in an outer circumferential portion of the substrate to be smaller than a film thickness in another portion; and adjusting a distance between the substrate holder and the plate so as to flatten a distribution of plating film thickness of the entire substrate by adjustment of the distance between the substrate holder and the plate such as to increase a film thickness in the outer circumferential portion of the substrate according to a film thickness distribution of the substrate that is plated in the plating module.
-
-
-
-
-
-
-
-
-
Search Results
2167
records
(took 0.027 seconds)
