公开(公告)号：US08878360B2

公开(公告)日：2014-11-04

申请号：US13548705

申请日：2012-07-13

Applicant: Thorsten Meyer ,  Gerald Ofner ,  Sven Albers

Inventor： Thorsten Meyer ,  Gerald Ofner ,  Sven Albers

IPC: H01L23/48

CPC classification number: H01L23/49816 ,  H01L21/561 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/16 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/24011 ,  H01L2224/24105 ,  H01L2224/24145 ,  H01L2224/24146 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73209 ,  H01L2224/73217 ,  H01L2224/73253 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/81191 ,  H01L2224/82031 ,  H01L2224/82039 ,  H01L2224/821 ,  H01L2224/83191 ,  H01L2224/83385 ,  H01L2224/92124 ,  H01L2224/92224 ,  H01L2224/92244 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19105 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2224/83 ,  H01L2924/01014 ,  H01L2924/01006 ,  H01L2224/82 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A stacked semiconductor device and method of manufacturing a stacked semiconductor device are described. The semiconductor device may include a reconstituted base layer having a plurality of embedded semiconductor chips. A first redistribution layer may contact the electrically conductive contacts of the embedded chips and extend beyond the boundary of one or more of the embedded chips, forming a fan-out area. Another chip may be stacked above the chips embedded in the base layer and be electrically connected to the embedded chips by a second redistribution layer. Additional layers of chips may be included in the semiconductor device.

Abstract translation: 对叠层半导体器件及其制造方法进行说明。 半导体器件可以包括具有多个嵌入式半导体芯片的复原基底层。 第一再分配层可以接触嵌入式芯片的导电触点并且延伸超过一个或多个嵌入式芯片的边界，形成扇出区域。 另外的芯片可以堆叠在嵌入在基底层中的芯片之上，并通过第二再分布层与嵌入式芯片电连接。 芯片的附加层可以包括在半导体器件中。

公开(公告)号：US07994608B2

公开(公告)日：2011-08-09

申请号：US11996604

申请日：2005-08-24

Applicant: Ai Min Tan ,  Gerald Ofner ,  Swain Hong Yeo ,  Mary Teo ,  Pei Siang Lim

Inventor： Ai Min Tan ,  Gerald Ofner ,  Swain Hong Yeo ,  Mary Teo ,  Pei Siang Lim

IPC: H01L21/00 ,  H01L23/58

CPC classification number: H01L24/81 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81122 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An integrated circuit device includes a semiconductor chip having an active surface with a plurality of chip contact pads, a rewiring substrate and an electrically conductive inductor coil for magnetically aligning the semiconductor chip with the rewiring substrate.

Abstract translation: 集成电路器件包括具有多个芯片接触焊盘的有源表面的半导体芯片，重新布线基板和用于将半导体芯片与重新布线基板磁性对准的导电电感线圈。

公开(公告)号：US07566968B2

公开(公告)日：2009-07-28

申请号：US11196497

申请日：2005-08-04

Applicant: Michael Bauer ,  Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Holger Woerner

Inventor： Michael Bauer ,  Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Holger Woerner

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: G01N33/48785 ,  B01L3/502715 ,  B01L9/52 ,  B01L2200/027 ,  B01L2300/0819 ,  B01L2300/0877 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring substrate including contact pads, external contact areas and rewiring lines that electrically connect the contact pads to the external contact areas. The rewiring substrate covers a portion of the first side of the semiconductor chip without covering the bioactive structure, such that the rewiring substrate overlaps the contact areas of the semiconductor chip and the contact pads and the contact areas are aligned with and electrically connect to each other. In addition, a measuring apparatus is configured to receive the biosensor and conduct measurements of a fluid medium that is delivered into the measuring apparatus.

Abstract translation: 具有智能卡结构的生物传感器包括：半导体芯片，包括生物活性结构和布置在半导体芯片的第一面上的接触区域;以及重新布线基板，包括接触焊盘，外部接触区域和将接触焊盘电连接到 外部接触区域。 再配线基板覆盖半导体芯片的第一侧的一部分而不覆盖生物活性结构，使得重新布线基板与半导体芯片和接触焊盘的接触区域重叠，并且接触区域彼此对准并电连接 。 此外，测量装置被配置为接收生物传感器并进行传送到测量装置中的流体介质的测量。

公开(公告)号：US20080006900A1

公开(公告)日：2008-01-10

申请号：US11738641

申请日：2007-04-23

Applicant: Kai Chong Chan ,  Charles Wee Ming Lee ,  Gerald Ofner

Inventor： Kai Chong Chan ,  Charles Wee Ming Lee ,  Gerald Ofner

IPC: H01L31/036 ,  H01L21/00 ,  H01L23/48

CPC classification number: H01L23/3121 ,  H01L21/563 ,  H01L29/0657 ,  H01L2221/6834 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10155 ,  H01L2924/10157 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A semiconductor package includes a rewiring substrate and a semiconductor chip. The semiconductor chip includes: a first face with an active surface including integrated circuit devices and chip contact pads, a second face lying in a plane essentially parallel to the first face and side faces. Each side face of the semiconductor chip lies in a plane essentially perpendicular to the first and second faces. At least one edge between two mutually essentially perpendicular faces of the semiconductor chip includes a surface.

Abstract translation: 半导体封装包括重新布线基板和半导体芯片。 半导体芯片包括：具有主动表面的第一面，包括集成电路器件和芯片接触焊盘，位于基本上平行于第一面和侧面的平面中的第二面。 半导体芯片的每个侧面位于基本上垂直于第一和第二面的平面中。 半导体芯片的两个相互基本垂直的面之间的至少一个边缘包括一个表面。

公开(公告)号：US07286287B1

公开(公告)日：2007-10-23

申请号：US09889895

申请日：2000-11-23

Applicant: Anton Gerald Ofner

Inventor： Anton Gerald Ofner

IPC: G02B23/00

CPC classification number: G02B7/002 ,  G02B5/30 ,  G02B25/004 ,  G02B27/017 ,  G02B27/0172 ,  G02B27/0176 ,  G02B2027/0132 ,  G02C7/088

Abstract: A vision aid in the form of telescopic spectacles has two lens systems, which each comprise at least one objective lens (70) and one eyepiece (71). An autofocussing element which changes the focal length of the lens systems for sharp focussing thereof according to the distance of the telescopic spectacle from the object is assigned to the lens systems. Furthermore, an element for changing the magnification factor by changing the focal length of the lens systems (“zoom”) and finally an element for matching the parallax between the lens systems of the vision aid to the focal length which has been set according to the distance of the telescopic spectacles from the object are assigned to the lens systems. The parallax is adapted using adjustable optical elements (11) which are located in the beam path of the lens systems, with which elements the angle (13) between the beam paths (14) running from the lens systems (1) to the object can be changed.

Abstract translation: 伸缩眼镜形式的视力援助具有两个透镜系统，每个透镜系统包括至少一个物镜（70）和一个目镜（71）。 将透镜系统的焦距改变为根据伸缩眼镜与物体的距离进行锐利聚焦的自动聚焦元件被分配给透镜系统。 此外，通过改变透镜系统的焦距（“缩放”）以及最后将视觉辅助的透镜系统之间的视差匹配的元件与根据 将伸缩眼镜与物体的距离分配给透镜系统。 使用位于透镜系统的光束路径中的可调节光学元件（11）来适应视差，利用该元件，从透镜系统（1）延伸到物体的光束路径（14）之间的角度（13）可以 改变。

公开(公告)号：US20070037319A1

公开(公告)日：2007-02-15

申请号：US11501913

申请日：2006-08-10

Applicant: Kai Chan ,  Charles Lee ,  Gerald Ofner

Inventor： Kai Chan ,  Charles Lee ,  Gerald Ofner

IPC: H01L21/00

CPC classification number: H01L21/6835 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/3157 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A semiconductor package comprises a substrate which includes a plurality of conducting traces and upper contact areas on its upper surface and a second plurality of lower conductive traces and external contact areas on its bottom surface and external conducting members attached to the external contact areas. The semiconductor package also includes a semiconductor die comprising an active surface with a plurality of die contact pads, electrically connected to the contact areas of the substrate by conducting members. A support layer between the conducting members on the active surface of the semiconductor die covers at least the base portion of the conducting members. A method relates to the production of the semiconductor package.

Abstract translation: 半导体封装包括：衬底，其包括多个导电迹线和其上表面上的上接触区域，以及在其底表面上的第二多个下导电迹线和外部接触区域以及附接到外部接触区域的外部导电构件。 半导体封装还包括半导体管芯，其包括具有多个管芯接触焊盘的有源表面，其通过导电构件电连接到衬底的接触区域。 半导体管芯的有源表面上的导电构件之间的支撑层至少覆盖导电构件的基部。 一种方法涉及半导体封装的制造。

公开(公告)号：US5971540A

公开(公告)日：1999-10-26

申请号：US36335

申请日：1998-03-06

Applicant: Anton Gerald Ofner

Inventor： Anton Gerald Ofner

IPC: A61B19/00 ,  G02C7/08 ,  G02C1/00

CPC classification number: G02C7/088 ,  A61B90/20

Abstract: Magnifying spectacles for surgical use have an automatic focusing device, a device for automatically altering the magnification factor and a device for automatic parallax compensation corresponding to the current focal length. During surgical operations, alteration of the working distance is commonly necessary due to the positions of different operating sites. Automatic adaptation of the focal length and the parallax angle allows optimum optical configuration to be reached without the need for the surgeon to use his hands. Focusing can be adjusted using a foot switch.

Abstract translation: 用于外科手术的放大镜具有自动对焦装置，用于自动改变放大倍数的装置和与当前焦距相对应的用于自动视差补偿的装置。 在外科手术中，由于不同操作部位的位置，通常需要改变工作距离。 自动调整焦距和视差角度可以实现最佳的光学配置，无需外科医生使用他的手。 可以使用脚踏开关调节对焦。

公开(公告)号：US09056763B2

公开(公告)日：2015-06-16

申请号：US14039157

申请日：2013-09-27

Applicant: Christian Geissler ,  Thorsten Meyer ,  Gerald Ofner ,  Reinhard Mahnkopf ,  Andreas Augustin ,  Christian Mueller

Inventor： Christian Geissler ,  Thorsten Meyer ,  Gerald Ofner ,  Reinhard Mahnkopf ,  Andreas Augustin ,  Christian Mueller

IPC: H01L23/02 ,  B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00666 ,  B81B7/0054 ,  B81C1/00261 ,  B81C1/00349 ,  B81C2203/0136 ,  B81C2203/0154 ,  H01L21/568 ,  H01L23/3135 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/24137 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/73207 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/73277 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Stress buffer layers for integrated microelectromechanical systems (MEMS) are described. For example, a semiconductor package includes a substrate having first and second surfaces, the second surface having an array of external conductive contacts. A microelectromechanical system (MEMS) component is disposed above the first surface of the substrate. A buffer layer is disposed above the MEMS component, the buffer layer having a first Young's modulus. A mold compound is disposed above the buffer layer, the mold compound having a second Young's modulus higher than the first Young's modulus.

Abstract translation: 描述了用于集成微机电系统（MEMS）的应力缓冲层。 例如，半导体封装包括具有第一和第二表面的衬底，第二表面具有外部导电触点阵列。 微机电系统（MEMS）部件设置在基板的第一表面上方。 缓冲层设置在MEMS部件上方，缓冲层具有第一杨氏模量。 模具化合物设置在缓冲层上方，模塑料具有高于第一杨氏模量的第二杨氏模量。

公开(公告)号：US20140138827A1

公开(公告)日：2014-05-22

申请号：US14164289

申请日：2014-01-27

Applicant: Thorsten Meyer ,  Gerald Ofner ,  Bernd Waidhas

Inventor： Thorsten Meyer ,  Gerald Ofner ,  Bernd Waidhas

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/498

CPC classification number: H01L24/81 ,  H01L21/568 ,  H01L23/3135 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/14 ,  H01L24/17 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/0231 ,  H01L2224/02371 ,  H01L2224/02373 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/00

Abstract: According to various embodiments, a flip chip package structure is provided in which a redistribution layer (RDL) is disposed on a surface of both a semiconductor chip and one or more lateral extensions of the semiconductor chip surface. The lateral extensions may be made using, e.g., a reconstituted wafer to implement a fanout region lateral to one or more sides of the semiconductor chip. One or more electrical connectors such as solder bumps or copper cylinders may be applied to the RDL, and an interposer such as a PCB interposer may be connected to the electrical connectors. In this way, a relatively tight semiconductor pad pitch may be accommodated and translated to an appropriate circuit board pitch without necessarily requiring a silicon or glass interposer.

Abstract translation: 根据各种实施例，提供了一种倒装芯片封装结构，其中再分配层（RDL）设置在半导体芯片和半导体芯片表面的一个或多个侧向延伸部分的表面上。 横向延伸部可以使用例如重构的晶片来实现半导体芯片的一个或多个侧面的横向扇出区域。 可以将一个或多个电连接器（例如焊料凸块或铜圆筒）施加到RDL，并且诸如PCB插入器的插入件可以连接到电连接器。 以这种方式，可以容纳相对紧凑的半导体衬垫间距并将其转换成适当的电路板间距，而不需要硅或玻璃插入件。

公开(公告)号：US08076180B2

公开(公告)日：2011-12-13

申请号：US12168255

申请日：2008-07-07

Applicant: Thorsten Meyer ,  Gerald Ofner

Inventor： Thorsten Meyer ,  Gerald Ofner

IPC: H01L21/44

CPC classification number: H01L24/19 ,  H01L21/568 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/3121 ,  H01L23/5389 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/24137 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

Abstract: Repairable semiconductor device and method. In one embodiment a method, provides a first body having a first semiconductor chip and a first metal layer. A second body includes a second semiconductor chip and a second metal layer. Metal of the first metal layer is removed. The first semiconductor chip is removed from the first body. The second body is attached to the first body. The first metal layer is electrically coupled to the second metal layer.

Abstract translation: 可修复的半导体器件和方法。 在一个实施例中，一种方法提供了具有第一半导体芯片和第一金属层的第一主体。 第二主体包括第二半导体芯片和第二金属层。 第一金属层的金属被去除。 第一半导体芯片从第一主体移除。 第二个身体连接到第一个身体。 第一金属层电耦合到第二金属层。