公开(公告)号：US07429537B2

公开(公告)日：2008-09-30

申请号：US11292823

申请日：2005-12-02

申请人： Brian K. Aegerter ,  Curt T. Dundas ,  Tom L. Ritzdorf ,  Gary L. Curtis ,  Michael Jolley

发明人： Brian K. Aegerter ,  Curt T. Dundas ,  Tom L. Ritzdorf ,  Gary L. Curtis ,  Michael Jolley

IPC分类号： H01L21/302

CPC分类号： H01L21/67051 ,  B08B3/02 ,  H01L21/67028

摘要： A method for rinsing and drying a workpiece includes placing the workpiece into a chamber and spinning the workpiece. A rinsing fluid, such as water, is applied onto the workpiece through a first outlet in the chamber, with the rinsing fluid moving outwardly towards the edge of the workpiece via centrifugal force, to rinse the workpiece. A drying fluid, such as an alcohol vapor, is applied onto the workpiece through the first outlet, with the drying fluid moving outwardly towards the edge of the workpiece via centrifugal force, to dry the workpiece. The drying fluid advantageously follows a meniscus of the rinsing fluid across the workpiece surface. The rinsing fluid, or the drying fluid, or both fluids, may be applied near or at a central area of the workpiece.

摘要翻译： 用于冲洗和干燥工件的方法包括将工件放置在室中并旋转工件。 冲洗流体例如水通过腔室中的第一出口施加到工件上，漂洗流体通过离心力向外移动到工件的边缘，以冲洗工件。 干燥流体，例如醇蒸汽，通过第一出口施加到工件上，干燥流体通过离心力向外移动到工件的边缘，以干燥工件。 干燥流体有利地沿着穿过工件表面的冲洗流体的弯液面。 冲洗流体或干燥流体或两种流体可以施加在工件的中心区域附近或其附近。

公开(公告)号：US06843944B2

公开(公告)日：2005-01-18

申请号：US10002560

申请日：2001-11-01

申请人： Randy S. Bay ,  Cristina U. Thomas ,  David F. Slama ,  Richard T. Paxton ,  Gary L. Curtis ,  Jonathan J. Mattson

发明人： Randy S. Bay ,  Cristina U. Thomas ,  David F. Slama ,  Richard T. Paxton ,  Gary L. Curtis ,  Jonathan J. Mattson

IPC分类号： A44B18/00 ,  B24D11/02 ,  B29C67/00 ,  B29C47/92

CPC分类号： B24D11/02 ,  A44B18/0049 ,  B29C67/0044 ,  B29L2031/729 ,  B65H37/00 ,  B65H2301/511 ,  B65H2301/512

摘要： A method for capping a stem web including passing the stem web through a first nip against a first heated nip roll so as to partially cap the stems; cooling the web; and passing the stem web through a second nip against a second heated nip roll to completely cap the stems to a diameter “D”. In preferred embodiments the two nips are on opposite sides of a larger central cooled roll positioned between the heated rolls. Preferably, the reaction forces between the rolls are measured and controlled at each end of each other heated rolls. The invention is particularly adapted to making abrasive particles that are attached to a driving mechanism via headed stem fasteners formed by the method.

摘要翻译： 一种用于封盖杆腹板的方法，包括使所述杆腹板通过第一辊隙抵靠第一加热夹辊，以便部分地盖住所述杆; 冷却网; 并且使所述杆腹板通过第二压合部抵靠第二加热辊隙辊将所述杆部完全盖住直径“D”。 在优选的实施例中，两个辊隙位于位于加热辊之间的较大中心冷却辊的相对侧上。 优选地，在每个其他加热辊的每个端部处测量和控制辊之间的反作用力。 本发明特别适用于通过由该方法形成的头部杆紧固件制造附着于驱动机构的磨料颗粒。

公开(公告)号：US06799932B2

公开(公告)日：2004-10-05

申请号：US10457944

申请日：2003-06-09

申请人： Jeffry A. Davis ,  Kert L. Dolechek ,  Gary L. Curtis

发明人： Jeffry A. Davis ,  Kert L. Dolechek ,  Gary L. Curtis

IPC分类号： B65G49107

CPC分类号： H01L21/67754 ,  H01L21/67173 ,  H01L21/6732 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  H01L21/68707 ,  Y10S414/135 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

摘要： A processor for processing articles, such as semiconductor wafers, in a substantially clean atmosphere is set forth. The processor includes an enclosure defining a substantially enclosed clean processing chamber and at least one processing station disposed in the processing chamber. An interface section is disposed adjacent an interface end of the enclosure. The interface section includes at least one interface port through which a pod containing articles for processing are loaded or unloaded to or from the processor. The interface section is hygienically separated from the processing chamber since the interface section is generally not as clean as the highly hygienic processing chamber. An article extraction mechanism adapted to seal with the pod is employed. The mechanism is disposed to allow extraction of the articles contained within the pod into the processing chamber without exposing the articles to ambient atmospheric conditions in the interface section. The article processor also preferably includes an article insertion mechanism that is adapted to seal with a pod disposed in the interface section. The article insertion mechanism is disposed to allow insertion of the articles into the pod after processing by the at least one processing station. The article insertion mechanism allows the insertion of the articles without exposing the articles to ambient atmospheric conditions in the interface section.

摘要翻译： 阐述了一种用于在基本上清洁的气氛中处理诸如半导体晶片的制品的处理器。 处理器包括限定基本封闭的清洁处理室的外壳和设置在处理室中的至少一个处理站。 接口部分设置在外壳的接口端附近。 接口部分包括至少一个接口端口，通过该至少一个接口端口将包含用于处理的物品的容器装载或者从处理器卸载。 接口部分与处理室卫生地分开，因为界面部分通常不像高度卫生的处理室那么干净。 采用适于与荚密封的物品提取机构。 该机构被设置为允许将容纳在容器内的物品提取到处理室中，而不会使物品暴露于接口部分中的环境大气条件。 物品处理器还优选地包括物品插入机构，其适于与设置在界面部分中的容器密封。 物品插入机构设置成允许在由至少一个处理站处理之后将物品插入容器中。 物品插入机构允许物品的插入，而不会使物品暴露在界面部分中的环境大气条件下。

公开(公告)号：US06715971B2

公开(公告)日：2004-04-06

申请号：US10118678

申请日：2002-04-09

申请人： Gary L. Curtis

发明人： Gary L. Curtis

IPC分类号： B23Q1110

CPC分类号： B23Q11/1084 ,  B23H1/10 ,  B23Q11/1076 ,  Y10T408/458 ,  Y10T408/46 ,  Y10T409/303752 ,  Y10T409/303808 ,  Y10T409/303976 ,  Y10T409/304032 ,  Y10T409/304088

摘要： A method and apparatus for directing a coolant stream onto a cutting tool is made up of a nozzle pivotally mounted on a machine tool, the nozzle being automatically adjusted in response to movement of the machine tool via a retractable plunger or other linear drive member so as to cause the coolant stream to intersect the interface between a workpiece and each cutting tool that is brought into cutting position on the machine tool; and the nozzle is pivotal between a reference position and a different intermediate position corresponding to the length or diameter of the cutting tool which is advanced into cutting position.

摘要翻译： 用于将冷却剂流引导到切削工具上的方法和装置由可枢转地安装在机床上的喷嘴构成，喷嘴根据机床通过可伸缩柱塞或其它线性驱动构件的运动而被自动调节，以便 使冷却剂流与工件和被切割位置上的每个切削工具之间的界面相交; 并且喷嘴在参考位置与对应于进入切割位置的切割工具的长度或直径相对应的不同中间位置之间枢转。

公开(公告)号：US06666922B2

公开(公告)日：2003-12-23

申请号：US09921845

申请日：2001-08-02

申请人： Gary L Curtis ,  Raymon F. Thompson

发明人： Gary L Curtis ,  Raymon F. Thompson

IPC分类号： C23C1600

CPC分类号： H01L21/67017 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/6708 ,  Y10S134/902

摘要： An apparatus for processing a workpiece in a micro-environment includes a workpiece housing connected to a motor for rotation. The workpiece housing forms a substantially closed processing chamber where one or more processing fluids are distributed across at least one face of the workpiece by centrifugal force generated during rotation of the housing. Multiple housings may be vertically stacked and rotated about a common rotation axis to simultaneously process multiple workpieces in a small space.

公开(公告)号：US06622737B2

公开(公告)日：2003-09-23

申请号：US10217716

申请日：2002-08-13

申请人： Gary L. Curtis ,  Raymon F. Thompson

发明人： Gary L. Curtis ,  Raymon F. Thompson

IPC分类号： B08B304

CPC分类号： H01L21/67017 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/67075 ,  H01L21/6708 ,  Y10S134/902

摘要： In a method for rinsing and drying a semiconductor workpiece in a micro-environment, the workpiece is placed into a rinser/dryer housing. The rinser/dryer housing is rotated by a rotor motor. The rinser/dryer housing defines a substantially closed rinser/dryer chamber. Rinsing and drying fluids are distributed across at least one face of the semiconductor workpiece by the action of centrifugal force generated during rotation of the housing. A fluid supply system is connected to sequentially supply a rinsing fluid followed by a drying fluid to the chamber as the housing is rotated.

公开(公告)号：US06447633B1

公开(公告)日：2002-09-10

申请号：US09710530

申请日：2000-11-09

申请人： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

发明人： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

IPC分类号： C28F102

CPC分类号： H01L21/6715 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/6708 ,  Y10S118/90 ,  Y10S438/906 ,  Y10S438/913

摘要： A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid flows off of the circumferential edge of the wafer, it is contained in an annular reservoir, so that the fluid also flows onto an outer annular area of the second side of the wafer. An opening allows fluid to flow out of the reservoir. The opening defines the location of a parting line beyond which the fluid will not travel on the second side of the wafer. An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.

公开(公告)号：US06264752B1

公开(公告)日：2001-07-24

申请号：US09113435

申请日：1998-07-10

申请人： Gary L. Curtis ,  Raymon F. Thompson

发明人： Gary L. Curtis ,  Raymon F. Thompson

IPC分类号： C23L1600

CPC分类号： H01L21/67017 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/6708

摘要： An apparatus for processing a microelectronic workpiece in a micro-environment is set forth. The apparatus includes a first chamber member having an interior chamber wall and a second chamber member having an interior chamber wall. The first and second chamber members are adapted for relative movement between a loading position in which the first and second chamber members are distal one another and a processing position in which the first and second chamber members are proximate one another to define a processing chamber. At least one workpiece support assembly is disposed between the first and second chamber members for supporting the microelectronic workpiece. The workpiece support assembly is operable to space the workpiece a first distance, x1, from an interior chamber wall of at least one of the first and second chamber members when the first and second chamber members are in the loading position and to space the workpiece a second distance, x2, from the interior chamber wall when the first and second chamber members are in the processing position, wherein x1>x2.

摘要翻译： 阐述了在微环境中处理微电子工件的装置。 该装置包括具有内部室壁的第一室构件和具有内部室壁的第二室构件。 第一和第二室构件适于在第一和第二室构件彼此远离的装载位置和第一和第二室构件彼此靠近以限定处理室的处理位置之间的相对运动。 至少一个工件支撑组件设置在第一和第二室构件之间，用于支撑微电子工件。 工件支撑组件可操作以当第一和第二室构件处于装载位置时将工件与第一和第二室构件中的至少一个室内构件的内室壁隔开第一距离x1，并使工件空间 第二距离x2，当第一和第二腔室构件处于加工位置时，其中x1> x2。

公开(公告)号：US5678320A

公开(公告)日：1997-10-21

申请号：US415240

申请日：1995-04-03

申请人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

发明人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  F26B17/24

CPC分类号： H01L21/67781 ,  H01L21/67173 ,  H01L21/67313 ,  H01L21/67326 ,  H01L21/67742 ,  H01L21/67754 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/138 ,  Y10S414/14 ,  Y10S414/141

摘要： A processor for processing semiconductor articles, such as integrated circuit wafers, flat panel displays, semiconductor substrates, and data disks. The processor has an interface section which receives articles in article carriers. The interface section transfers the articles from carriers into processing arrays. A conveyor having an automated arm assembly moves article arrays to and between processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.

摘要翻译： 用于处理诸如集成电路晶片，平板显示器，半导体衬底和数据盘的半导体产品的处理器。 处理器具有接收物品载体中的物品的接口部分。 接口部分将物品从载体转移到处理阵列中。 具有自动臂组件的输送机将物品阵列移动到处理站之间和处理站之间。 处理站从与接口部分相邻的封闭区域进行访问。

公开(公告)号：US5664337A

公开(公告)日：1997-09-09

申请号：US680463

申请日：1996-07-15

申请人： Jeffrey A. Davis ,  Gary L. Curtis

发明人： Jeffrey A. Davis ,  Gary L. Curtis

IPC分类号： H01L21/677 ,  F26B17/24

CPC分类号： H01L21/67754 ,  H01L21/67173 ,  H01L21/67313 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  Y10S414/138

摘要： A semiconductor processing system for wafers or other semiconductor articles. The system uses an interface section at an end of the machine accessible from the clean room. A plurality of processing stations are arranged away from the clean room interface. A transfer subsystem removes wafers from supporting carriers, and positions both the wafers and carriers onto a carrousel which is used as an inventory storage. Wafers are shuttled between the inventory and processing stations by a robotic conveyor which is oriented to move toward and away from the interface end. The system processes the wafers without wafer carriers.

摘要翻译： 一种用于晶片或其他半导体制品的半导体处理系统。 系统使用机器末端的接口部分可从洁净室进入。 多个处理站被布置成远离洁净室界面。 传输子系统从支撑载体上移除晶片，并将晶片和载体两者放置在用作库存存储器的转盘上。 晶片通过机器人输送机在库存和处理站之间穿梭，该机器人输送机被定向成朝向和远离接口端移动。 系统处理没有晶片载体的晶片。