摘要:
Deflection measuring apparatus and methods are used to prevent overstress of printed circuit boards (PCB) prior and during testing. They can be used to verify in a HALT, HASS of ESS testing protocol, if the PCB testing fixture and vibration testing setup would be likely to cause failure of PCB components during pre- testing and testing procedures, which failure would otherwise not occur with faultless components. Furthermore, In the context of a PCB to be integrated to a system as a product such as a computer, the deflection measuring apparatus and methods are used to prevent overstress of PCBs at the system assembly stage, to ensure that operations involved, such as plugging of PCB connectors, will not cause PCB components failure, which would otherwise not occur with faultless components.