摘要:
A feature in a layer is provided. A photoresist layer is formed over the layer. The photoresist layer is patterned to form photoresist features with photoresist sidewalls, where the photoresist features have a first critical dimension. A conformal layer is deposited over the sidewalls of the photoresist features to reduce the critical dimensions of the photoresist features. Features are etched into the layer, wherein the layer features have a second critical dimension, which is less than the first critical dimension.
摘要:
A laminating roller assembly comprises a frame, a movable support supported by the frame, a laminating roller and a lift mechanism. The laminating roller is attached to the movable support. The lift mechanism is attached to the frame and is configured to move the movable support and the attached laminating roller relative to the frame. Additional embodiments of the invention are directed to a credential substrate laminator and a method of laminating a credential substrate using a credential substrate laminator.
摘要:
A laminating roller assembly comprises a frame, a movable support supported by the frame, a laminating roller and a lift mechanism. The laminating roller is attached to the movable support. The lift mechanism is attached to the frame and is configured to move the movable support and the attached laminating roller relative to the frame. Additional embodiments of the invention are directed to a credential substrate laminator and a method of laminating a credential substrate using a credential substrate laminator.
摘要:
A feature in a layer is provided. A photoresist layer is formed over the layer. The photoresist layer is patterned to form photoresist features with photoresist sidewalls, where the photoresist features have a first critical dimension. A conformal layer is deposited over the sidewalls of the photoresist features to reduce the critical dimensions of the photoresist features. Features are etched into the layer, wherein the layer features have a second critical dimension, which is less than the first critical dimension.