Abstract:
A lighting device may include: a mount, which is populated with at least one electronic component and with at least one semiconductor light source, a cover for covering at least one electronic component and at least one connecting element for fastening the cover to the mount, wherein the connecting element is connected to the mount by means of a non-latching connection and to the cover by means of a latching connection.
Abstract:
An illumination device may include a first heat sink; a carrier substrate, which is populated on its front side by at least one light source, and is attached by its rear side to the first heat sink; and a second heat sink, which is arranged essentially in front of the carrier substrate; wherein the at least one light source is arranged outside of the second heat sink.
Abstract:
A fastening element for fastening a light source substrate to a support. The fastening element is configured to be seated on the light source substrate, and includes at least one fastening portion for fastening to the support.
Abstract:
A lighting device (1; 21; 41) having at least one heat sink (5; 44) for cooling at least one light source, wherein the at least one heat sink (5; 44) comprises one or more at least bent sheet metal parts.
Abstract:
A cooling element for a lighting device having a plurality of cooling fins, wherein adjacent cooling fins delimit a cooling fin intermediate space with at least one air duct for connecting at least two cooling fin intermediate spaces.
Abstract:
A cooling element for a lighting device having a plurality of cooling fins, wherein adjacent cooling fins delimit a cooling fin intermediate space with at least one air duct for connecting at least two cooling fin intermediate spaces.
Abstract:
In various embodiments, a semiconductor lamp may include at least one semiconductor light source; a driver for operating the at least one semiconductor light source and at least one heat sink for cooling the at least one semiconductor light source and the driver; wherein the at least one heat sink may include a first heat sink, which is thermally connected to the at least one semiconductor light source and a second heat sink, which is thermally connected to the driver; wherein the first heat sink and the second heat sink are thermally insulated from one another.
Abstract:
In various embodiments, a lamp is provided. The lamp may include at least one solid light source which is installed on a carrier; an at least partially light-permeable vessel, which encloses the light source and the carrier in a gas-tight manner and a filling gas, which is enclosed in the vessel, wherein the filling gas is a mixture of at least one gas having high thermal conductivity and at least one gas having a different physical property.
Abstract:
A lighting device may include at least one partially light-transmissive cover which covers at least one light source, so that a hollow chamber is provided between the at least one light source and the cover, and at least one heat sink structure, which is at least one of at least partially arranged in the hollow chamber and is set at least partially into the cover.
Abstract:
A mounting structure for solid-state light sources, for example of the LED type, comprises a support board; a submount mounted on said support board and having at least one solid-state light radiation source mounted thereon; a drive board carrying drive circuitry for the light radiation source, the aforementioned drive board being mounted on the support board and extending peripherally with respect to the aforementioned submount; electrical interface connections between the submount and the drive board for connecting the light radiation source to the drive circuitry; and mechanical and thermal interface connections between the submount and the support board.