SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    2.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 审中-公开
    基板处理装置和基板处理方法

    公开(公告)号:US20130014787A1

    公开(公告)日:2013-01-17

    申请号:US13544207

    申请日:2012-07-09

    IPC分类号: B08B3/00

    CPC分类号: H01L21/31133 H01L21/6708

    摘要: A substrate processing apparatus supplies a resist stripping solution, formed by mixing sulfuric acid and a hydrogen peroxide solution, to a surface of a substrate. The substrate processing apparatus includes a nozzle that discharges the resist stripping solution toward the substrate, a hydrogen peroxide solution supply passage through which the hydrogen peroxide solution flows toward the nozzle, a plurality of sulfuric acid supply passages respectively connected to a plurality of mixing positions along the hydrogen peroxide solution supply passage that differ in flow passage length to the nozzle, and a sulfuric acid supply passage selecting unit that introduces the sulfuric acid from a sulfuric acid supply source to a sulfuric acid supply passage selected from among the plurality of sulfuric acid supply passages.

    摘要翻译: 基板处理装置将通过将硫酸和过氧化氢溶液混合形成的抗蚀剂剥离溶液提供到基板的表面。 基板处理装置包括将抗蚀剂剥离溶液朝向基板排出的喷嘴,过氧化氢溶液朝向喷嘴流动的过氧化氢溶液供给路径,分别与多个混合位置连接的多个硫酸供给通路 与喷嘴不同的流路长度的过氧化氢溶液供给流路,以及从硫酸供给源将硫酸从硫酸供给路径中选出的硫酸供给路径导入的硫酸供给路径选择部, 段落。