公开(公告)号：US20100140785A1

公开(公告)日：2010-06-10

申请号：US12330676

申请日：2008-12-09

Applicant: Thomas Killer ,  Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Volker Strutz ,  Hermann Josef Lutz

Inventor： Thomas Killer ,  Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Volker Strutz ,  Hermann Josef Lutz

IPC: H01L23/48 ,  H01L21/56 ,  H01L21/60

CPC classification number: H01L23/4985 ,  H01L21/6835 ,  H01L23/36 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/48 ,  H01L2221/68386 ,  H01L2224/04042 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of assembling a semiconductor device includes providing a chip attached to an elastic carrier, and supporting the elastic carrier with a stiffener. The method additionally includes removing the stiffener from the elastic carrier after attaching the elastic carrier to a board.

Abstract translation: 组装半导体器件的方法包括提供附接到弹性载体的芯片，并且用加强件支撑弹性载体。 该方法还包括在将弹性载体附接到板上之后从弹性载体移除加强件。

公开(公告)号：US07355858B2

公开(公告)日：2008-04-08

申请号：US11375565

申请日：2006-03-15

Applicant: Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz ,  Erich Syri

Inventor： Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz ,  Erich Syri

IPC: H05K7/20

CPC classification number: H01L23/4093 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A heat sink for surface-mounted semiconductor devices is provided on a superordinate circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are spring-elastically connected to the press-on region of the heat sink via a spring-elastic connecting region of the heat sink. The snap-action hooks engage with edge regions of a thermally conductive coupling plate with the press-on region generating pressure. The coupling plate is fixed to a rear side of a semiconductor chip of the surface-mounted semiconductor device.

Abstract translation: 用于表面安装的半导体器件的散热器设置在电子模块的上级电路板上。 散热器包括具有压入区域和快动钩的三维结构的导热板。 快动钩相对于压入区域大致直角设置，并且通过散热器的弹簧弹性连接区域弹簧连接到散热器的压入区域。 快动钩与导热联接板的边缘区域接合，压区产生压力。 耦合板固定到表面安装半导体器件的半导体芯片的后侧。

公开(公告)号：US06774483B2

公开(公告)日：2004-08-10

申请号：US10414837

申请日：2003-04-16

Applicant: Jürgen Högerl ,  Erich Syri

Inventor： Jürgen Högerl ,  Erich Syri

IPC: H01L2334

CPC classification number: H05K1/141 ,  H01L25/0655 ,  H01L2924/0002 ,  H05K3/301 ,  H05K3/366 ,  H05K2201/045 ,  H05K2201/10159 ,  H05K2201/10189 ,  H01L2924/00

Abstract: A semiconductor assembly includes a module holder and a semiconductor module, which has a board substrate with conductor tracks and one or more unpackaged semiconductor chips mounted on the substrate, which are connected to conductor tracks on the substrate by electrical contacts. The substrate has at one edge at least one contact strip with connection contact areas, which are connected to at least some of the conductor tracks. The module holder has a plug-in connection for the electrical connection to other components, at least one mating contact strip for the connection to the contact strip of the at least one semiconductor module and electrical conductors between the contact areas of the at least one semiconductor module and electrical contacts of the plug-in connection. The configuration allows semiconductor modules to be connected to the outside world in an economical way.

Abstract translation: 半导体组件包括模块保持器和半导体模块，其具有带有导体轨迹的板基板和安装在基板上的一个或多个未封装的半导体芯片，其通过电触点连接到基板上的导体轨道。 衬底在一个边缘处具有至少一个具有连接接触区域的接触片，其连接到至少一些导体轨道。 模块保持器具有用于与其他部件的电连接的插入式连接，用于连接至少一个半导体模块的接触条的至少一个配合接触条和至少一个半导体的接触区之间的电导体 插头连接的模块和电气触点。 该配置允许半导体模块以经济的方式连接到外部世界。

公开(公告)号：US08026618B2

公开(公告)日：2011-09-27

申请号：US11759977

申请日：2007-06-08

Applicant: Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

Inventor： Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

IPC: H01L23/28

CPC classification number: H01L23/4334 ,  H01L23/3128 ,  H01L23/36 ,  H01L24/48 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device includes a plastic housing and a semiconductor chip, wherein the semiconductor chip includes an active top side and a rear side. An interposer is arranged on the active top side of the semiconductor chip. At least a portion of the interposer is embedded into the plastic housing, while the top side of the interposer forms the top side of the semiconductor device. A top side fitting shape is arranged on the top side of the interposer, where the top side fitting shape has a predetermined radius of curvature that is free of plastic housing composition, and the top side fitting shape has a convex or concave lens-shaped sphere segment shape.

Abstract translation: 半导体器件包括塑料外壳和半导体芯片，其中半导体芯片包括有源顶侧和后侧。 在半导体芯片的有源顶侧设置插入件。 插入器的至少一部分嵌入到塑料外壳中，而插入件的顶侧形成半导体器件的顶侧。 顶侧配件形状布置在插入件的顶侧上，其中顶侧配件形状具有不具有塑料外壳组合物的预定曲率半径，并且顶侧配件形状具有凸或凹透镜状球体 片段形状。

公开(公告)号：US07825506B2

公开(公告)日：2010-11-02

申请号：US11910113

申请日：2006-03-27

Applicant: Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

Inventor： Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

IPC: H01L23/02

CPC classification number: H01L25/0655 ,  H01L23/16 ,  H01L23/3128 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K1/0201 ,  H05K3/284 ,  H05K2201/062 ,  H05K2201/09972 ,  H05K2201/10674 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A semiconductor module and a method for producing the same is disclosed. In one embodiment, the semiconductor module has adjacent regions on a common wiring substrate in a common plastic housing composition. The regions are thermally decoupled by a thermal barrier. Semiconductor chips whose evolution of heat loss differs are arranged in these thermally separate regions, the thermal barrier ensuring that the function of the more thermally sensitive semiconductor chip is not impaired by the heat-loss-generating semiconductor chip.

Abstract translation: 公开了一种半导体模块及其制造方法。 在一个实施例中，半导体模块在共同的塑料外壳组合物中的公共布线基板上具有相邻区域。 这些区域被热障隔热解耦。 散热差异不同的半导体芯片被布置在这些热分离区域中，确保热损失较大的半导体芯片的功能不受损失发热半导体芯片的热障。

公开(公告)号：US20090057874A1

公开(公告)日：2009-03-05

申请号：US11910113

申请日：2006-03-27

Applicant: Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

Inventor： Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

IPC: H01L21/52 ,  H01L23/02

CPC classification number: H01L25/0655 ,  H01L23/16 ,  H01L23/3128 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K1/0201 ,  H05K3/284 ,  H05K2201/062 ,  H05K2201/09972 ,  H05K2201/10674 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: Semiconductor module comprising semiconductor chips in a plastic housing in separate regions and method for producing the sameThe invention relates to a semiconductor module (9) comprising semiconductor chips (1, 2) in a plastic housing (3) in separate regions (4, 5), and to a method for producing the same. In this case, the semiconductor module (9) has adjacent regions (4, 5) on a common wiring substrate (7) in a common plastic housing composition (6), said regions being thermally decoupled by a thermal barrier (8). Semiconductor chips whose evolution of heat loss differs are arranged in these thermally separate regions (4, 5), the thermal barrier (8) ensuring that the function of the more thermally sensitive semiconductor chip (2) is not impaired by the heat-loss-generating semiconductor chip (1).

Abstract translation: 半导体模块包括分离区域中的塑料壳体中的半导体芯片及其制造方法技术领域本发明涉及一种半导体模块（9），其包括在分离区域（4,5）中的塑料壳体（3）中的半导体芯片（1,2） ）及其制造方法。 在这种情况下，半导体模块（9）在共同的塑料外壳组合物（6）中的公共布线基板（7）上具有相邻的区域（4,5），所述区域由热障（8）热解耦。 散热差异不同的半导体芯片被布置在这些热分离区域（4,5）中，确保热敏半导体芯片（2）的功能不受热损耗的影响， 生成半导体芯片（1）。

公开(公告)号：US08071433B2

公开(公告)日：2011-12-06

申请号：US12868422

申请日：2010-08-25

Applicant: Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

Inventor： Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

IPC: H01L21/00 ,  H01L21/337

CPC classification number: H01L25/165 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/73203 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/10045 ,  H05K2201/10977 ,  Y02P70/613

Abstract: A semiconductor component including: a substrate, at least one semiconductor chip arranged on the substrate and at least one passive device likewise arranged on the substrate. The passive device is mounted with its underside on the substrate. The semiconductor component further includes an interspace disposed between the underside of the passive device and the substrate. The interspace is filled with an underfilling material. In order to avoid the solder pumping effect, the upper side and the lateral sides of the passive device are also embedded in a plastic compound.

Abstract translation: 一种半导体部件，包括：衬底，布置在衬底上的至少一个半导体芯片和同样布置在衬底上的至少一个无源器件。 无源器件的底面安装在基板上。 半导体部件还包括设置在无源器件的下侧和衬底之间的间隙。 该间隙填充有底部填充材料。 为了避免焊料泵送效应，无源器件的上侧和侧面也嵌入塑料化合物中。

公开(公告)号：US07998797B2

公开(公告)日：2011-08-16

申请号：US12330676

申请日：2008-12-09

Applicant: Thomas Killer ,  Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Volker Strutz ,  Hermann Josef Lutz

Inventor： Thomas Killer ,  Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Volker Strutz ,  Hermann Josef Lutz

IPC: H01L21/00 ,  H01L23/12

CPC classification number: H01L23/4985 ,  H01L21/6835 ,  H01L23/36 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/48 ,  H01L2221/68386 ,  H01L2224/04042 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of assembling a semiconductor device includes providing a chip attached to an elastic carrier, and supporting the elastic carrier with a stiffener. The method additionally includes removing the stiffener from the elastic carrier after attaching the elastic carrier to a board.

Abstract translation: 组装半导体器件的方法包括提供附接到弹性载体的芯片，并且用加强件支撑弹性载体。 该方法还包括在将弹性载体附接到板上之后从弹性载体移除加强件。

公开(公告)号：US20070262433A1

公开(公告)日：2007-11-15

申请号：US11748135

申请日：2007-05-14

Applicant: Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

Inventor： Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

IPC: H01L23/02 ,  H01L21/00

CPC classification number: H01L25/165 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/73203 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/10045 ,  H05K2201/10977 ,  Y02P70/613

Abstract: A semiconductor component including: a substrate, at least one semiconductor chip arranged on the substrate and at least one passive device likewise arranged on the substrate. The passive device is mounted with its underside on the substrate. The semiconductor component further includes an interspace disposed between the underside of the passive device and the substrate. The interspace is filled with an underfilling material. In order to avoid the solder pumping effect, the upper side and the lateral sides of the passive device are also embedded in a plastic compound.

Abstract translation: 一种半导体部件，包括：衬底，布置在衬底上的至少一个半导体芯片和同样布置在衬底上的至少一个无源器件。 无源器件的底面安装在基板上。 半导体部件还包括设置在无源器件的下侧和衬底之间的间隙。 该间隙填充有底部填充材料。 为了避免焊料泵送效应，无源器件的上侧和侧面也嵌入塑料化合物中。

公开(公告)号：US20100323479A1

公开(公告)日：2010-12-23

申请号：US12868422

申请日：2010-08-25

Applicant: Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

Inventor： Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

IPC: H01L21/56

CPC classification number: H01L25/165 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/73203 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/10045 ,  H05K2201/10977 ,  Y02P70/613

Abstract: A semiconductor component including: a substrate, at least one semiconductor chip arranged on the substrate and at least one passive device likewise arranged on the substrate. The passive device is mounted with its underside on the substrate. The semiconductor component further includes an interspace disposed between the underside of the passive device and the substrate. The interspace is filled with an underfilling material. In order to avoid the solder pumping effect, the upper side and the lateral sides of the passive device are also embedded in a plastic compound.

Abstract translation: 一种半导体部件，包括：衬底，布置在衬底上的至少一个半导体芯片和同样布置在衬底上的至少一个无源器件。 无源器件的底面安装在基板上。 半导体部件还包括设置在无源器件的下侧和衬底之间的间隙。 该间隙填充有底部填充材料。 为了避免焊料泵送效应，无源器件的上侧和侧面也嵌入塑料化合物中。