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    Semiconductor device cooling module
    2.
    发明授权
    Semiconductor device cooling module 有权
    半导体器件冷却模块

    公开(公告)号：US08693200B2

    公开(公告)日：2014-04-08

    申请号：US13368031

    申请日：2012-02-07

    申请人： Evan G. Colgan ,  Michael A. Gaynes ,  Jeffrey A. Zitz

    发明人： Evan G. Colgan ,  Michael A. Gaynes ,  Jeffrey A. Zitz

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A cooling module for cooling a semiconductor is provided and includes a land grid array (LGA) interposer, a substrate with an LGA side and a chip side, a cooler, a load frame attached to the substrate and formed to define an aperture in which the cooler is removably disposable, a spring clamp removably attachable to the load frame and configured to apply force from the load frame to the cooler such that the substrate and the cooler are urged together about the semiconductor and a load assembly device configured to urge the load frame and the LGA interposer together.

    摘要翻译： 提供了一种用于冷却半导体的冷却模块，其包括平台栅格阵列（LGA）插入器，具有LGA侧和芯片侧的衬底，冷却器，附接到衬底并形成以限定孔径的负载框架 冷却器可拆卸地是一次性的，弹簧夹可移除地附接到负载框架并且构造成将力从负载框架施加到冷却器，使得衬底和冷却器围绕半导体被一起被推动在一起;以及负载组件装置，其构造成推动负载框架 和LGA插入器在一起。

    ELECTRONIC ASSEMBLY WITH DETACHABLE COOLANT MANIFOLD AND COOLANT-COOLED ELECTRONIC MODULE
    3.
    发明申请
    ELECTRONIC ASSEMBLY WITH DETACHABLE COOLANT MANIFOLD AND COOLANT-COOLED ELECTRONIC MODULE 有权
    具有可拆卸冷却液歧管和冷却冷却电子模块的电子组件

    公开(公告)号：US20140078672A1

    公开(公告)日：2014-03-20

    申请号：US13616337

    申请日：2012-09-14

    申请人： Thomas J. BRUNSCHWILER ,  Evan G. COLGAN ,  Michael J. ELLSWORTH, JR. ,  Werner ESCHER ,  Ingmar G. MEIJER ,  Stephan PAREDES ,  Gerd SCHLOTTIG ,  Martin WITZIG ,  Jeffrey A. ZITZ

    发明人： Thomas J. BRUNSCHWILER ,  Evan G. COLGAN ,  Michael J. ELLSWORTH, JR. ,  Werner ESCHER ,  Ingmar G. MEIJER ,  Stephan PAREDES ,  Gerd SCHLOTTIG ,  Martin WITZIG ,  Jeffrey A. ZITZ

    IPC分类号： H05K7/20 ,  H05K13/00

    CPC分类号： H05K7/20772 ,  Y10T29/49002

    摘要： Cooled electronic assemblies, and a method of decoupling a cooled electronic assembly, are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic components and one or more coolant-carrying channels integrated within the module and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure, which includes a coolant inlet and outlet in fluid communication with the coolant-carrying channel(s) of the electronic module, facilitates flow of coolant through the coolant-carrying channel, and thus cooling of the electronic component(s). Coolant-absorbent material is positioned at the interface between the electronic module and the manifold structure to facilitate absorbing any excess coolant during a stepwise detaching of the manifold structure from the electronic module.

    摘要翻译： 提供了冷却的电子组件，以及一种解耦冷却的电子组件的方法。 在一个实施例中，组件包括冷却剂冷却的电子模块，其具有一个或多个电子部件和一个或多个集成在模块内的冷却剂传送通道并且被配置为便于冷却剂流过模块以冷却电子部件。 此外，组件包括可拆卸地联接到电子模块的冷却剂歧管结构。 歧管结构包括与电子模块的冷却剂输送通道流体连通的冷却剂入口和出口，有利于冷却剂流过冷却剂输送通道，从而冷却电子部件。 冷却剂吸收材料位于电子模块和歧管结构之间的界面处，以便于在将歧管结构从电子模块逐步拆卸时吸收任何多余的冷却剂。

    INTRA-CONDENSER CONTAMINANT EXTRACTOR FOR A VAPOR-COMPRESSION REFRIGERATION APPARATUS
    5.
    发明申请
    INTRA-CONDENSER CONTAMINANT EXTRACTOR FOR A VAPOR-COMPRESSION REFRIGERATION APPARATUS 失效
    用于蒸气压缩制冷装置的冷凝器污染物萃取器

    公开(公告)号：US20130091886A1

    公开(公告)日：2013-04-18

    申请号：US13271290

    申请日：2011-10-12

    申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Evan G. Colgan ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

    发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Evan G. Colgan ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

    IPC分类号： F25B43/00 ,  F25D31/00 ,  B23P15/26

    CPC分类号： F25B43/003 ,  F25B2400/01 ,  H05K7/20327 ,  H05K7/20809

    摘要： Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system. The vapor-compression refrigeration system includes an expansion component, an evaporator, a compressor, and a condenser coupled in fluid communication via a refrigerant flow path. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant extractor coupled in fluid communication with the refrigerant flow path. The extractor includes a refrigerant boiling filter and a heater. At least a portion of refrigerant passing through the refrigerant flow path passes through the refrigerant boiling filter, and the heater provides heat to the refrigerant boiling filter to boil refrigerant passing through the filter. By boiling refrigerant passing through the filter, contaminants are extracted from the refrigerant, and are deposited in the refrigerant boiling filter.

    摘要翻译： 提供了便于冷却电子部件的装置和方法。 该装置包括蒸气压缩制冷系统。 蒸汽压缩式制冷系统包括膨胀部件，蒸发器，压缩机以及通过制冷剂流动路径流体连通的冷凝器。 蒸发器与电子部件联接并冷却。 该装置还包括与制冷剂流动路径流体连通地联接的污染物提取器。 提取器包括制冷剂沸腾过滤器和加热器。 通过制冷剂流路的制冷剂的至少一部分通过制冷剂沸腾过滤器，并且加热器向制冷剂沸腾过滤器提供热量以沸腾通过过滤器的制冷剂。 通过沸腾通过过滤器的制冷剂，污染物从制冷剂中排出，并沉积在制冷剂沸腾过滤器中。

    Processes for enhanced 3D integration and structures generated using the same
    6.
    发明授权
    Processes for enhanced 3D integration and structures generated using the same 有权
    用于增强3D集成和使用该集成生成的结构的过程

    公开(公告)号：US08330262B2

    公开(公告)日：2012-12-11

    申请号：US12698529

    申请日：2010-02-02

    申请人： Evan G. Colgan ,  Sampath Purushothaman ,  Roy R. Yu

    发明人： Evan G. Colgan ,  Sampath Purushothaman ,  Roy R. Yu

    IPC分类号： H01L23/02

    CPC分类号： H01L23/49816 ,  B23P11/00 ,  H01L21/78 ,  H01L2924/0002 ,  H05K1/11 ,  H05K1/14 ,  H05K7/00 ,  Y10T29/49826 ,  H01L2924/00

    摘要： An enhanced 3D integration structure comprises a logic microprocessor chip bonded to a collection of vertically stacked memory slices and an optional set of outer vertical slices comprising optoelectronic devices. Such a device enables both high memory content in close proximity to the logic circuits and a high bandwidth for logic to memory communication. Additionally, the provision of optoelectronic devices in the outer slices of the vertical slice stack enables high bandwidth direct communication between logic processor chips on adjacent enhanced 3D modules mounted next to each other or on adjacent packaging substrates. A method to fabricate such structures comprises using a template assembly which enables wafer format processing of vertical slice stacks.

    摘要翻译： 增强的3D集成结构包括结合到垂直堆叠的存储器片的集合的逻辑微处理器芯片和包括光电子器件的可选的一组外部垂直片。 这样一种装置使得能够靠近逻辑电路的高存储器内容和用于逻辑到存储器通信的高带宽。 此外，在垂直切片堆叠的外切片中提供光电子器件可实现彼此相邻或相邻封装衬底上安装的相邻增强3D模块之间的逻辑处理器芯片之间的高带宽直接通信。 制造这种结构的方法包括使用能够对垂直切片堆叠进行晶片格式处理的模板组件。

    Processes for Enhanced 3D Integration and Structures Generated Using the Same
    8.
    发明申请
    Processes for Enhanced 3D Integration and Structures Generated Using the Same 有权
    用于增强3D集成和使用其生成的结构的过程

    公开(公告)号：US20110188209A1

    公开(公告)日：2011-08-04

    申请号：US12698529

    申请日：2010-02-02

    申请人： Evan G. Colgan ,  Sampath Purushothaman ,  Roy R. Yu

    发明人： Evan G. Colgan ,  Sampath Purushothaman ,  Roy R. Yu

    IPC分类号： H05K7/00 ,  H05K1/14 ,  H05K1/11 ,  B23P11/00

    CPC分类号： H01L23/49816 ,  B23P11/00 ,  H01L21/78 ,  H01L2924/0002 ,  H05K1/11 ,  H05K1/14 ,  H05K7/00 ,  Y10T29/49826 ,  H01L2924/00

    摘要： An enhanced 3D integration structure comprises a logic microprocessor chip bonded to a collection of vertically stacked memory slices and an optional set of outer vertical slices comprising optoelectronic devices. Such a device enables both high memory content in close proximity to the logic circuits and a high bandwidth for logic to memory communication. Additionally, the provision of optoelectronic devices in the outer slices of the vertical slice stack enables high bandwidth direct communication between logic processor chips on adjacent enhanced 3D modules mounted next to each other or on adjacent packaging substrates. A method to fabricate such structures comprises using a template assembly which enables wafer format processing of vertical slice stacks.

    摘要翻译： 增强的3D集成结构包括结合到垂直堆叠的存储器片的集合的逻辑微处理器芯片和包括光电子器件的可选的一组外部垂直片。 这样一种装置使得能够靠近逻辑电路的高存储器内容和用于逻辑到存储器通信的高带宽。 此外，在垂直切片堆叠的外切片中提供光电子器件可实现彼此相邻或相邻封装衬底上安装的相邻增强型3D模块之间的逻辑处理器芯片之间的高带宽直接通信。 制造这种结构的方法包括使用能够对垂直切片堆叠进行晶片格式处理的模板组件。