公开(公告)号：US06329721B1

公开(公告)日：2001-12-11

申请号：US09570884

申请日：2000-05-15

申请人： Giulio DiGiacomo

发明人： Giulio DiGiacomo

IPC分类号： H01L2348

CPC分类号： H05K3/3436 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/051 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/11 ,  H01L2224/1147 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13609 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19043 ,  H05K3/3463 ,  H05K2201/10992 ,  H05K2203/0415 ,  H05K2203/043 ,  H05K2203/0557 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05005 ,  H01L2224/05541 ,  H01L2924/00014

摘要： A solder column structure particularly useful for joining electronic components by C-4 interconnection is provided comprising a solder column attached at one end to one of the substrates being joined and having a layer of indium at the other end. During reflow, to join the other substrate, the indium melts with part of the solder column forming a Pb—Sn—In ternary alloy joint having enhanced fatigue resistance. A method for using the solder column to make electronic component assemblies and electronic component assemblies made using the method and solder column are also provided.

公开(公告)号：US5981310A

公开(公告)日：1999-11-09

申请号：US12071

申请日：1998-01-22

申请人： Giulio DiGiacomo ,  Stephen S. Drofitz, Jr. ,  David L. Edwards ,  Larry D. Gross ,  Sushumna Iruvanti ,  Raed A. Sherif ,  Subhash L. Shinde ,  David J. Womac ,  David B. Goland ,  Lester W. Herron

发明人： Giulio DiGiacomo ,  Stephen S. Drofitz, Jr. ,  David L. Edwards ,  Larry D. Gross ,  Sushumna Iruvanti ,  Raed A. Sherif ,  Subhash L. Shinde ,  David J. Womac ,  David B. Goland ,  Lester W. Herron

IPC分类号： H01L23/433 ,  H01L25/065 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/433 ,  H01L24/83 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83193 ,  H01L2224/83801 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15724 ,  H01L2924/15788 ,  H01L2924/16152 ,  H01L2924/16251

摘要： A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over each chip on a substrate. The heat-sink columns are interconnected by flexible members to provide a unitary cover. Thin film metallization of at least a portion of the mating surfaces of the substrate, chips and heat-sink column permits soldering of the cap to the chips and substrate to form the package which is a mechanically stable structure with no degradation of interconnection fatigue life due to thermal cycling of the assembly when in use.

摘要翻译： 一种多芯片模块和散热帽组件及其制造方法，为更高功率密度的芯片提供足够的冷却。 散热器盖具有设置在基板上的每个芯片上的散热柱。 散热柱通过柔性构件相互连接，以提供整体盖。 衬底，芯片和散热柱的配合表面的至少一部分的薄膜金属化允许将帽焊接到芯片和衬底以形成封装，其是机械稳定的结构，而不会降低互连疲劳寿命 在使用时对组件进行热循环。

公开(公告)号：US5192622A

公开(公告)日：1993-03-09

申请号：US743439

申请日：1991-08-09

申请人： Armando S. Cammarano ,  Giulio DiGiacomo ,  Nunzio DiPaolo

发明人： Armando S. Cammarano ,  Giulio DiGiacomo ,  Nunzio DiPaolo

IPC分类号： C22C32/00 ,  H01L23/498

CPC分类号： H01L23/49866 ,  C22C32/0089 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/15312 ,  Y10T428/12049 ,  Y10T428/12056 ,  Y10T428/12111 ,  Y10T428/12139 ,  Y10T428/12146

摘要： A ternary-alloy/glass composite suitable for use in vias in glass-ceramic electronic structures includes gold, palladium, and either platinum or silver in the alloy where the gold is less than 50% by weight of the alloy. The alloy is combined with glass frit where the glass is present as 5-50% by volume in the composition. The ternary-alloy glass composite is sintered in the glass-ceramic structure and provides a hermetic seal. Chips and pins can be bonded directly to the ternary-alloy/glass composite using a eutectic braze without causing cracks in the glass-ceramic. The ternary-alloy/glass composite has good adhesion with glass-ceramics and is useful in vias in electronic structures.

摘要翻译： 适合用于玻璃 - 陶瓷电子结构通孔的三元合金/玻璃复合物包括合金中的金，钯和铂或银，其中金小于合金的50重量％。 该合金与玻璃料组合，其中玻璃在组合物中的存在量为5-50体积％。 三元合金玻璃复合材料在玻璃 - 陶瓷结构中烧结并提供气密密封。 芯片和引脚可以使用共晶钎焊直接粘合到三元合金/玻璃复合材料上，而不会在玻璃陶瓷中产生裂纹。 三元合金/玻璃复合材料与玻璃陶瓷具有良好的粘合性，可用于电子结构的通孔。

公开(公告)号：US06281573B1

公开(公告)日：2001-08-28

申请号：US09052296

申请日：1998-03-31

申请人： Eugene R. Atwood ,  Joseph A. Benenati ,  Giulio DiGiacomo ,  Horatio Quinones

发明人： Eugene R. Atwood ,  Joseph A. Benenati ,  Giulio DiGiacomo ,  Horatio Quinones

IPC分类号： H05K720

CPC分类号： H01L23/3675 ,  H01L23/3736 ,  H01L23/4275 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00013 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/00 ,  H01L2224/29099

摘要： Solder compositions are introduced to interface between an IC chip and its associated heat exchanger cover. The solder compositions have a solidus-liquidus temperature range that encompasses the IC chip operational temperature range. The solder composition has the desired property of absorbing and rejecting heat energy by changing state or phase with each temperature rise and decline that result from temperature fluctuations associated with the thermal cycles of the integrated circuit chips. A path for high thermal conduction (low thermal resistance) from the IC chip to the heat exchanger to the ambient air is provided by an electronic module cover, configured as a cap with a heat exchanger formed or attached as a single construction, and made of the same material as the substrate, or made with materials of compatible thermal coefficients of expansion to mitigate the effects of vertical displacement during thermal cycling. The cap-heat exchanger cover is constructed to be compliant, and to contact both the IC chip and substrate.

摘要翻译： 引入焊料组合物到IC芯片与其相关联的热交换器盖之间的界面。 焊料组合物具有包含IC芯片工作温度范围的固相线 - 液相线温度范围。 焊料组合物具有通过随着每个温度升高改变状态或相位而吸收和排除热能的性能，并且由与集成电路芯片的热循环相关的温度波动导致的下降。 通过电子模块盖提供从IC芯片到热交换器到周围空气的高热传导（低热阻）的路径，该电子模块盖被构造为具有形成或附接为单个结构的热交换器的盖，并且由 与基材相同的材料，或由具有相容的热膨胀系数的材料制成，以减轻热循环期间垂直位移的影响。 盖 - 热交换器盖被构造成柔性，并且与IC芯片和基板接触。

公开(公告)号：US6025649A

公开(公告)日：2000-02-15

申请号：US898443

申请日：1997-07-22

申请人： Giulio DiGiacomo

发明人： Giulio DiGiacomo

IPC分类号： H01L23/485 ,  H05K3/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/3436 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/051 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/11 ,  H01L2224/1147 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13609 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19043 ,  H05K2201/10992 ,  H05K2203/0415 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K3/3463 ,  Y02P70/613

摘要： A solder column structure particularly useful for joining electronic components by C-4 interconnection is provided comprising a solder column attached at one end to one of the substrates being joined and having a layer of indium at the other end. During reflow, to join the other substrate, the indium melts with part of the solder column forming a Pb--Sn--In ternary alloy joint having enhanced fatigue resistance. A method for using the solder column to make electronic component assemblies and electronic component assemblies made using the method and solder column are also provided.

摘要翻译： 提供了特别可用于通过C-4互连连接电子部件的焊料柱结构，其包括在一端连接到正在接合的一个衬底并且在另一端具有铟层的焊料柱。 在回流期间，为了加入另一个基板，铟熔融部分焊料柱形成具有增强的耐疲劳性的Pb-Sn-In三元合金接头。 还提供了使用焊料柱制造使用方法和焊料柱制成的电子部件组件和电子部件组件的方法。

公开(公告)号：US5266522A

公开(公告)日：1993-11-30

申请号：US894384

申请日：1992-06-05

申请人： Giulio DiGiacomo ,  Armando S. Cammarano ,  Nunzio DiPaolo

发明人： Giulio DiGiacomo ,  Armando S. Cammarano ,  Nunzio DiPaolo

IPC分类号： H01L21/48 ,  H01L23/498 ,  H05K3/24 ,  H05K3/38 ,  H01L21/44

CPC分类号： H05K3/24 ,  H01L21/4853 ,  H01L23/49811 ,  H01L2924/0002 ,  H05K2201/09481 ,  H05K3/388

摘要： This invention relates generally to structure and method for corrosion- and stress-resistant interconnecting metallurgy, and more specifically to new structures and methods for corrosion- and stress-resistant interconnecting multilayer metallurgical pad comprising sequentially deposited layers of chromium, nickel and noble or relatively noble metal as the interconnecting metallurgy, or multilayer metallurgical pad comprising sequentially deposited layers of chromium, soluble noble metal, nickel and noble or relatively noble metal as the interconnecting metallurgy. This invention also relates to an improved multilayer metallurgical pad or metallurgical structure for mating at least a portion of a pin or a connector or a wire to a substrate.

摘要翻译： 本发明一般涉及耐腐蚀和耐应力相互连接冶金的结构和方法，更具体地涉及用于耐腐蚀和耐应力的互连多层冶金垫的新结构和方法，其包括依次沉积的铬，镍和贵金属或相对贵重的层 金属作为互连冶金，或多层冶金垫，其包括依次沉积的铬层，可溶性贵金属，镍和贵金属或相对贵重金属作为互连冶金。 本发明还涉及用于将销或连接器或电线的至少一部分配合到衬底的改进的多层冶金垫或冶金结构。

公开(公告)号：US4465223A

公开(公告)日：1984-08-14

申请号：US514137

申请日：1983-07-15

申请人： Armando S. Cammarano ,  Giulio DiGiacomo

发明人： Armando S. Cammarano ,  Giulio DiGiacomo

IPC分类号： B23K35/00 ,  B23K35/30 ,  B23K1/04

CPC分类号： B23K35/3013 ,  B23K35/001

摘要： A method of brazing two surfaces together with a Au/Sn brazing solder. The method includes the additional step of providing a film of Cu, for example on one of the surfaces, in addition to the Au/Sn brazing solder.

摘要翻译： 一种用Au / Sn钎焊焊料将两个表面钎焊的方法。 该方法还包括除了Au / Sn钎焊焊料之外还提供例如在其中一个表面上的Cu膜的附加步骤。

公开(公告)号：US06678949B2

公开(公告)日：2004-01-20

申请号：US09886326

申请日：2001-06-21

申请人： Chandrika Prasad ,  Roy Yu ,  Richard L. Canull ,  Giulio DiGiacomo ,  Ajay P. Giri ,  Lewis S. Goldmann ,  Kimberley A. Kelly ,  Bouwe W. Leenstra ,  Voya R. Markovich ,  Eric D. Perfecto ,  Sampath Purushothaman ,  Joseph M. Sullivan

发明人： Chandrika Prasad ,  Roy Yu ,  Richard L. Canull ,  Giulio DiGiacomo ,  Ajay P. Giri ,  Lewis S. Goldmann ,  Kimberley A. Kelly ,  Bouwe W. Leenstra ,  Voya R. Markovich ,  Eric D. Perfecto ,  Sampath Purushothaman ,  Joseph M. Sullivan

IPC分类号： H05K334

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L23/16 ,  H01L23/49833 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H05K1/141 ,  H05K3/20 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/467 ,  H05K7/023 ,  H05K2201/049 ,  H05K2201/10977 ,  H05K2201/2036 ,  H05K2203/0182 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49165 ,  Y10T29/49169 ,  Y10T29/49174 ,  Y10T29/49211 ,  Y10T29/49213 ,  H01L2924/00 ,  H01L2924/00014

摘要： A structure for mounting electronic devices. The structure uses a non-conductive, compliant spacer interposed between an underlying carrier and an overlying thin film. The spacer includes a pattern of through-vias which matches opposing interconnects on opposing surfaces of the carrier and the thin film. In this way, solder connections can extend in the through-vias to electrically connect the thin film to the carrier and smooth out topography. In a related process for forming the structure, the thin film is built on a first sacrificial carrier and then further processed on a second sacrificial carrier to keep it from distorting, expanding, or otherwise suffering adversely during its processing. The solder connections between the thin film and the carrier are formed using a closed solder joining process. The spacer is used with laminate cards to create thermal stress release structures on portions of the cards carrying a thin film.

摘要翻译： 一种用于安装电子设备的结构。 该结构使用介于下面的载体和上覆薄膜之间的非导电的兼容间隔物。 间隔件包括通孔的图形，其与载体和薄膜的相对表面上的相对互连匹配。 以这种方式，焊接连接可以在通孔中延伸，以将薄膜电连接到载体上并平滑地形。 在用于形成结构的相关方法中，薄膜建立在第一牺牲载体上，然后在第二牺牲载体上进一步处理，以防止其在其加工期间变形，膨胀或以其它方式受到不利影响。 使用封闭的焊料接合工艺形成薄膜和载体之间的焊接连接。 间隔件与层压卡一起使用以在携带薄膜的卡的部分上产生热应力释放结构。

公开(公告)号：US06281452B1

公开(公告)日：2001-08-28

申请号：US09204851

申请日：1998-12-03

申请人： Chandrika Prasad ,  Roy Yu ,  Richard L. Canull ,  Giulio DiGiacomo ,  Ajay P. Giri ,  Lewis S. Goldmann ,  Kimberley A. Kelly ,  Bouwe W. Leenstra ,  Voya R. Markovich ,  Eric D. Perfecto ,  Sampath Purushothaman ,  Joseph M. Sullivan

发明人： Chandrika Prasad ,  Roy Yu ,  Richard L. Canull ,  Giulio DiGiacomo ,  Ajay P. Giri ,  Lewis S. Goldmann ,  Kimberley A. Kelly ,  Bouwe W. Leenstra ,  Voya R. Markovich ,  Eric D. Perfecto ,  Sampath Purushothaman ,  Joseph M. Sullivan

IPC分类号： H01R1204

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L23/16 ,  H01L23/49833 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H05K1/141 ,  H05K3/20 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/467 ,  H05K7/023 ,  H05K2201/049 ,  H05K2201/10977 ,  H05K2201/2036 ,  H05K2203/0182 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49165 ,  Y10T29/49169 ,  Y10T29/49174 ,  Y10T29/49211 ,  Y10T29/49213 ,  H01L2924/00 ,  H01L2924/00014

摘要： A structure for mounting electronic devices which uses a non-conductive, compliant spacer interposed between an underlying carrier and an overlying thin film. The spacer includes a pattern of through-vias which matches opposing interconnects on opposing surfaces of the carrier and the thin film. In this way, solder connections can extend in the through-vias to electrically connect the thin film to the carrier and smooth out topography. In a related process for forming the structure, the thin film is built on a first sacrificial carrier and then further processed on a second sacrificial carrier to keep it from distorting, expanding, or otherwise suffering adversely during its processing. The solder connections between the thin film and the carrier are formed using a closed solder joining process. The spacer is used with laminate cards to create thermal stress release structures on portions of the cards carrying a thin film.

摘要翻译： 一种用于安装电子器件的结构，其使用插入在下面的载体和上覆薄膜之间的非导电兼容间隔物。 间隔件包括通孔的图形，其与载体和薄膜的相对表面上的相对互连匹配。 以这种方式，焊接连接可以在通孔中延伸，以将薄膜电连接到载体上并平滑地形。 在用于形成结构的相关方法中，薄膜建立在第一牺牲载体上，然后在第二牺牲载体上进一步处理，以防止其在其加工期间变形，膨胀或以其它方式受到不利影响。 使用封闭的焊料接合工艺形成薄膜和载体之间的焊接连接。 间隔件与层压卡一起使用以在携带薄膜的卡的部分上产生热应力释放结构。

公开(公告)号：US5950907A

公开(公告)日：1999-09-14

申请号：US825036

申请日：1997-03-26

申请人： Giulio DiGiacomo

发明人： Giulio DiGiacomo

IPC分类号： B23K35/26 ,  C22C11/06 ,  H01L21/60 ,  H05K3/34

CPC分类号： H01L24/81 ,  B23K35/268 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19043

摘要： An enhanced fatigue life solder comprising, by weight, about 1-3% tin, about 1-3% silver and the balance essentially lead is provided. The solder is particularly useful for joining electronic components and in particular for making C-4 interconnections. A method for using the solder to make electronic components and electric components made using the method are also provided.

摘要翻译： 提供了一种增强的疲劳寿命焊料，其包含重量约1-3％的锡，约1-3％的银和余量基本上为铅。 该焊料对于连接电子元件特别适用于制造C-4互连。 还提供了使用焊料制造使用该方法制造的电子部件和电气部件的方法。