公开(公告)号：US20080156908A1

公开(公告)日：2008-07-03

申请号：US12071785

申请日：2008-02-26

申请人： Isao Ota ,  Kenji Tanimoto ,  Gen Yamada ,  Noriyuki Takakuma

发明人： Isao Ota ,  Kenji Tanimoto ,  Gen Yamada ,  Noriyuki Takakuma

IPC分类号： B02C17/20

CPC分类号： B02C17/00 ,  B02C17/20 ,  C09K3/1409

摘要： A method of milling cerium compound by means of a ball mill using a milling medium, characterized in that ratio Hb/r of radius r of a cylindrical ball mill container and depth Hb of the milling medium in the ball mill container disposed horizontally ranges from 1.2 to 1.9, and the ball mill container is rotated at a rotational speed which is 50% or less of critical rotational speed Nc=299/r1/2 of the ball mill container converted from the radius r expressed in centimeter. The milling method can be carried out in a wet or dry process, and the cerium compound is preferably cerium oxide. The method can be also applied for producing a cerium compound slurry.

摘要翻译： 一种通过使用研磨介质的球磨机研磨铈化合物的方法，其特征在于，圆柱形球磨机容器的半径r与深度H b b的比值H b / 水平设置的球磨机容器中的研磨介质的SUB> 1.2〜1.9，球磨容器以临界旋转速度N C = 50％以下的转速旋转， 从以半径r表示的半径r转换的球磨机容器的299 / r 1/2倍。 研磨方法可以在湿法或干法中进行，铈化合物优选为氧化铈。 该方法也可用于制备铈化合物浆料。

公开(公告)号：US20080073796A1

公开(公告)日：2008-03-27

申请号：US11535700

申请日：2006-09-27

申请人： Paul M. Harvey ,  Kazushige Kawasaki ,  Gen Yamada

发明人： Paul M. Harvey ,  Kazushige Kawasaki ,  Gen Yamada

IPC分类号： H01L23/48

CPC分类号： H05K1/116 ,  H01L23/49827 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0219 ,  H05K3/4602 ,  H05K2201/0792 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/09781 ,  H05K2201/09809 ,  H01L2924/00

摘要： An electrically optimized and structurally protected micro via structure for high speed signals in multilayer interconnection substrates is provided. The via structure eliminates the overlap of a contact with the reference planes to thereby reduce the via capacitance and thus, the via impedance mismatch in the via structure. As a result, the via structure is electrically optimized. The via structure further comprises one or more floating support members placed in close proximity to the via within a via clearance area between the via and the reference planes. The floating support members are “floating” in the sense that they are not in electrical contact with either the via or the reference planes. Thus, they are not provided for purposes of signal propagation but only for structural support. The floating support members may be connected to one another by way of one or more microvia structures.

摘要翻译： 提供了用于多层互连基板中的高速信号的电学优化和结构保护的微通孔结构。 通孔结构消除了与参考平面的接触的重叠，从而减小了通孔电容，从而减小了通孔结构中的通路阻抗失配。 结果，通孔结构被电学优化。 通孔结构还包括一个或多个浮动支撑构件，该浮动支撑构件在通孔和参考平面之间的通孔间隙区域内靠近通孔放置。 浮动支撑构件在它们不与通孔或参考平面电接触的意义上是“浮动的”。 因此，它们不是用于信号传播的目的，而是仅用于结构支持。 浮动支撑构件可以通过一个或多个微孔结构彼此连接。

公开(公告)号：US06719819B2

公开(公告)日：2004-04-13

申请号：US10281104

申请日：2002-10-28

申请人： Isao Ota ,  Tohru Nishimura ,  Gen Yamada

发明人： Isao Ota ,  Tohru Nishimura ,  Gen Yamada

IPC分类号： C09G102

CPC分类号： G11B5/8404 ,  B24B37/044 ,  C09G1/02 ,  C09K3/1409 ,  G11B5/84

摘要： For aluminum disks and glass-made hard disks, those disks having a mean waviness of less than 3 Å are being desired in order to increase the density of memory capacity. The present invention provides polishing compositions that can give smoothly polished surfaces for the disks. The polishing compositions are polishing compositions for aluminum disks or substrates having silica on the surface thereof, which contain colloidal silica particle groups having different particle size distributions and have a SiO2 concentration of 0.5 to 50% by weight.

摘要翻译： 对于铝盘和玻璃制硬盘，希望具有小于3的平均波纹的那些盘以增加存储容量的密度。 本发明提供了能给光盘平滑抛光的表面的抛光组合物。 抛光组合物是用于铝盘或其表面上具有二氧化硅的基材的抛光组合物，其含有具有不同粒度分布且SiO 2浓度为0.5至50重量％的胶体二氧化硅颗粒基团。

公开(公告)号：US07687391B2

公开(公告)日：2010-03-30

申请号：US11535700

申请日：2006-09-27

申请人： Paul M. Harvey ,  Kazushige Kawasaki ,  Gen Yamada

发明人： Paul M. Harvey ,  Kazushige Kawasaki ,  Gen Yamada

IPC分类号： H01L21/4763

CPC分类号： H05K1/116 ,  H01L23/49827 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0219 ,  H05K3/4602 ,  H05K2201/0792 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/09781 ,  H05K2201/09809 ,  H01L2924/00

摘要： An electrically optimized and structurally protected micro via structure for high speed signals in multilayer interconnection substrates is provided. The via structure eliminates the overlap of a contact with the reference planes to thereby reduce the via capacitance and thus, the via impedance mismatch in the via structure. As a result, the via structure is electrically optimized. The via structure further comprises one or more floating support members placed in close proximity to the via within a via clearance area between the via and the reference planes. The floating support members are “floating” in the sense that they are not in electrical contact with either the via or the reference planes. Thus, they are not provided for purposes of signal propagation but only for structural support. The floating support members may be connected to one another by way of one or more microvia structures.

摘要翻译： 提供了用于多层互连基板中的高速信号的电学优化和结构保护的微通孔结构。 通孔结构消除了与参考平面的接触的重叠，从而减小了通孔电容，从而减小了通孔结构中的通路阻抗失配。 结果，通孔结构被电学优化。 通孔结构还包括一个或多个浮动支撑构件，该浮动支撑构件在通孔和参考平面之间的通孔间隙区域内靠近通孔放置。 浮动支撑构件在它们不与通孔或参考平面电接触的意义上是“浮动的”。 因此，它们不是用于信号传播的目的，而是仅用于结构支持。 浮动支撑构件可以通过一个或多个微孔结构相互连接。

公开(公告)号：US07484679B2

公开(公告)日：2009-02-03

申请号：US10518769

申请日：2003-07-03

申请人： Isao Ota ,  Kenji Tanimoto ,  Gen Yamada ,  Noriyuki Takakuma

发明人： Isao Ota ,  Kenji Tanimoto ,  Gen Yamada ,  Noriyuki Takakuma

IPC分类号： B02C1/00 ,  B02C11/08 ,  B02C21/00 ,  B02C23/00

CPC分类号： B02C17/00 ,  B02C17/20 ,  C09K3/1409

摘要： A method of milling cerium compound by means of a ball mill using a milling medium, characterized in that ratio Hb/r of radius r of a cylindrical ball mill container and depth Hb of the milling medium in the ball mill container disposed horizontally ranges from 1.2 to 1.9, and the ball mill container is rotated at a rotational speed which is 50% or less of critical rotational speed Nc=299/r1/2 of the ball mill container converted from the radius r expressed in centimeter. The milling method can be carried out in a wet or dry process, and the cerium compound is preferably cerium oxide. The method can be also applied for producing a cerium compound slurry.

摘要翻译： 一种通过使用研磨介质的球磨机研磨铈化合物的方法，其特征在于，圆柱形球磨机容器的半径r的比率Hb / r和水平设置的球磨机容器中的研磨介质的深度Hb范围为1.2 到1.9，球磨容器以从以半径r表示的半径r转换的球磨机容器的临界转速Nc = 299 / r1 / 2的50％以下的转速旋转。 研磨方法可以在湿法或干法中进行，铈化合物优选为氧化铈。 该方法也可用于制备铈化合物浆料。

公开(公告)号：US20080272862A1

公开(公告)日：2008-11-06

申请号：US12171602

申请日：2008-07-11

申请人： Paul M. Harvey ,  Kazushige Kawasaki ,  Gen Yamada

发明人： Paul M. Harvey ,  Kazushige Kawasaki ,  Gen Yamada

IPC分类号： H01P1/00

CPC分类号： H05K1/116 ,  H01L23/49827 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0219 ,  H05K3/4602 ,  H05K2201/0792 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/09781 ,  H05K2201/09809 ,  H01L2924/00

摘要： An electrically optimized and structurally protected micro via structure for high speed signals in multilayer interconnection substrates is provided. The via structure eliminates the overlap of a contact with the reference planes to thereby reduce the via capacitance and thus, the via impedance mismatch in the via structure. As a result, the via structure is electrically optimized. The via structure further comprises one or more floating support members placed in close proximity to the via within a via clearance area between the via and the reference planes. The floating support members are “floating” in the sense that they are not in electrical contact with either the via or the reference planes. Thus, they are not provided for purposes of signal propagation but only for structural support. The floating support members may be connected to one another by way of one or more microvia structures.

公开(公告)号：US20050253001A1

公开(公告)日：2005-11-17

申请号：US10518769

申请日：2003-07-03

申请人： Isao Ota ,  Kenji Tanimoto ,  Gen Yamada ,  Noriyuki Takakuma

发明人： Isao Ota ,  Kenji Tanimoto ,  Gen Yamada ,  Noriyuki Takakuma

IPC分类号： B02C17/00 ,  B02C17/20 ,  C09K3/14 ,  B02C19/12

CPC分类号： B02C17/00 ,  B02C17/20 ,  C09K3/1409

摘要： A method of milling cerium compound by means of a ball mill using a milling medium, characterized in that ratio Hb/r of radius r of a cylindrical ball mill container and depth Hb of the milling medium in the ball mill container disposed horizontally ranges from 1.2 to 1.9, and the ball mill container is rotated at a rotational speed which is 50% or less of critical rotational speed Nc=299/r1/2 of the ball mill container converted from the radius r expressed in centimeter. The milling method can be carried out in a wet or dry process, and the cerium compound is preferably cerium oxide. The method can be also applied for producing a cerium compound slurry.

摘要翻译： 一种通过使用研磨介质的球磨机研磨铈化合物的方法，其特征在于，圆柱形球磨机容器的半径r与深度H b b的比值H b / 水平设置的球磨机容器中的研磨介质的SUB> 1.2〜1.9，球磨容器以临界旋转速度N C = 50％以下的转速旋转， 从以半径r表示的半径r转换的球磨机容器的299 / r 1/2倍。 研磨方法可以在湿法或干法中进行，铈化合物优选为氧化铈。 该方法也可用于制备铈化合物浆料。

公开(公告)号：US07911049B2

公开(公告)日：2011-03-22

申请号：US12171602

申请日：2008-07-11

申请人： Paul M. Harvey ,  Kazushige Kawasaki ,  Gen Yamada

发明人： Paul M. Harvey ,  Kazushige Kawasaki ,  Gen Yamada

IPC分类号： H01L23/053

CPC分类号： H05K1/116 ,  H01L23/49827 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0219 ,  H05K3/4602 ,  H05K2201/0792 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/09781 ,  H05K2201/09809 ,  H01L2924/00

摘要： An electrically optimized and structurally protected micro via structure for high speed signals in multilayer interconnection substrates is provided. The via structure eliminates the overlap of a contact with the reference planes to thereby reduce the via capacitance and thus, the via impedance mismatch in the via structure. As a result, the via structure is electrically optimized. The via structure further comprises one or more floating support members placed in close proximity to the via within a via clearance area between the via and the reference planes. The floating support members are “floating” in the sense that they are not in electrical contact with either the via or the reference planes. Thus, they are not provided for purposes of signal propagation but only for structural support. The floating support members may be connected to one another by way of one or more microvia structures.

摘要翻译： 提供了用于多层互连基板中的高速信号的电学优化和结构保护的微通孔结构。 通孔结构消除了与参考平面的接触的重叠，从而减小了通孔电容，从而减小了通孔结构中的通路阻抗失配。 结果，通孔结构被电学优化。 通孔结构还包括一个或多个浮动支撑构件，该浮动支撑构件在通孔和参考平面之间的通孔间隙区域内靠近通孔放置。 浮动支撑构件在它们不与通孔或参考平面电接触的意义上是“浮动的”。 因此，它们不是用于信号传播的目的，而是仅用于结构支持。 浮动支撑构件可以通过一个或多个微孔结构彼此连接。