公开(公告)号：US20140255376A1

公开(公告)日：2014-09-11

申请号：US14181241

申请日：2014-02-14

申请人： Eric A. Johnson ,  Sabine Pellett ,  William H. Tepp ,  Tony L. Yaksh ,  Marc Marino ,  Qinghao Xu

发明人： Eric A. Johnson ,  Sabine Pellett ,  William H. Tepp ,  Tony L. Yaksh ,  Marc Marino ,  Qinghao Xu

IPC分类号： A61K47/48 ,  C12N9/96

CPC分类号： A61K47/62 ,  A61K9/0085 ,  A61K38/164 ,  A61K38/4893 ,  C07K7/22 ,  C07K14/33 ,  C07K14/57545 ,  C07K14/70 ,  C07K14/72 ,  C07K2319/01 ,  C07K2319/33 ,  C07K2319/55 ,  C12N9/96 ,  C12Y304/24069

摘要： A chimeric toxin is disclosed comprising a peptide ligand specifically targeting neurons involved in pain processing; and a clostridial neurotoxin light chain, wherein the ligand is linked to the light chain. The methods of preparing such chimeric toxin and the method of using the chimeric toxin to regulate pain transmission are also disclosed.

摘要翻译： 公开了一种嵌合毒素，其包含特异性靶向涉及疼痛加工的神经元的肽配体; 和梭菌神经毒素轻链，其中所述配体与轻链连接。 还公开了制备这种嵌合毒素的方法和使用嵌合毒素调节疼痛传递的方法。

公开(公告)号：US08435759B2

公开(公告)日：2013-05-07

申请号：US12664800

申请日：2008-06-27

申请人： Eric A. Johnson ,  Kristin M. Marshall ,  Sabine Pellett ,  Marite Bradshaw

发明人： Eric A. Johnson ,  Kristin M. Marshall ,  Sabine Pellett ,  Marite Bradshaw

IPC分类号： C12P21/00 ,  C12N15/74

CPC分类号： C12N9/52 ,  C07K14/33 ,  C12N15/74 ,  C12Y304/24069

摘要： The present invention provides a novel isolated plasmid, wherein the plasmid is a native plasmid found in unique C. botulinum type A strains and encode either BoNT/A3 or BoNT/A4 and BoNT/B. The present invention also provides a method of obtaining a plasmid-encoded botulinum neurotoxin and botulinum neurotoxin complex comprising the step of isolating a plasmid encoding the cntA/A or cntA/B neurotoxin gene and genes encoding protein components of the toxin complex from a C. botulinum type A strain. The inventors performed comparative analyzes of representative BoNT/A subtype strains by pulsed-field gel electrophoresis (PFGE) and Southern hybridizations with probes specific for the BoNT/A and B genes, cntA/A and cntA/B. Unexpectedly, the inventors determined that the genes encoding BoNT/A3 in the A3 strain, and BoNT/A4 and BoNT/B in the A4 strain, are on plasmids.

摘要翻译： 本发明提供了一种新的分离质粒，其中质粒是在独特的A型肉毒杆菌中发现的天然质粒，并且编码BoNT / A3或BoNT / A4和BoNT / B。 本发明还提供了获得质粒编码的肉毒杆菌神经毒素和肉毒杆菌神经毒素复合物的方法，包括分离编码cntA / A或cntA / B神经毒素基因的质粒和编码来自C的毒素复合物的蛋白质组分的基因的步骤。 A型肉毒杆菌。 本发明人通过脉冲场凝胶电泳（PFGE）和针对BoNT / A和B基因cntA / A和cntA / B特异性探针的Southern杂交进行了代表性的BoNT / A亚型菌株的比较分析。 出人意料的是，本发明人确定了A3菌株中编码BoNT / A3的基因以及A4菌株中的BoNT / A4和BoNT / B在质粒上。

公开(公告)号：US07499614B2

公开(公告)日：2009-03-03

申请号：US10692921

申请日：2003-10-24

申请人： Eric A. Johnson ,  David V. Caletka

发明人： Eric A. Johnson ,  David V. Caletka

IPC分类号： G02B6/26

CPC分类号： G02B6/1221 ,  G02B6/12004 ,  G02B6/42 ,  G02B6/4232 ,  G02B2006/12104 ,  G02B2006/12176

摘要： A method of producing opto-electronic cards and printed circuit boards which are adapted to provide for passive alignment of VCSELs to waveguides. Also provided are opto-electronic cards and printed circuit boards which incorporate structure providing for the passive alignment of VCSELs to waveguides.

摘要翻译： 一种制造光电卡和印刷电路板的方法，其适于提供VCSEL与波导的无源对准。 还提供了光电卡和印刷电路板，其结合提供VCSEL到波导的被动对准的结构。

公开(公告)号：US20090017495A1

公开(公告)日：2009-01-15

申请号：US12040542

申请日：2008-02-29

申请人： Michael Baldwin ,  Eric A. Johnson ,  Joseph T. Barbieri ,  Marite Bradshaw ,  William H. Tepp ,  Christina L. Pier

发明人： Michael Baldwin ,  Eric A. Johnson ,  Joseph T. Barbieri ,  Marite Bradshaw ,  William H. Tepp ,  Christina L. Pier

IPC分类号： C12N15/09 ,  C07K14/33

CPC分类号： C12N9/52 ,  A61K39/0258 ,  A61K39/08 ,  A61K2039/523 ,  C12Y304/24069 ,  Y02A50/469 ,  Y02A50/474

摘要： A method of producing botulinum toxin C-terminal receptor binding domain (HCR) is disclosed. The one embodiment, the method comprises the steps of (a) preparing E. coli transformed with an expression vector comprising DNA encoding HCR protein, (b) inducing expression of the HCR protein at a reduced temperature in a culture media, and (c) purifying the HCR protein via extraction, wherein the extraction comprises a clarification by centrifugation and a filtration, wherein the purified HCR protein is at least 10 mg/L of culture medium.

摘要翻译： 公开了产生肉毒杆菌毒素C末端受体结合结构域（HCR）的方法。 该方法包括以下步骤：（a）用包含编码HCR蛋白的DNA的表达载体转化大肠杆菌，（b）在培养基中降低温度诱导HCR蛋白的表达，和（c） 通过提取纯化HCR蛋白质，其中提取物通过离心和过滤进行澄清，其中纯化的HCR蛋白质为至少10mg / L的培养基。

公开(公告)号：US07433674B2

公开(公告)日：2008-10-07

申请号：US11559918

申请日：2006-11-15

申请人： Eric A. Johnson ,  Mark J. Handzel

发明人： Eric A. Johnson ,  Mark J. Handzel

IPC分类号： H04M11/00

CPC分类号： H04W12/12 ,  H04L63/1416 ,  H04L63/1425 ,  H04M3/38 ,  H04M15/00 ,  H04M15/41 ,  H04M15/47 ,  H04M15/88 ,  H04M15/887 ,  H04M17/00 ,  H04M2203/6027 ,  H04M2215/0116 ,  H04M2215/014 ,  H04M2215/0148 ,  H04M2215/0164 ,  H04M2215/32 ,  H04W4/24 ,  H04W12/06 ,  H04W60/00

摘要： The present invention provides an apparatus for credit based management of a telecommunication system. One embodiment of the apparatus includes an interface for communicating credit information on a particular subscriber and for receiving call records for the particular subscriber that are derived from a switch which establishes connections between telecommunication devices. A credit limit device then utilizes the credit information to establish a credit limit for the subscriber. The apparatus also includes a device for comparing the particular subscriber's call usage to a credit limit established for the subscriber based on information obtained from the credit bureau. An output device is used to provide an indication that the subscriber has exceeded their credit limit. Another embodiment of the apparatus, includes a device for, upon expiration of a predetermined time period, contacting the credit bureau to obtain a new credit score for a subscriber and use this score to update the subscriber's credit limit.

摘要翻译： 本发明提供了一种用于电信系统的信用管理的装置。 该装置的一个实施例包括用于在特定订户上传送信用信息的接口，以及用于接收从建立电信设备之间的连接的交换机导出的特定用户的呼叫记录。 信用限额设备然后利用信用信息为用户建立信用限额。 该装置还包括一个装置，用于根据从信用局获得的信息将特定用户的呼叫使用量与为用户建立的信用限额进行比较。 输出设备用于提供用户已经超过其信用限额的指示。 该装置的另一实施例包括一种装置，用于在预定时间段期满后，联系信用局以获得用户的新信用评分，并使用该分数来更新用户的信用限额。

公开(公告)号：US20080194418A1

公开(公告)日：2008-08-14

申请号：US11914099

申请日：2006-05-10

申请人： Eric A. Johnson ,  Guowen Liu ,  Michael R. Miller

发明人： Eric A. Johnson ,  Guowen Liu ,  Michael R. Miller

IPC分类号： C40B30/04 ,  C12Q1/68 ,  C40B40/08 ,  C40B50/06

CPC分类号： C12Q1/683 ,  C12Q2563/131 ,  C12Q2533/101 ,  C12Q2525/191 ,  C12Q2565/501

摘要： Described herein are methods for the high-throughput discovery and genotyping of nucleotide polymorphisms in DNA, including single nucleotide polymorphism (SNPs) and short deletions and insertions. These methods take advantage of the fact that differences in DNA sequence result in the differential presence of restriction endonuclease digestion sites. Differences can be detected between individuals, or the relative presence detected in a population. Provided approaches involve isolation of short DNA fragments (“tags) near restriction endonuclease sites. The presence of one (or two) of these tags indicates that a site was present. Distinguishable labeling of tags from two individual or populations allows comparative presence of these sites to be assayed on a platform that employs a collection of nucleic acids. Other approaches depend on the differential presence of restriction endonuclease sites, but involve mixing genomic DNA from the two individuals. Regions of DNA with a restriction site in only one individual create an opportunity for primer extension to produce labeled material, which can be assayed on a platform that employs a collection of nucleic acids. Any of a variety of detection platforms can be use with the described approaches. By way of example, highly efficient variant detection microarrays and bead libraries are provided that contain genomic tags with different representations between two populations, so that most elements in the collection of nucleic acids contain an informative SNP between the populations of interest.

摘要翻译： 本文描述了DNA的核苷酸多态性的高通量发现和基因分型的方法，包括单核苷酸多态性（SNPs）和短缺失和插入。 这些方法利用DNA序列的差异导致限制性内切核酸酶消化位点的差异存在的事实。 可以在个体之间检测差异，或在群体中检测到相对存在。 提供的方法包括在限制性内切核酸酶位点附近分离短DNA片段（“标签”），一个（或两个）这些标签的存在表明存在一个位点。来自两个个体或群体的标签的区分标签允许这些位点的比较存在 在采用核酸集合的平台上进行检测其他方法取决于限制性内切核酸酶位点的差异存在，但涉及混合来自两个个体的基因组DNA。仅在一个个体中具有限制性位点的DNA区域产生机会 用于引物延伸以产生标记的物质，其可以在采用核酸集合的平台上进行测定。多种检测平台中的任何一种可以与所述方法一起使用。作为示例，高效变体检测微阵列和珠粒 提供了包含两个群体之间具有不同表征的基因组标签的文库，因此大多数 核酸集合中的元素包含感兴趣的群体之间的信息性SNP。

公开(公告)号：US07067916B2

公开(公告)日：2006-06-27

申请号：US09885853

申请日：2001-06-20

申请人： William E. Bernier ,  Charles F. Carey ,  Eberhard B. Gramatzki ,  Thomas R. Homa ,  Eric A. Johnson ,  Pierre Langevin ,  Irving Memis ,  Son K. Tran ,  Robert F. White

发明人： William E. Bernier ,  Charles F. Carey ,  Eberhard B. Gramatzki ,  Thomas R. Homa ,  Eric A. Johnson ,  Pierre Langevin ,  Irving Memis ,  Son K. Tran ,  Robert F. White

IPC分类号： H01L23/48

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/351 ,  H05K3/3436 ,  H01L2924/00

摘要： A method and structure for coupling a semiconductor substrate (e.g., a semiconductor chip) to an organic substrate (e.g., a chip carrier). The coupling interfaces a solder member (e.g., a solder ball) to both a conductive pad on the semiconductor substrate and a conductive pad on the organic substrate. Thermal strains on the solder member during thermal cycling may be reduced by having a surface area of the pad on the semiconductor substrate exceed a surface area of the pad on the organic substrate. Thermal strains on the solder member during thermal cycling may also be reduced by having a distance from a centerline of the solder member to a closest lateral edge of the semiconductor substrate exceed about 0.25 mm.

公开(公告)号：US06677522B1

公开(公告)日：2004-01-13

申请号：US10255457

申请日：2002-09-26

申请人： Charles F. Carey ,  Eric A. Johnson ,  Alfredo Migliore

发明人： Charles F. Carey ,  Eric A. Johnson ,  Alfredo Migliore

IPC分类号： H01L2328

CPC分类号： H01L23/562 ,  H01L23/3121 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： An electronic component such as a ceramic capacitor is coupled to a dielectric substrate package. Encapsulant material substantially surrounding the sides of the component, develops cracks therein, particularly near the corners of the component where CTE stresses are greatest. The cracks propagate downward into the dielectric substrate material and sever circuit lines in the substrate causing failure. A mounting pad for the component is extended from beneath the component to substantially beyond the outer periphery of the encapsulant material to prevent cracks from propagating into the dielectric material.

摘要翻译： 诸如陶瓷电容器的电子部件耦合到电介质基板封装。 基本上围绕部件侧面的封装材料在其中产生裂纹，特别是在CTE应力最大的部件的拐角附近。 裂纹向下传播到电介质基片材料中，并使基片中的电路线导致故障。 用于部件的安装垫从部件下方延伸到基本上超过密封剂材料的外周边，以防止裂纹传播到电介质材料中。

公开(公告)号：US06570259B2

公开(公告)日：2003-05-27

申请号：US09814789

申请日：2001-03-22

申请人： David J. Alcoe ,  Eric A. Johnson ,  Matthew M. Reiss ,  Charles G. Woychik

发明人： David J. Alcoe ,  Eric A. Johnson ,  Matthew M. Reiss ,  Charles G. Woychik

IPC分类号： H01L2348

CPC分类号： H01L21/563 ,  H01L23/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01004 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/05639 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655

摘要： The present invention provides a package for a semiconductor chip that minimizes stresses and strains that arise from differential thermal expansion on chip-to-substrate or chip-to-card interconnections. A collar element of one or more elements is provided. Adhesive material connects the collar element to the electric device and to the substrate that supports it, forming a unitary electrical package.

公开(公告)号：US06545869B2

公开(公告)日：2003-04-08

申请号：US09764048

申请日：2001-01-17

申请人： Barry A. Bonitz ,  Eric Duchesne ,  Michael A. Gaynes ,  Eric A. Johnson

发明人： Barry A. Bonitz ,  Eric Duchesne ,  Michael A. Gaynes ,  Eric A. Johnson

IPC分类号： H05K720

CPC分类号： H01L23/4334 ,  H01L21/4882 ,  H01L21/563 ,  H01L23/3735 ,  H01L24/32 ,  H01L2224/73203 ,  H01L2224/83951 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/351 ,  Y10T29/4913 ,  H01L2924/3512 ,  H01L2924/00

摘要： An electronic structure, and associated method of fabrication, for coupling a heat spreader above a chip to a chip carrier below the chip. Initially provided is a substrate, a chip on a surface of the substrate and coupled to the substrate, and the heat spreader. Then a fillet of at least one adhesive material is formed on the chip and around a periphery of the chip. Additionally, the heat spreader is placed on a portion of the fillet and over a top surface of the chip. The fillet couples the heat spreader to the substrate. An outer surface of the fillet makes a to contact angle of about 25 degrees with the surface of the substrate. The small contact angle not exceeding about 25 degrees prevents cracking of the substrate that would otherwise result from thermal cycling.

摘要翻译： 一种用于将芯片上方的散热器与芯片下方的芯片载体耦合的电子结构及其制造方法。 最初提供的是衬底，衬底的表面上的芯片并且耦合到衬底和散热器。 然后在芯片上和芯片的周围形成至少一种粘合剂材料的圆角。 此外，散热器放置在圆角的一部分上并且在芯片的顶表面上。 圆角将散热器耦合到基板。 圆角的外表面与衬底的表面形成约25度的接触角。 小的接触角不超过约25度可以防止由于热循环而导致的基体的破裂。