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公开(公告)号：US20110013363A1
公开(公告)日：2011-01-20
申请号：US12502547
申请日：2009-07-14
IPC分类号： H05K7/20
CPC分类号： H05K7/20545 , H05K7/20727
摘要： A system for cooling processor assembly is disclosed which comprises a printed circuit board (PCB) with a plurality of heat emitting electronic components and a housing for each PCB with a heat collector. The heat collector is constructed in one-piece material covering the plurality of heat emitting electronic components through heat collecting areas with different heights adapted to the different heights of the electronic components as regard to the PCB surface wherein the heat collecting areas being in thermal contact with the electronic components.
摘要翻译： 公开了一种用于冷却处理器组件的系统，其包括具有多个发热电子部件的印刷电路板（PCB）和具有热收集器的每个PCB的壳体。 热收集器构造成一体式材料，其通过热电收集区域覆盖多个发热电子部件，这些热收集区域具有适合于电子部件相对于PCB表面的不同高度的不同高度，其中集热区域与 电子元件。
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公开(公告)号：US08111516B2
公开(公告)日：2012-02-07
申请号：US12502547
申请日：2009-07-14
IPC分类号： H05K7/20
CPC分类号： H05K7/20545 , H05K7/20727
摘要： A system for cooling processor assembly is disclosed which comprises a printed circuit board (PCB) with a plurality of heat emitting electronic components and a housing for each PCB with a heat collector. The heat collector is constructed in one-piece material covering the plurality of heat emitting electronic components through heat collecting areas with different heights adapted to the different heights of the electronic components as regard to the PCB surface wherein the heat collecting areas being in thermal contact with the electronic components.
摘要翻译： 公开了一种用于冷却处理器组件的系统，其包括具有多个发热电子部件的印刷电路板（PCB）和具有热收集器的每个PCB的壳体。 热收集器构造成一体式材料，其通过热电收集区域覆盖多个发热电子部件，这些热收集区域具有适合于电子部件相对于PCB表面的不同高度的不同高度，其中集热区域与 电子元件。
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3.发明授权Multi channel inter-processor coupling facility processing received commands stored in memory absent status error of channels 失效多通道处理器间耦合设备处理接收到的存储在存储器中的命令，而不存在通道的状态错误
公开(公告)号：US5574945A
公开(公告)日：1996-11-12
申请号：US477926
申请日：1995-06-07
申请人： David A. Elko , Gottfried A. Goldrian , Steven N. Goss , Thomas A. Gregg , Audrey A. Helffrich , Ambrose A. Verdibello, Jr.
发明人： David A. Elko , Gottfried A. Goldrian , Steven N. Goss , Thomas A. Gregg , Audrey A. Helffrich , Ambrose A. Verdibello, Jr.
IPC分类号： G06F11/00 , G06F15/163
CPC分类号： G06F11/141 , G06F11/0724 , G06F11/073 , G06F11/0772
摘要： A computer system with a coupling facility is provided with a plurality of processors and a plurality of intersystem channels coupled to the processors via a memory bus. The coupling facility includes a memory bus interface for the memory bus and a plurality of channels for coupling said channels to said processors. The memory bus interface includes an adapter with at least two hardware vectors provided for command detection, command isolation, and parallel testing of the error states of the intersystem channels, one which detects a command vector arrival, and a second which contains error state vector indicators. A LOCATE CHANNEL BUFFER (LCB) instruction is employed which performs a sense and reset operation on the command vector to identify and isolate a new command, and subsequently reads a vector of said error states vector indicator to determine the presence or absence of link errors.
摘要翻译： 具有耦合设施的计算机系统设置有多个处理器和经由存储器总线耦合到处理器的多个系统间通道。 耦合设备包括用于存储器总线的存储器总线接口和用于将所述通道耦合到所述处理器的多个通道。 存储器总线接口包括具有至少两个硬件向量的适配器，用于命令检测，命令隔离和并行测试系统间通道的错误状态，检测命令向量到达的错误状态，以及包含错误状态向量指示器的第二个 。 使用LOCATE CHANNEL BUFFER（LCB）指令，对命令向量执行感测和复位操作，以识别和隔离新命令，随后读取所述错误状态向量指示符的向量，以确定是否存在链路错误。
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公开(公告)号：US07961465B2
公开(公告)日：2011-06-14
申请号：US12502507
申请日：2009-07-14
CPC分类号： G06F1/20 , H01L23/473 , H01L2924/0002 , H05K7/20772 , H01L2924/00
摘要： A system for cooling processor assembly is disclosed which comprises printed circuit boards (PCB) with a plurality of heat emitting electronic components, and a housing for each PCB with a heat sink covering at least partly the heat emitting electronic components. The housing comprises a base portion to which are transferred heat emitted by the electronic components. Furthermore, the system for cooling processor comprises a cooling plate on which are fixed in series the different PCBs by directly positioning the base portion of the housings onto the cooling plate. The housings for each PCB system include at their base portions clamps to be inserted into corresponding guiding holes of the cooling plate when a PCB together with its housing is positioned onto the cooling plate at a specific therefor dedicated place defined by the guiding holes. Advantageously, the PCB together with its housing is pressed against the cooling plate alongside the base portion when fixed onto the cooling plate allowing thermal coupling between the housing and the cooling plate and a hot plugging of the PCB onto the cooling plate without requiring interrupting the cooling process applied to the cooling plate.
摘要翻译： 公开了一种用于冷却处理器组件的系统，其包括具有多个发热电子部件的印刷电路板（PCB）和用于每个PCB的壳体，其具有至少部分地覆盖发热电子部件的散热片。 壳体包括基部，其被电子部件传输的热量传递到该基部。 此外，用于冷却处理器的系统包括冷却板，通过将壳体的基部直接定位在冷却板上，在冷却板上串联固定不同的PCB。 每个PCB系统的壳体包括在其基部部分处，当PCB与其壳体一起被定位在冷却板上时，插入到冷却板的相应的引导孔中，该特定的导向孔由引导孔限定。 有利地，当固定在冷却板上时，PCB与其壳体一起被压靠在冷却板上，允许壳体和冷却板之间的热耦合，以及PCB在冷却板上的热插拔，而不需要中断冷却 工艺应用于冷却板。
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公开(公告)号：US20110013359A1
公开(公告)日：2011-01-20
申请号：US12502507
申请日：2009-07-14
IPC分类号： G06F1/20
CPC分类号： G06F1/20 , H01L23/473 , H01L2924/0002 , H05K7/20772 , H01L2924/00
摘要： A system for cooling processor assembly is disclosed which comprises printed circuit boards (PCB) with a plurality of heat emitting electronic components, and a housing for each PCB with a heat sink covering at least partly the heat emitting electronic components. The housing comprises a base portion to which are transferred heat emitted by the electronic components. Furthermore, the system for cooling processor comprises a cooling plate on which are fixed in series the different PCBs by directly positioning the base portion of the housings onto the cooling plate. The housings for each PCB system include at their base portions clamps to be inserted into corresponding guiding holes of the cooling plate when a PCB together with its housing is positioned onto the cooling plate at a specific therefor dedicated place defined by the guiding holes. Advantageously, the PCB together with its housing is pressed against the cooling plate alongside the base portion when fixed onto the cooling plate allowing thermal coupling between the housing and the cooling plate and a hot plugging of the PCB onto the cooling plate without requiring interrupting the cooling process applied to the cooling plate.
摘要翻译： 公开了一种用于冷却处理器组件的系统，其包括具有多个发热电子部件的印刷电路板（PCB）和用于每个PCB的壳体，其具有至少部分地覆盖发热电子部件的散热片。 壳体包括基部，其被电子部件传输的热量传递到该基部。 此外，用于冷却处理器的系统包括冷却板，通过将壳体的基部直接定位在冷却板上，在冷却板上串联固定不同的PCB。 每个PCB系统的壳体包括在其基部部分处，当PCB与其壳体一起被定位在冷却板上时，插入到冷却板的相应的引导孔中，该特定的导向孔由引导孔限定。 有利地，当固定在冷却板上时，PCB与其壳体一起被压靠在冷却板上，允许壳体与冷却板之间的热耦合，并且将PCB热插拔到冷却板上，而不需要中断冷却 工艺应用于冷却板。
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公开(公告)号：US07197540B2
公开(公告)日：2007-03-27
申请号：US10093920
申请日：2002-03-08
IPC分类号： G06F15/167
CPC分类号： G06F15/17393 , H04L49/101 , H04L49/1546 , H04L49/25 , H04L49/3018 , H04L49/3027
摘要： The present invention relates to switching technology in computer networks and in particular to a method and system for switching information packets through a m input, n output device. According to the invention it is proposed to temporarily buffer said packets according to a new, self-explanatory, preferred a linear addressing scheme in which a respective buffer location of consecutive stream packets results from a respective self-explanatory, or linear, respectively, incrementation of a buffer pointer. Preferably, a matrix of FIFO storage elements (10,11,12,13) having an input and an output crossbar can be used for implementing input/output paralleling modes (ILP,OLP) and multiple lanes and achieving address input/output scaling up to a single cycle.
摘要翻译： 本发明涉及计算机网络中的切换技术，特别涉及一种通过m输入输出设备切换信息分组的方法和系统。 根据本发明，提出根据一种新的，不言自明的优选的线性寻址方案临时缓冲所述分组，其中连续流分组的相应缓冲器位置分别由相应的不说明的或线性的递增 的缓冲区指针。 优选地，可以使用具有输入和输出交叉开关的FIFO存储元件（10,11,12,13）的矩阵来实现输入/输出并行模式（ILP，OLP）和多个通道，并且实现地址输入/输出放大 到一个周期。
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7.发明授权Method and arrangement for controlling the print current in metal paper printers 失效用于控制金属纸打印机中打印电流的方法和装置
公开(公告)号：US4395715A
公开(公告)日：1983-07-26
申请号：US296662
申请日：1981-08-27
摘要： For record carriers with a greatly varying thickness of the metal layer, the burn out process is effected dynamically with respect to the current strength. During the starting phase up to the beginning of the actual arcing phase a relatively high current is applied which is sufficient to burn out even thick metal layers. As burning out proceeds, the print current, after a particular arc voltage has been reached, is reduced in a short time, maintaining the arc and avoiding an undesirable burning out which would increase the print spot. For thinner metal layers the burn out current is correspondingly lower. The maximum burn out current is automatically adjusted to the thickness of the metal layer by measuring the arc voltage between electrode and metal surface of the record carrier. Suitable arrangements for controlling the burn out current are characterized by an (arc) voltage-controlled current control circuit.
摘要翻译： 对于具有大大变化的金属层厚度的记录载体，烧蚀过程相对于当前强度动态地实现。 在启动阶段直到实际电弧阶段的开始阶段，施加相对较高的电流，这足以烧掉甚至厚的金属层。 随着燃烧的进行，达到特定电弧电压之后的打印电流在短时间内减少，保持电弧并避免不期望的烧坏，这将增加打印点。 对于较薄的金属层，烧坏电流相应较低。 通过测量记录载体的电极和金属表面之间的电弧电压，自动调节最大烧坏电流至金属层的厚度。 用于控制烧坏电流的适当布置的特征在于（电弧）电压控制电流控制电路。
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