Abstract:
A method of measuring temperature of a TMR element includes a step of obtaining in advance a temperature coefficient of element resistance of a discrete TMR element that is not mounted on an apparatus, by measuring temperature versus element resistance value characteristic of the discrete TMR element in a state that a breakdown voltage is intentionally applied to the discrete TMR element and a tunnel barrier layer of the discrete TMR element is brought into a stable conductive state, a step of bringing a tunnel barrier layer of a TMR element actually mounted on the apparatus into a stable conductive state by intentionally applying the breakdown voltage to the mounted TMR element having the same structure as that of the discrete TMR element whose temperature coefficient has been measured, a step of measuring an element resistance value of the mounted TMR element with the tunnel barrier layer that has been brought into a stable conductive state, and a step of obtaining a temperature corresponding to the measured element resistance value from the previously measured temperature coefficient of element resistance.
Abstract:
A seal inspector and a method of inspecting a seal are described. A seal inspector includes an eddy current sensor for detecting changes in an eddy current within a lid seal of a can. The eddy current sensor includes a signal line for creating a magnetic field, which induces the eddy current. The induced eddy current generates a magnetic field that acts on the alternating current and as a consequence produces an eddy current response. A signal processing control unit receives the eddy current response and determines whether a value associated with the eddy current has surpassed a threshold value. If the associated value has surpassed the threshold value, the can may be ejected from a can conveyor system.
Abstract:
A thin-film magnetic head that the protrusion of the head end surface due to heat generated from the heating means becomes large enough to set the magnetic spacing dMS to the smaller value efficiently is provided. The head comprises: a substrate having an element-formed surface on which at least one concave portion is formed and an ABS; at least one magnetic head element formed above or on the element-formed surface; at least one thermal expansion layer embedded in the at least one concave portion; and at least one heating means positioned directly above the at least one thermal expansion layer.
Abstract translation:提供了由于由加热装置产生的热量而使头端表面的突出部变得足够大以将磁性间隔d MS MS 有效地设定为较小值的薄膜磁头。 头部包括:具有形成有至少一个凹部的元件形成表面的基板和ABS; 至少一个磁头元件形成在元件形成表面之上或之上; 至少一个热膨胀层嵌入在所述至少一个凹部中; 以及至少一个位于至少一个热膨胀层上方的加热装置。
Abstract:
A peripheral power management system includes a power monitor for determining a power consumption characteristic of a computing processor and a controller for generating a reference power signal based on the power consumption characteristic. The peripheral power management system also includes a power regulator control signal generator for generating a power regulator control signal based on the reference power signal. The power regulator control signal controls a peripheral device power regulator which regulates an electrical supply power of a peripheral device. In this way, the peripheral power management system controls regulation of the electrical supply power of the peripheral device based on the power consumption characteristic of the computing processor. In some embodiments, the peripheral power management system determines the power consumption characteristic of the computing processor by monitoring communication on a serial voltage identification bus.
Abstract:
An MRAM circuit includes an MRAM array having a plurality of operational MRAM elements and a reference cell made up of one or more reference MRAM elements. A plurality of program lines within a first region are cladded with a flux-concentrating layer configured to focus a generated magnetic field while the portions of the program lines within a second region are uncladded so that the generated magnetic field is unfocused. Generally, the first region is associated with the operational MRAM elements and the second region is associated with the reference cell.
Abstract:
A slider mounted CPP GMR or TMR read head sensor is protected from electrostatic discharge (ESD) damage and from noise and cross-talk from an adjacent write head by means of a balanced resistive/capacitative shunt. The shunt includes highly resistive interconnections between upper and lower shields of the read head and a grounded slider substrate and a low resistance interconnection between the lower pole piece of the write head and the substrate. The capacitances between the pole piece and the upper shield, the upper shield and the lower shield and the lower shield and the substrate are made equal by either forming the shields and pole piece with equal surface areas and separating them with dielectrics of equal thicknesses, or by keeping the ratio of area to insulator thicknesses equal.
Abstract:
Embodiments of the present disclosure include systems, apparatuses, and methods for dynamic frequency and voltage control of components used in a computer system. A system includes a processor voltage regulator and a system clock generator directly operably with each other. The processor voltage regulator provides a core voltage signal to a processor, and is configured to detect a present processor load state of the processor. The system clock generator is for providing a system clock signal to the processor. At least one of the processor voltage regulator or the system clock generator is further configured determine a desired frequency of the system clock signal responsive to the present processor load state, and determine a voltage level for the core voltage signal suitably paired with the desired frequency for proper operation of the processor at the desired frequency. Other systems, apparatuses, and methods are provided.
Abstract:
Embodiments of the present disclosure include systems, apparatuses, and methods for dynamic frequency and voltage control of components used in a computer system. A system includes a processor voltage regulator and a system clock generator directly operably with each other. The processor voltage regulator provides a core voltage signal to a processor, and is configured to detect a present processor load state of the processor. The system clock generator is for providing a system clock signal to the processor. At least one of the processor voltage regulator or the system clock generator is further configured determine a desired frequency of the system clock signal responsive to the present processor load state, and determine a voltage level for the core voltage signal suitably paired with the desired frequency for proper operation of the processor at the desired frequency. Other systems, apparatuses, and methods are provided.
Abstract:
A method of measuring temperature of a TMR element includes a step of obtaining in advance a temperature coefficient of element resistance of a discrete TMR element that is not mounted on an apparatus, by measuring temperature versus element resistance value characteristic of the discrete TMR element in a state that a breakdown voltage is intentionally applied to the discrete TMR element and a tunnel barrier layer of the discrete TMR element is brought into a stable conductive state, a step of bringing a tunnel barrier layer of a TMR element actually mounted on the apparatus into a stable conductive state by intentionally applying the breakdown voltage to the mounted TMR element having the same structure as that of the discrete TMR element whose temperature coefficient has been measured, a step of measuring an element resistance value of the mounted TMR element with the tunnel barrier layer that has been brought into a stable conductive state, and a step of obtaining a temperature corresponding to the measured element resistance value from the previously measured temperature coefficient of element resistance.