Bleachable materials for lithography
    1.
    发明授权
    Bleachable materials for lithography 有权
    用于光刻的可漂洗材料

    公开(公告)号:US07875408B2

    公开(公告)日:2011-01-25

    申请号:US11698182

    申请日:2007-01-25

    摘要: Compositions comprising photobleachable organic materials can be bleached by 193 nm light, and brought back to their original state by stimuli after exposure. (reversible photobleaching). We use these compositions in art-known contrast enhancement layers and as a part of a photoresist, especially in optical lithography processes for semiconductor fabrication. They may comprise polymers such as organo-silicon polymers, polymers comprising polymers of aromatic hydroxyl compounds such as phenol and naphthol such as phenol formaldehyde polymers and naphthol formaldehyde polymers styrene polymers and phenolic acrylate polymers or cyclic materials comprising: where the radicals “R” and “Y” represent organo, or substituted organo moieties, Structures I, II, and III represent basic organic skeletons and can be unsubstituted or substituted in any available position with any one or combinations of multiple substituents.

    摘要翻译: 包含可光漂白有机材料的组合物可以用193nm的光漂白,并且在曝光后通过刺激使其恢复到其初始状态。 (可逆光漂白)。 我们将这些组合物用于本领域已知的对比增强层和作为光致抗蚀剂的一部分,特别是在用于半导体制造的光刻工艺中。 它们可以包括聚合物,例如有机硅聚合物,包含芳族羟基化合物如苯酚和萘酚的聚合物的聚合物,例如苯酚甲醛聚合物和萘酚甲醛聚合物苯乙烯聚合物和酚醛丙烯酸酯聚合物或环状材料,其包括:其中基团“R”和 “Y”表示有机或取代的有机部分,结构I,II和III表示碱性有机骨架,并且可以在任何可用位置被未取代或被任何一个或多个取代基的组合取代。

    Method for lithography for optimizing process conditions
    4.
    发明授权
    Method for lithography for optimizing process conditions 失效
    光刻方法优化工艺条件

    公开(公告)号:US07767385B2

    公开(公告)日:2010-08-03

    申请号:US11371820

    申请日:2006-03-09

    IPC分类号: G03F7/20

    CPC分类号: G03F7/2022

    摘要: A method of lithography is disclosed, which allows for independent resist process optimization of two or more exposure steps that are performed on a single resist layer. By providing for a separate post-exposure bake after each resist exposure step, pattern resolution for each exposure can be optimized. The method can generally be used with different lithographic techniques, and is well-suited for hybrid lithography. It has been applied to the fabrication of a device, in which the active area and the gate levels are defined in separate mask levels using hybrid lithography with an e-beam source and a 248 nm source respectively. Conditions for post-exposure bakes after the two exposure steps are independently adjusted to provide for optimized results.

    摘要翻译: 公开了一种光刻方法,其允许在单个抗蚀剂层上执行的两个或多个曝光步骤的独立抗蚀剂工艺优化。 通过在每个抗蚀剂曝光步骤之后提供单独的曝光后烘烤,可以优化每个曝光的图案分辨率。 该方法通常可以用于不同的光刻技术,并且非常适用于混合光刻。 已经将其应用于器件的制造,其中使用具有电子束源和248nm源的混合光刻将有源面积和栅极电平限定在分开的掩模级中。 独立调整两次曝光步骤后暴露后烘烤条件以提供优化结果。

    Bleachable materials for lithography
    6.
    发明申请
    Bleachable materials for lithography 有权
    用于光刻的可漂洗材料

    公开(公告)号:US20080182178A1

    公开(公告)日:2008-07-31

    申请号:US11698182

    申请日:2007-01-25

    IPC分类号: G03C1/00 G03F1/00

    摘要: Compositions comprising photobleachable organic materials can be bleached by 193 nm light, and brought back to their original state by stimuli after exposure. (reversible photobleaching). We use these compositions in art-known contrast enhancement layers and as a part of a photoresist, especially in optical lithography processes for semiconductor fabrication. They may comprise polymers such as organosilicon polymers, polymers comprising polymers of aromatic hydroxyl compounds such as phenol and naphthol such as phenol formaldehyde polymers and naphthol formaldehyde polymers styrene polymers and phenolic acrylate polymers or cyclic materials comprising: where the radicals “R” and “Y” represent organo, or substituted organo moieties, Structures I, II, and III represent basic organic skeletons and can be unsubstituted or substituted in any available position with any one or combinations of multiple substituents.

    摘要翻译: 包含可光漂白有机材料的组合物可以用193nm的光漂白,并且在曝光后通过刺激使其恢复到其初始状态。 (可逆光漂白)。 我们将这些组合物用于本领域已知的对比增强层和作为光致抗蚀剂的一部分,特别是在用于半导体制造的光刻工艺中。 它们可以包括聚合物,例如有机硅聚合物,包含芳族羟基化合物如苯酚和萘酚的聚合物的聚合物,例如苯酚甲醛聚合物和萘酚甲醛聚合物苯乙烯聚合物和酚醛丙烯酸酯聚合物或环状材料,其包含:其中基团“R”和“Y “表示有机或取代的有机部分,结构I,II和III表示碱性有机骨架,并且可以在任何可用的位置被未取代或被任意一个或多个取代基的组合取代。

    Photoresist composition
    8.
    发明授权
    Photoresist composition 失效
    光刻胶组成

    公开(公告)号:US06806026B2

    公开(公告)日:2004-10-19

    申请号:US10159635

    申请日:2002-05-31

    IPC分类号: G03F7039

    摘要: A photoresist composition is provided that includes a polymer having at least one acrylate or methacrylate monomer having a formula: where R1 represents hydrogen (H), a linear or branched alkyl group of 1 to 20 carbons, or a semi- or perfluorinated linear or branched alkyl group of 1 to 20 carbons; and where R2 represents an unsubstituted aliphatic group or a substituted aliphatic group having zero or one trifluoromethyl (CF3) group attached to each carbon of the substituted aliphatic group, or a substituted or unsubstituted aromatic group; and where R3 represents hydrogen (H), methyl (CH3), trifluoromethyl (CF3), difluoromethyl (CHF2), fluoromethyl (CH2F), or a semi- or perfluorinated aliphatic chain; and where R4 represents trifluoromethyl (CF3), difluoromethyl (CHF2), fluoromethyl (CH2F), or a semi- or perfluorinated substituted or unsubstituted aliphatic group. A method of patterning a substrate using the photoresist composition is also provided herein.

    摘要翻译: 提供了一种光致抗蚀剂组合物,其包括具有至少一种具有下式的丙烯酸酯或甲基丙烯酸酯单体的聚合物:其中R 1表示氢(H),1-20个碳的直链或支链烷基,或半或全氟 1〜20个碳原子的直链或支链烷基; 并且其中R 2表示未取代的脂族基团或具有连接在取代的脂族基团的每个碳上的零个或一个三氟甲基(CF 3)基团的取代的脂族基团,或取代或未取代的芳族基团; 并且其中R 3表示氢(H),甲基(CH 3),三氟甲基(CF 3),二氟甲基(CHF 2),氟甲基(CH 2 F)或半或全氟化脂族链; 并且其中R 4表示三氟甲基(CF 3),二氟甲基(CHF 2),氟甲基(CH 2 F)或半或全氟取代或未取代的脂族基团。 本文还提供了使用光致抗蚀剂组合物图案化衬底的方法。