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公开(公告)号：US20190203816A1
公开(公告)日：2019-07-04
申请号：US16331526
申请日：2017-06-27
申请人： Jiangbiao FU , Fulin LIU , Bijian CHEN
发明人： Jiangbiao FU , Fulin LIU , Bijian CHEN
CPC分类号： F16H37/021 , B62D11/02 , B62D11/12 , F16H48/06 , F16H48/20 , F16H2047/045 , F16H2700/02
摘要： A continuously variable transmission steering mechanism of a tracked vehicle, comprising a differential (1), a right drive shaft (2), a left drive shaft (3), and a continuously variable transmission (4) used for adjusting the rotational speed of the right drive shaft (2) and that of the left drive shaft (3). A left half shaft (5) and a right half shaft (6) are connected on the differential (1). The right half shaft (6) of the differential (1) is linked to the right drive shaft (2). The right drive shaft (2) rotates to drive the right half shaft (6) of the differential (1) to rotate. The left half shaft (5) of the differential (1) is linked to the left drive shaft (3). The left drive shaft (3) rotates to drive the left half shaft (5) of the differential (1) to rotate. The rotational speed ratio of the right half shaft (6) of the differential (1) to the right drive shaft (2) is equal to the rotational speed ratio of the left half shaft (5) of the differential (1) to the left drive shaft (6). The employment of the continuously variable transmission steering mechanism of the tracked vehicle, by means of continuously and precisely adjusting the rotational speeds of the left and right half shafts of the differential via the continuously variable transmission (4), implements precise turning of tracks, thus increasing the safety of the tracked vehicle traveling at a high speed.
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公开(公告)号：US07692440B2
公开(公告)日：2010-04-06
申请号：US10533236
申请日：2003-08-29
申请人： Jimmy Hwee Seng Chew , Kok Yeow Lim , Fulin Liu
发明人： Jimmy Hwee Seng Chew , Kok Yeow Lim , Fulin Liu
摘要： A water jet handler (200) has a loading location (205), a cutting location (210), and an unloading location (215); and two movable mounts (240 and a 245). As a first movable mount (240) receives a molded substrate at the loading location (205), and transports it to the cutting location (210), a second movable mount (245) transports singulated semiconductor packages of a previously singulated molded substrate from the cutting location (210) to the unloading location (215). As the molded substrate on the first movable mount (240) is cut in the X direction (232) by a water jet, the singulated semiconductor packages are unloaded. The molded substrate is then transferred to the second movable mount (245) on which it is cut in the Y direction (272) to produce singulated semiconductor packages, as the first movable mount (240) returns to the loading location (205), when another molded substrate is loaded.
摘要翻译： 喷水处理器（200）具有装载位置（205），切割位置（210）和卸载位置（215）; 和两个可移动的安装件（240和245）。 作为第一可移动安装座（240）在装载位置（205）处接收模制基板，并将其传送到切割位置（210），第二可移动安装件（245）将先前分割成型的基板的单个半导体封装从 切割位置（210）到卸载位置（215）。 当第一可移动支架（240）上的模制基板通过水射流在X方向（232）上被切割时，单片半导体封装被卸载。 然后，随着第一可移动支架（240）返回到装载位置（205），模制基板被转移到在Y方向（272）上被切割的第二可移动支架（245）以产生单个半导体封装，当 另外一个模塑基底被加载。
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公开(公告)号：US20060094339A1
公开(公告)日：2006-05-04
申请号：US10533236
申请日：2003-08-29
申请人： Jimmy Hwee Chew , Kok Yeow Lim , Fulin Liu
发明人： Jimmy Hwee Chew , Kok Yeow Lim , Fulin Liu
摘要： A water jet handler (200) has a loading location (205), a cutting location (210), and an unloading location (215); and two movable mounts (240 and a 245). As a first movable mount (240) receives a molded substrate at the loading location (205), and transport it to the cutting location (210), a second movable mount (245) transports singulated semiconductor packages of a previously singulated molded substrate from the cutting location (210) to the unloading location (215). As the molded substrate on the first movable mount (240) is cut in the X direction (232) by a water jet, the singulated semiconductor packages are unloaded. The molded substrate is then transferred to the second movable mount (245) on which it is cut in the Y direction (272) to produce singulated semiconductor packages, as the first movable mount (240) returns to the loading location (205), when another molded substrate is loaded.
摘要翻译： 喷水处理器（200）具有装载位置（205），切割位置（210）和卸载位置（215）; 和两个可移动的安装件（240和245）。 作为第一可移动安装座（240）在装载位置（205）处接收模制基板，并将其传送到切割位置（210），第二可移动安装件（245）将先前分割成型的基板的单个半导体封装从 切割位置（210）到卸载位置（215）。 当第一可移动支架（240）上的模制基板通过水射流在X方向（232）上被切割时，单片半导体封装被卸载。 然后，随着第一可移动支架（240）返回到装载位置（205），模制基板被转移到在Y方向（272）上被切割的第二可移动支架（245）以产生单个半导体封装，当 另外一个模塑基底被加载。
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