公开(公告)号：US08823012B2

公开(公告)日：2014-09-02

申请号：US13403400

申请日：2012-02-23

申请人： Alexander Lidow ,  Robert Beach ,  Alana Nakata ,  Jianjun Cao ,  Guang Yuan Zhao ,  Robert Strittmatter ,  Fang Chang Liu

发明人： Alexander Lidow ,  Robert Beach ,  Alana Nakata ,  Jianjun Cao ,  Guang Yuan Zhao ,  Robert Strittmatter ,  Fang Chang Liu

IPC分类号： H01L21/48 ,  H01L21/02 ,  H01L29/20 ,  H01L33/00

CPC分类号： H01L21/0254 ,  H01L29/1066 ,  H01L29/2003 ,  H01L29/402 ,  H01L29/66462 ,  H01L29/7786 ,  H01L33/007

摘要： Enhancement-mode GaN devices having a gate spacer, a gate metal material and a gate compound that are self-aligned, and a methods of forming the same. The materials are patterned and etched using a single photo mask, which reduces manufacturing costs. An interface of the gate spacer and the gate compound has lower leakage than the interface of a dielectric film and the gate compound, thereby reducing gate leakage. In addition, an ohmic contact metal layer is used as a field plate to relieve the electric field at a doped III-V gate compound corner towards the drain contact, which leads to lower gate leakage current and improved gate reliability.

摘要翻译： 具有栅极间隔物，栅极金属材料和自对准的栅极化合物的增强型GaN器件及其形成方法。 使用单个光掩模对材料进行图案化和蚀刻，这降低了制造成本。 栅极间隔物和栅极化合物的界面比电介质膜和栅极化合物的界面具有更低的泄漏，从而减少栅极泄漏。 此外，使用欧姆接触金属层作为场板，以减轻掺杂III-V栅极化合物角向漏极接触的电场，这导致较低的栅极漏电流和改善的栅极可靠性。

公开(公告)号：US20090186449A1

公开(公告)日：2009-07-23

申请号：US12412479

申请日：2009-03-27

申请人： Kai-Chih WANG ,  Fang-Chang Liu

发明人： Kai-Chih WANG ,  Fang-Chang Liu

IPC分类号： H01L21/78

CPC分类号： H01L27/14618 ,  H01L2224/02371 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/10 ,  H01L2924/00014

摘要： A package structure for an optoelectronic device. The package structure comprises a device chip reversely disposed on a first substrate, which comprises a second substrate and a first dielectric layer between the first and second substrates. The first dielectric layer comprises a pad formed in a corner of the first dielectric layer non-overlapping the second substrate, such that the surface and sidewall of the pad are exposed. A metal layer is formed directly on the exposed surface of the pad and covers the second substrate. A protective layer covers the metal layer, having an opening to expose a portion of the metal layer on the second substrate. A solder ball is disposed in the opening, electrically connecting to the metal layer. The invention also discloses a method for fabricating the same.

摘要翻译： 光电器件的封装结构。 封装结构包括反向设置在第一衬底上的器件芯片，其包括第二衬底和第一和第二衬底之间的第一电介质层。 第一电介质层包括形成在第一电介质层的与第二衬底不重叠的角部中的焊盘，使得焊盘的表面和侧壁暴露。 金属层直接形成在焊盘的暴露表面上并覆盖第二基板。 保护层覆盖金属层，其具有用于暴露第二基板上的金属层的一部分的开口。 焊球设置在开口中，电连接到金属层。 本发明还公开了一种制造该方法的方法。

公开(公告)号：US20070092375A1

公开(公告)日：2007-04-26

申请号：US11254969

申请日：2005-10-21

申请人： Fang-Chang Liu

发明人： Fang-Chang Liu

IPC分类号： F04D25/08

CPC分类号： F04D25/08 ,  F04D29/601 ,  F04D29/705

摘要： The circumferential air conditioning fan includes a housing, centrifugal fan, and a drive motor. The housing has a containing space, and one end of the containing space has an air inlet, and the side of the containing space has a circumferential air outlet. A centrifugal fan is placed in the containing space that can be driven by drive motor, and the centrifugal fan has rotary diversion component. The first end is corresponding with the air inlet, and the second end is corresponding with the circumferential air outlet. A centrifugal fan is placed in the containing space that circulates airflow in the directions of circumferential air outlet. The circumferential air conditioning fan disclosed in the present invention can receive circumferential airflow in the circular direction, and further improve the quality of air and degree of comfort.

摘要翻译： 圆周空调风扇包括壳体，离心风扇和驱动电动机。 壳体具有容纳空间，容纳空间的一端具有空气入口，容纳空间的一侧具有周向空气出口。 离心风机放置在可由驱动电机驱动的容纳空间中，离心风机具有旋转分流部件。 第一端与空气入口相对应，第二端与周向空气出口对应。 将离心式风扇放置在沿周向空气出口的方向使气流循环的容纳空间中。 本发明公开的圆周空调风扇可以在圆周方向上容纳圆周气流，进一步提高空气质量和舒适度。

公开(公告)号：US08361898B2

公开(公告)日：2013-01-29

申请号：US12695792

申请日：2010-01-28

申请人： Kai-Chih Wang ,  Fang-Chang Liu

发明人： Kai-Chih Wang ,  Fang-Chang Liu

IPC分类号： H01L21/44

CPC分类号： H01L24/05 ,  H01L24/03 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05093 ,  H01L2224/05096 ,  H01L2224/05556 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/48463 ,  H01L2224/85375 ,  H01L2224/8585 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19043 ,  Y10T29/49224 ,  H01L2224/05552 ,  H01L2224/45099

摘要： A bonding pad structure for an optoelectronic device. The bonding pad structure includes a carrier substrate having a bonding pad region and an optoelectronic device region. An insulating layer is disposed on the carrier substrate, having an opening corresponding to the bonding pad region. A bonding pad is embedded in the insulating layer under the opening to expose the top surface thereof. A device substrate is disposed on the insulating layer corresponding to the optoelectronic device region. A cap layer covers the device substrate and the insulating layer excluding the opening. A conductive buffer layer is disposed in the opening to directly contact the bonding pad. The invention also discloses a method for fabricating the same.

摘要翻译： 一种用于光电子器件的焊盘结构。 焊盘结构包括具有焊盘区域和光电子器件区域的载体衬底。 绝缘层设置在载体基板上，具有对应于焊盘区域的开口。 接合焊盘嵌入在开口下方的绝缘层中以暴露其顶表面。 器件衬底设置在对应于光电子器件区域的绝缘层上。 盖层覆盖器件基板和除了开口之外的绝缘层。 导电缓冲层设置在开口中以直接接触焊盘。 本发明还公开了一种制造该方法的方法。

公开(公告)号：US20120175631A1

公开(公告)日：2012-07-12

申请号：US13403400

申请日：2012-02-23

申请人： Alexander Lidow ,  Robert Beach ,  Alana Nakata ,  Jianjun Cao ,  Guang Yuan Zhao ,  Robert Strittmatter ,  Fang Chang Liu

发明人： Alexander Lidow ,  Robert Beach ,  Alana Nakata ,  Jianjun Cao ,  Guang Yuan Zhao ,  Robert Strittmatter ,  Fang Chang Liu

IPC分类号： H01L29/778 ,  H01L21/335 ,  H01L29/205

CPC分类号： H01L21/0254 ,  H01L29/1066 ,  H01L29/2003 ,  H01L29/402 ,  H01L29/66462 ,  H01L29/7786 ,  H01L33/007

摘要： Enhancement-mode GaN devices having a gate spacer, a gate metal material and a gate compound that are self-aligned, and a methods of forming the same. The materials are patterned and etched using a single photo mask, which reduces manufacturing costs. An interface of the gate spacer and the gate compound has lower leakage than the interface of a dielectric film and the gate compound, thereby reducing gate leakage. In addition, an ohmic contact metal layer is used as a field plate to relieve the electric field at a doped III-V gate compound corner towards the drain contact, which leads to lower gate leakage current and improved gate reliability.

摘要翻译： 具有栅极间隔物，栅极金属材料和自对准的栅极化合物的增强型GaN器件及其形成方法。 使用单个光掩模对材料进行图案化和蚀刻，这降低了制造成本。 栅极间隔物和栅极化合物的界面比电介质膜和栅极化合物的界面具有更低的泄漏，从而减少栅极泄漏。 此外，使用欧姆接触金属层作为场板，以减轻掺杂III-V栅极化合物角向漏极接触的电场，这导致较低的栅极漏电流和改善的栅极可靠性。

公开(公告)号：US20090026562A1

公开(公告)日：2009-01-29

申请号：US11878762

申请日：2007-07-26

申请人： Kai-Chih Wang ,  Fang-Chang Liu ,  I-Pang Chou

发明人： Kai-Chih Wang ,  Fang-Chang Liu ,  I-Pang Chou

IPC分类号： H01L31/00

CPC分类号： H01L27/14636 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

摘要： A package structure for an optoelectronic device. The package structure comprises a device chip interposed between a lower transparent substrate and an upper transparent substrate. The device chip comprises a semiconductor substrate comprising a device region surrounded by a pad region, in which the pad region comprises a plurality of notches along the edges of the semiconductor substrate. A dielectric layer is between the semiconductor substrate and the upper transparent substrate, comprising a plurality of pads formed therein and substantially aligned with the plurality of notches, respectively. A plurality of metal lines is disposed under a bottom surface of the lower transparent substrate. A plurality of solder balls disposed under the plurality of metal lines, respectively.

摘要翻译： 光电器件的封装结构。 封装结构包括插入在下透明基板和上透明基板之间的器件芯片。 器件芯片包括半导体衬底，该半导体衬底包括由焊盘区域围绕的器件区域，其中焊盘区域包括沿着半导体衬底的边缘的多个凹口。 电介质层位于半导体衬底和上部透明衬底之间，包括分别形成在其中并与多个凹口基本对准的多个焊盘。 多个金属线设置在下透明基板的底表面下方。 分别设置在多个金属线下方的多个焊球。

公开(公告)号：US20080169477A1

公开(公告)日：2008-07-17

申请号：US11652084

申请日：2007-01-11

申请人： Kai-Chih Wang ,  Fang-Chang Liu

发明人： Kai-Chih Wang ,  Fang-Chang Liu

IPC分类号： H01L27/15 ,  H01L21/44

CPC分类号： H01L27/14618 ,  H01L2224/02371 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/10 ,  H01L2924/00014

摘要： A package structure for an optoelectronic device. The package structure comprises a device chip reversely disposed on a first substrate, which comprises a second substrate and a first dielectric layer between the first and second substrates. The first dielectric layer comprises a pad formed in a corner of the first dielectric layer non-overlapping the second substrate, such that the surface and sidewall of the pad are exposed. A metal layer is formed directly on the exposed surface of the pad and covers the second substrate. A protective layer covers the metal layer, having an opening to expose a portion of the metal layer on the second substrate. A solder ball is disposed in the opening, electrically connecting to the metal layer. The invention also discloses a method for fabricating the same.

摘要翻译： 光电器件的封装结构。 封装结构包括反向设置在第一衬底上的器件芯片，其包括第二衬底和第一和第二衬底之间的第一电介质层。 第一电介质层包括形成在第一电介质层的与第二衬底不重叠的角部中的焊盘，使得焊盘的表面和侧壁暴露。 金属层直接形成在焊盘的暴露表面上并覆盖第二基板。 保护层覆盖金属层，具有用于暴露第二基板上的金属层的一部分的开口。 焊球设置在开口中，电连接到金属层。 本发明还公开了一种制造该方法的方法。

公开(公告)号：US20080164553A1

公开(公告)日：2008-07-10

申请号：US11649242

申请日：2007-01-04

申请人： Tzu-Han Lin ,  Tzy-Ying Lin ,  Fang-Chang Liu ,  Kai-Chih Wang

发明人： Tzu-Han Lin ,  Tzy-Ying Lin ,  Fang-Chang Liu ,  Kai-Chih Wang

IPC分类号： H01L31/0203 ,  H01L31/18

CPC分类号： H01L27/14618 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2924/01078 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00

摘要： Isolation structure for CMOS image sensor device chip scale packages and fabrication methods thereof. A CMOS image sensor chip scale package includes a transparent substrate configured as a support structure for the package. The transparent substrate includes a first cutting edge and a second cutting edge. A CMOS image sensor die with a die circuitry is mounted on the transparent substrate. An encapsulant is disposed on the substrate encapsulating the CMOS image sensor die. A connection extends from the die circuitry to a plurality of terminal contacts for the package on the encapsulant, wherein the connection is exposed by the first cutting edge. An isolation structure is disposed on the first cutting edge passivating the exposed connection and co-planed with the second cutting edge.

摘要翻译： CMOS图像传感器芯片级封装的隔离结构及其制造方法。 CMOS图像传感器芯片级封装包括被配置为用于封装的支撑结构的透明衬底。 透明基板包括第一切削刃和第二切削刃。 具有裸片电路的CMOS图像传感器芯片安装在透明基板上。 密封剂设置在封装有CMOS图像传感器芯片的基板上。 连接从管芯电路延伸到密封剂上的封装的多个端子触头，其中连接由第一切削刃暴露。 隔离结构设置在第一切削刃上，钝化暴露的连接并与第二切削刃共同设计。

公开(公告)号：US20060289733A1

公开(公告)日：2006-12-28

申请号：US11226223

申请日：2005-09-15

申请人： Peter Zung ,  Tzu-Han Lin ,  Fang-Chang Liu

发明人： Peter Zung ,  Tzu-Han Lin ,  Fang-Chang Liu

IPC分类号： H01J5/02

CPC分类号： H01L27/14618 ,  H01L24/20 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/73267

摘要： An image sensor module includes an image-sensing unit having a first surface, a second surface and a plurality of first conductive contacts arranged at the second surface, a signal processing unit mounted on the first surface of the image-sensing unit and provided with a plurality of second conductive contacts respectively electrically connected to the first conductive contacts of the image-sensing unit, a plurality of solder balls respectively electrically connected to the second conductive contacts of the signal processing unit for mounting in an external circuit board, and a lens set mounted on the second surface of the image-sensing unit and covering the first conductive contacts of the image-sensing unit.

摘要翻译： 图像传感器模块包括具有第一表面，第二表面和布置在第二表面处的多个第一导电触点的图像感测单元，信号处理单元安装在图像感测单元的第一表面上并且具有 分别电连接到图像感测单元的第一导电触点的多个第二导电触点，分别电连接到信号处理单元的第二导电触点的多个焊球，用于安装在外部电路板中，以及透镜组 安装在图像感测单元的第二表面上并且覆盖图像感测单元的第一导电触点。

公开(公告)号：US20110291132A1

公开(公告)日：2011-12-01

申请号：US12790496

申请日：2010-05-28

申请人： Fang-Chang LIU ,  Kuan-Ping Lee

发明人： Fang-Chang LIU ,  Kuan-Ping Lee

IPC分类号： H01L33/50

CPC分类号： H01L33/50 ,  H01L33/44 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light-emitting device (LED) is disclosed. The LED includes a carrier substrate having a blue light emitter thereon. A layer containing a fluorescent material is on the blue light emitter. An encapsulant is disposed around the blue light emitter. Pigments are suspended between an outer surface of the encapsulant and the blue light emitter.

摘要翻译： 公开了一种发光器件（LED）。 LED包括其上具有蓝光发射器的载体衬底。 含有荧光材料的层在蓝光发射器上。 密封剂设置在蓝光发射器周围。 颜料悬浮在密封剂的外表面和蓝光发射体之间。