公开(公告)号：US20130127484A1

公开(公告)日：2013-05-23

申请号：US13587407

申请日：2012-08-16

申请人： Guiheum Choi ,  Minsu Kang ,  Teaseog Um ,  Seunghee Lee

发明人： Guiheum Choi ,  Minsu Kang ,  Teaseog Um ,  Seunghee Lee

IPC分类号： G01R31/26

CPC分类号： G01R31/2886 ,  G01R1/0466 ,  G01R31/2893

摘要： An insert for a semiconductor package testing apparatus comprises a body having a pocket constructed and arranged to receive the semiconductor package, and a sliding tool slidingly positioned on the body. The sliding tool is constructed and arranged to open and close the pocket as a result of a sliding motion of the sliding tool relative to the body.

摘要翻译： 用于半导体封装测试装置的插入件包括具有构造和布置成容纳半导体封装的凹穴的主体和滑动地定位在主体上的滑动工具。 滑动工具被构造和布置成由于滑动工具相对于身体的滑动运动而打开和关闭口袋。

公开(公告)号：US09024649B2

公开(公告)日：2015-05-05

申请号：US13587407

申请日：2012-08-16

申请人： Guiheum Choi ,  Minsu Kang ,  Teaseog Um ,  Seunghee Lee

发明人： Guiheum Choi ,  Minsu Kang ,  Teaseog Um ,  Seunghee Lee

IPC分类号： G01R31/00 ,  G01R31/28 ,  G01R1/04

CPC分类号： G01R31/2886 ,  G01R1/0466 ,  G01R31/2893

摘要： An insert for a semiconductor package testing apparatus comprises a body having a pocket constructed and arranged to receive the semiconductor package, and a sliding tool slidingly positioned on the body. The sliding tool is constructed and arranged to open and close the pocket as a result of a sliding motion of the sliding tool relative to the body.

摘要翻译： 用于半导体封装测试装置的插入件包括具有构造和布置成容纳半导体封装的凹穴的主体和滑动地定位在主体上的滑动工具。 滑动工具被构造和布置成由于滑动工具相对于身体的滑动运动而打开和关闭口袋。