摘要:
Methods for fabrication of leading edge shields and tapered magnetic poles with a tapered leading edge are provided. The leading edge shield may be formed by utilizing a CMP stop layer. The CMP stop layer may aid in preventing over polishing of the magnetic material. For the tapered magnetic poles with a tapered leading edge, a magnetic material is deposited on a planarized surface, a patterned resist material is formed, and exposed magnetic material is etched to form at least one tapered surface of the magnetic material.
摘要:
A method for manufacturing a magnetic write head having a leading magnetic shield and a trailing magnetic shield that are arranged to prevent the lost of magnetic write field to the trailing magnetic shield. The write head includes a non-magnetic step layer that provides additional spacing between the trailing magnetic shield and the write pole at a region removed from the air bearing surface.
摘要:
A perpendicular magnetic recording (PMR) head has a pole tip shielded laterally by a separated pair of bottom side shields and shielded from above by an upper shield. The bottom side shields surround a lower portion of the pole tip while the upper portion of the pole tip is surrounded by non-magnetic layers. The bottom shields and the non-magnetic layer form a wedge-shaped trench in which the pole tip has been formed by a self-aligned plating process. A write gap layer and an upper shield is formed above the side shields and pole. The resulting structure substantially eliminates track overwrite while maintaining good track definition.
摘要:
A perpendicular magnetic recording (PMR) head has a pole tip shielded laterally by a separated pair of bottom side shields and shielded from above by an upper shield. The bottom side shields surround a lower portion of the pole tip while the upper portion of the pole tip is surrounded by non-magnetic layers. The bottom shields and the non-magnetic layer form a wedge-shaped trench in which the pole tip has been formed by a self-aligned plating process. A write gap layer and an upper shield is formed above the side shields and pole. The resulting structure substantially eliminates track overwrite while maintaining good track definition.
摘要:
A perpendicular magnetic recording (PMR) head is fabricated with a pole tip shielded laterally by a separated pair of bottom side shields and shielded from above by an upper shield. The bottom side shields surround a lower portion of the pole tip while the upper portion of the pole tip is surrounded by non-magnetic layers. The bottom shields and the non-magnetic layer form wedge-shaped trench in which the pole tip is formed by a self-aligned plating process. The wedge shape is formed by a RIE process using specific gases applied through a masking layer formed of material that has a slower etch rate than the non-magnetic material or the shield material. A masking layer of Ta, Ru/Ta, TaN or Ti, formed on a non-magnetic layer of alumina that is formed on a shield layer of NiFe and using RIE gases of CH3OH, CO or NH3 or their combinations, produces the desired result. A write gap layer and an upper shield is then formed above the side shields and pole. The resulting structure substantially eliminates track overwrite while maintaining good track definition.
摘要:
A method for manufacturing a magnetic write head having a leading magnetic shield and a trailing magnetic shield that are arranged to prevent the lost of magnetic write field to the trailing magnetic shield. The write head includes a non-magnetic step layer that provides additional spacing between the trailing magnetic shield and the write pole at a region removed from the air bearing surface.
摘要:
A process for forming the write pole of a PMR head is described. This write pole is symmetrically located relative to its side shields, This is accomplished, not through optical alignment, but by coating the pole with a uniform layer of non-magnetic material of a predetermined and precise thickness, followed by the formation of the shield layer around this.
摘要:
A perpendicular magnetic recording (PMR) head is fabricated with a pole tip shielded laterally by a separated pair of side shields and shielded from above by an upper shield. The side shields are formed by a RIE process using specific gases applied to a shield layer through a masking layer formed of material that has a slower etch rate than the shield material. A masking layer of Ta, Ru/Ta, TaN or Ti, formed on a shield layer of NiFe and using RIE gases of CH3OH, CO or NH3 or their combinations, produces the desired result. The differential in etch rates maintains the opening dimension within the mask and allows the formation of a wedge-shaped trench within the shield layer that separates the layer into two shields. The pole tip is then plated within the trench and, being aligned by the trench, acquires the wedge-shaped cross-section of the trench. An upper shield is then formed above the side shields and pole.
摘要:
A method for forming a trimmed upper pole piece for a magnetic write head, said pole piece having a uniform width above and below a write gap layer. Prior art methods of trimming pole pieces to a final width using ion-beam etches produce pole pieces with thickness differentials due to the etch resistant nature of the alumina write-gap filling material. The present method uses NiCr, NiFeCr or Ru as write gap filling materials which have an etch rate which is substantially equal to the etch rate of the other layers forming the pole piece and are highly corrosion resistant.
摘要:
The present disclosure describes a method for manufacturing a full wraparound shield damascene write head through the implementation of a three layered (tri-layered) hard mask. According to an embodiment of the invention, the various layers of hard mask are used for different purposes during the formation of a write head. The wraparound shield head of the present invention exhibits improved physical characteristics that further result in improved performance characteristics. Use of the hard mask layers according to the present invention allows for use of manufacturing processes that can be more closely controlled than those processes used in other processes. For example, smaller dimension lithographic techniques can be used. Also, reliance on certain CMP processes is not necessary where the use of CMP processes is not as well-controlled as deposition or lithographic techniques as is possible using the present invention.