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    Systems and methods for substrate polishing end point detection using improved friction measurement
    1.
    发明授权
    Systems and methods for substrate polishing end point detection using improved friction measurement 有权
    使用改进摩擦测量的基板抛光终点检测的系统和方法

    公开(公告)号：US09061394B2

    公开(公告)日：2015-06-23

    申请号：US13459079

    申请日：2012-04-28

    申请人： Shou-Sung Chang ,  Hung Chih Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

    发明人： Shou-Sung Chang ,  Hung Chih Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

    IPC分类号： B24B1/00 ,  B24B37/013 ,  B24B49/16

    CPC分类号： B24B37/013 ,  B24B49/16

    摘要： Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.

    摘要翻译： 提供了用于抛光衬底的方法，装置和系统。 本发明包括上压板; 耦合到上压板的扭矩/应变测量仪器; 以及耦合到扭矩/应变测量仪器并适于驱动上压板旋转通过扭矩/应变测量仪器的下压板。 在其他实施例中，本发明包括一个上部托架; 耦合到上部托架的侧向力测量仪器; 以及耦合到所述侧向力测量仪器并适于支撑抛光头的下托架。 公开了许多附加方面。

    SYSTEMS AND METHODS FOR SUBSTRATE POLISHING END POINT DETECTION USING IMPROVED FRICTION MEASUREMENT
    2.
    发明申请
    SYSTEMS AND METHODS FOR SUBSTRATE POLISHING END POINT DETECTION USING IMPROVED FRICTION MEASUREMENT 有权
    使用改进的摩擦测量的基板抛光端点检测的系统和方法

    公开(公告)号：US20130122782A1

    公开(公告)日：2013-05-16

    申请号：US13459071

    申请日：2012-04-27

    申请人： Shou-Sung Chang ,  Hung Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

    发明人： Shou-Sung Chang ,  Hung Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

    IPC分类号： B24B49/16

    CPC分类号： B24B37/013 ,  B24B49/16

    摘要： Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.

    摘要翻译： 提供了用于抛光衬底的方法，装置和系统。 本发明包括上压板; 耦合到上压板的扭矩/应变测量仪器; 以及耦合到扭矩/应变测量仪器并适于驱动上压板旋转通过扭矩/应变测量仪器的下压板。 在其他实施例中，本发明包括一个上部托架; 耦合到上部托架的侧向力测量仪器; 以及耦合到所述侧向力测量仪器并适于支撑抛光头的下托架。 公开了许多附加方面。

    Materials for chemical mechanical polishing
    4.
    发明授权
    Materials for chemical mechanical polishing 有权
    化学机械抛光材料

    公开(公告)号：US07429210B2

    公开(公告)日：2008-09-30

    申请号：US11626014

    申请日：2007-01-23

    申请人： Benjamin A. Bonner ,  Peter McReynolds ,  Gregory E. Menk ,  Anand N. Iyer ,  Gopalakrishna B. Prabhu ,  Erik S. Rondum ,  Robert L. Jackson ,  Garlen Leung

    发明人： Benjamin A. Bonner ,  Peter McReynolds ,  Gregory E. Menk ,  Anand N. Iyer ,  Gopalakrishna B. Prabhu ,  Erik S. Rondum ,  Robert L. Jackson ,  Garlen Leung

    IPC分类号： B24D11/00

    CPC分类号： B24D11/00 ,  B24B7/228 ,  B24D2203/00

    摘要： A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.

    摘要翻译： 公开了一种用于制造用于化学机械抛光工艺的抛光制品的抛光制品和方法。 抛光制品具有由在抛光材料中或通过抛光材料形成的凹槽分开的多个抛光材料砖，并且可以粘合地结合到基膜上。 抛光制品可以包括在抛光材料中形成的各种多边形瓦片和椭圆形形状，其允许增强的浆料保持性并且容易地从研磨材料供给辊滚动到卷筒纸型压板组件中的卷取辊上。 抛光制品还可以包括适于最小化抛光制品的不适于抛光的区域中的分层应力的上载体薄膜。 还公开了用于制造抛光制品和替换供应辊的各种实施例的方法和装置。

    LEADER AND TRAILER FOR LINEAR POLISHING SHEET
    10.
    发明申请
    LEADER AND TRAILER FOR LINEAR POLISHING SHEET 审中-公开
    线性抛光片的领导者和追踪者

    公开(公告)号：US20090088051A1

    公开(公告)日：2009-04-02

    申请号：US12239572

    申请日：2008-09-26

    申请人： Gregory E. Menk ,  Peter McReynolds ,  Benjamin A. Bonner ,  Erik S. Rondum ,  Gopalakrishna B. Prabhu

    发明人： Gregory E. Menk ,  Peter McReynolds ,  Benjamin A. Bonner ,  Erik S. Rondum ,  Gopalakrishna B. Prabhu

    IPC分类号： B24B21/00

    CPC分类号： B24B37/042 ,  B24B21/004

    摘要： A polishing article includes an elongated substantially rectangular central portion and a substantially rectangular edge portion. The central portion includes a polishing layer with a polishing surface. The central portion has a width, a length greater than the width and defining a longitudinal axis, and an edge. The edge portion extends from the edge of the central portion, the edge portion is thinner than the central portion, and the polishing layer does not extend onto the edge portion.

    摘要翻译： 抛光制品包括细长的大致矩形的中心部分和大致矩形的边缘部分。 中心部分包​​括具有抛光表面的抛光层。 中心部分具有宽度，长度大于宽度并限定纵向轴线和边缘。 边缘部分从中心部分的边缘延伸，边缘部分比中心部分薄，并且抛光层不延伸到边缘部分上。