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公开(公告)号：US08550031B2
公开(公告)日：2013-10-08
申请号：US13524854
申请日：2012-06-15
Applicant: Tetsuya Ishikawa , Rick J. Roberts , Helen R. Armer , Leon Volfovski , Jay D. Pinson , Michael Rice , David H. Quach , Mohsen S. Salek , Robert Lowrance , John A. Backer , William Tyler Weaver , Charles Carlson , Chongyang Wang , Jeffrey Hudgens , Harald Herchen , Brian Lue
Inventor： Tetsuya Ishikawa , Rick J. Roberts , Helen R. Armer , Leon Volfovski , Jay D. Pinson , Michael Rice , David H. Quach , Mohsen S. Salek , Robert Lowrance , John A. Backer , William Tyler Weaver , Charles Carlson , Chongyang Wang , Jeffrey Hudgens , Harald Herchen , Brian Lue
IPC: B05C13/02 , C23C14/00 , H01L21/677
CPC classification number: H01L21/67225 , G03B27/32 , G03D13/006 , G03F7/40 , G05B19/41825 , G05B2219/40476 , G05B2219/45031 , G05B2219/49137 , H01L21/67109 , H01L21/6715 , H01L21/67161 , H01L21/67173 , H01L21/67178 , H01L21/67184 , H01L21/6719 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67754 , H01L21/6831 , H01L21/6838 , H01L21/68707 , H01L22/26 , Y02P90/087 , Y10S414/135 , Y10S414/136 , Y10T29/53187 , Y10T29/5323
Abstract: Embodiments of the invention generally include a robot assembly comprising a robot operable to position a substrate at one or more points within a plane, and a motion assembly having a motor operable to position the robot in a direction generally parallel to a first direction. The motion assembly comprises a robot support interface having the robot coupled thereto, and one or more walls that form an interior region in which the motor is enclosed. The walls define an elongated opening through which the robot support interface travels, and the motor is operable to move the robot support interface laterally in the elongated opening. The motion assembly further comprises one or more fan assemblies that are in fluid communication with the interior region. The fan assemblies are operable to create a subatmospheric pressure in the interior region thereby causing gas to flow through the elongated opening into the interior region.
Abstract translation: 本发明的实施例通常包括机器人组件，其包括可操作以在平面内的一个或多个点处定位衬底的机器人，以及具有可操作以将机器人沿大致平行于第一方向的方向定位的电动机的运动组件。 运动组件包括机器人支撑接口，其具有耦合到其上的机器人，以及一个或多个壁，其形成电机被封闭的内部区域。 壁限定了机器人支撑接口行进的细长开口，电动机可操作以在细长的开口中横向移动机器人支撑界面。 运动组件还包括与内部区域流体连通的一个或多个风扇组件。 风扇组件可操作以在内部区域中产生低于大气压的压力，从而使气体通过细长的开口流入内部区域。
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公开(公告)号：US08215262B2
公开(公告)日：2012-07-10
申请号：US12254784
申请日：2008-10-20
Applicant: Tetsuya Ishikawa , Rick J. Roberts , Helen R. Armer , Leon Volfovski , Jay D. Pinson , Michael Rice , David H. Quach , Mohsen S. Salek , Robert Lowrance , John A. Backer , William Tyler Weaver , Charles Carlson , Chongyang Wang , Jeffrey Hudgens , Harald Herchen , Brian Lu
Inventor： Tetsuya Ishikawa , Rick J. Roberts , Helen R. Armer , Leon Volfovski , Jay D. Pinson , Michael Rice , David H. Quach , Mohsen S. Salek , Robert Lowrance , John A. Backer , William Tyler Weaver , Charles Carlson , Chongyang Wang , Jeffrey Hudgens , Harald Herchen , Brian Lu
IPC: B05C13/02 , C23C14/00 , H01L21/677
CPC classification number: H01L21/67225 , G03B27/32 , G03D13/006 , G03F7/40 , G05B19/41825 , G05B2219/40476 , G05B2219/45031 , G05B2219/49137 , H01L21/67109 , H01L21/6715 , H01L21/67161 , H01L21/67173 , H01L21/67178 , H01L21/67184 , H01L21/6719 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67754 , H01L21/6831 , H01L21/6838 , H01L21/68707 , H01L22/26 , Y02P90/087 , Y10S414/135 , Y10S414/136 , Y10T29/53187 , Y10T29/5323
Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, a cluster tool for processing a substrate includes a first processing rack, a first robot assembly and a second robot assembly operable to transfer substrates to substrate processing chambers in the first processing rack, and a horizontal motion assembly. The horizontal motion assembly includes one or more walls that form an interior region in which a motor is enclosed. The one or more walls defining an elongated opening through which a robot support interface travels, the robot support interface supporting a robot of the horizontal motion assembly.
Abstract translation: 实施例通常提供使用具有增加的系统吞吐量，增加的系统可靠性的多腔室处理系统（例如，集群工具）来处理衬底的装置和方法，在集群工具中处理的衬底具有更可重复的晶片历史，并且还 集群工具具有更小的系统占用空间。 在一个实施例中，用于处理衬底的簇工具包括第一处理架，第一机器人组件和可操作以将衬底传送到第一处理架中的衬底处理室的第二机器人组件和水平运动组件。 水平运动组件包括形成电动机被封闭的内部区域的一个或多个壁。 所述一个或多个壁限定机器人支撑接口行进的细长开口，所述机器人支撑界面支撑水平运动组件的机器人。
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公开(公告)号：US20080199282A1
公开(公告)日：2008-08-21
申请号：US12106824
申请日：2008-04-21
Applicant: Tetsuya Ishikawa , Rick J. Roberts , Helen R. Armer , Leon Volfovski , Jay D. Pinson , Michael Rice , David H. Quach , Mohsen S. Salek , Robert Lowrance , John A. Backer , William Tyler Weaver , Charles Carlson , Chongyang Wang , Jeffrey Hudgens , Harald Herchen , Brian Lue
Inventor： Tetsuya Ishikawa , Rick J. Roberts , Helen R. Armer , Leon Volfovski , Jay D. Pinson , Michael Rice , David H. Quach , Mohsen S. Salek , Robert Lowrance , John A. Backer , William Tyler Weaver , Charles Carlson , Chongyang Wang , Jeffrey Hudgens , Harald Herchen , Brian Lue
IPC: H01L21/677
CPC classification number: H01L21/67225 , G03B27/32 , G03D13/006 , G03F7/40 , G05B19/41825 , G05B2219/40476 , G05B2219/45031 , G05B2219/49137 , H01L21/67109 , H01L21/6715 , H01L21/67161 , H01L21/67173 , H01L21/67178 , H01L21/67184 , H01L21/6719 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67754 , H01L21/6831 , H01L21/6838 , H01L21/68707 , H01L22/26 , Y02P90/087 , Y10S414/135 , Y10S414/136 , Y10T29/53187 , Y10T29/5323
Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool). In one embodiment, the cluster tool is adapted to perform a track lithography process in which a photosensitive material is applied to a substrate, patterned in a stepper/scanner, and then removed in a developing process completed in the cluster tool. In one embodiment of the cluster tool, substrates are grouped together in groups of two or more for transfer or processing to improve system throughput, reduce the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, and thus increase system reliability. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.
Abstract translation: 实施例通常提供使用多室处理系统（例如，集群工具）来处理衬底的装置和方法。 在一个实施例中，簇工具适于执行轨道光刻工艺，其中感光材料被施加到基板上，在步进/扫描器中图案化，然后在以集群工具完成的显影过程中去除。 在集群工具的一个实施例中，将基板分成两组或更多组以进行传送或处理，以提高系统吞吐量，减少机器人必须在处理室之间传送一批衬底的移动次数，从而减少 提高系统可靠性。 实施例还提供了用于增加衬底转移过程以减少系统停机时间的可靠性的方法和装置。
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公开(公告)号：US07049606B2
公开(公告)日：2006-05-23
申请号：US10698726
申请日：2003-10-30
Applicant: Alexandros T. Demos , Hari K. Ponnekanti , Jun Zhao , Helen R. Armer
Inventor： Alexandros T. Demos , Hari K. Ponnekanti , Jun Zhao , Helen R. Armer
IPC: H01J37/30
CPC classification number: H01J37/317 , H01J3/025 , H01J37/077
Abstract: One embodiment of the present invention is an electron beam treatment apparatus that includes: (a) a chamber; (b) a cathode having a surface of relatively large area that is exposed to an inside of the chamber; (c) an anode having holes therein that is disposed inside the chamber and spaced apart from the cathode by a working distance; (d) a wafer holder disposed inside the chamber facing the anode; (e) a source of negative voltage whole output is applied to the cathode to provide a cathode voltage; (f) a source of voltage whose output is applied to the anode; (g) a gas inlet adapted to admit gas into the chamber at an introduction rate; and (h) a pump adapted to exhaust gas from the chamber at an exhaust rate, the introduction rate and the exhaust rate providing a gas pressure in the chamber; wherein values of cathode voltage, gas pressure, and the working distance are such that there is no arcing between the cathode and anode and the working distance is greater than an electron mean free path.
Abstract translation: 本发明的一个实施例是一种电子束处理装置，包括：（a）室; （b）具有暴露于所述室内部的相对较大面积表面的阴极; （c）其中具有孔的阳极，其设置在室内并与阴极间隔开工作距离; （d）设置在面向阳极的腔室内的晶片保持器; （e）将负电压全输出源施加到阴极以提供阴极电压; （f）其输出端施加到阳极的电压源; （g）气体入口，其适于以引入速率将气体引入所述腔室; 以及（h）适于以排气速度从所述室排出气体的泵，所述引入速率和排气速率在所述室中提供气体压力; 其中阴极电压，气体压力和工作距离的值使得阴极和阳极之间没有电弧，并且工作距离大于电子平均自由程。
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公开(公告)号：US20120180983A1
公开(公告)日：2012-07-19
申请号：US13411120
申请日：2012-03-02
Applicant: TETSUYA ISHIKAWA , RICK J. ROBERTS , HELEN R. ARMER , LEON VOLFOVSKI , JAY D. PINSON , MICHAEL RICE , DAVID H. QUACH , MOHSEN S. SALEK , ROBERT LOWRANCE , JOHN A. BACKER , WILLIAM TYLER WEAVER , CHARLES CARLSON , CHONGYANG WANG , JEFFREY HUDGENS , HARALD HERCHEN , BRIAN LUE
Inventor： TETSUYA ISHIKAWA , RICK J. ROBERTS , HELEN R. ARMER , LEON VOLFOVSKI , JAY D. PINSON , MICHAEL RICE , DAVID H. QUACH , MOHSEN S. SALEK , ROBERT LOWRANCE , JOHN A. BACKER , WILLIAM TYLER WEAVER , CHARLES CARLSON , CHONGYANG WANG , JEFFREY HUDGENS , HARALD HERCHEN , BRIAN LUE
IPC: H01L21/324 , H01L21/477 , F25B29/00 , B25J11/00 , H01L21/677
CPC classification number: H01L21/67225 , G03B27/32 , G03D13/006 , G03F7/40 , G05B19/41825 , G05B2219/40476 , G05B2219/45031 , G05B2219/49137 , H01L21/67109 , H01L21/6715 , H01L21/67161 , H01L21/67173 , H01L21/67178 , H01L21/67184 , H01L21/6719 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67754 , H01L21/6831 , H01L21/6838 , H01L21/68707 , H01L22/26 , Y02P90/087 , Y10S414/135 , Y10S414/136 , Y10T29/53187 , Y10T29/5323
Abstract: The present invention generally provides a cluster tool for processing a substrate. In one embodiment, the cluster tool comprises at least one processing rack, which comprises a first plurality of substrate processing chambers that are positioned adjacent to each other and aligned in a first direction, a second plurality of substrate processing chambers that are positioned adjacent to each other and adjacent to at least one of the first plurality of substrate processing chambers, the second plurality of substrate processing chambers being positioned in a second direction relative to the first direction, a first shuttle robot movable in the first direction for moving substrates between each of the first plurality of substrate processing chambers, and a second shuttle robot movable in the second direction for moving substrates between each of the second plurality of substrate processing chambers.
Abstract translation: 本发明通常提供一种用于处理衬底的簇工具。 在一个实施例中，集群工具包括至少一个处理架，其包括彼此相邻并且沿第一方向排列的第一多个基板处理室，与第二多个基板处理室相邻定位的第二多个基板处理室 第二多个基板处理室相对于第一方向位于第二方向上，第一梭形机器人可在第一方向上移动，以在每个基板处理室中的每一个之间移动基板 第一多个基板处理室，以及可沿第二方向移动的第二梭形机器人，用于在每个第二多个基板处理室之间移动基板。
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公开(公告)号：US08019467B2
公开(公告)日：2011-09-13
申请号：US11775355
申请日：2007-07-10
Applicant: Steve S. Hongkham , Eric A. Englhardt , Michael R. Rice , Helen R. Armer , Chongyang Chris Wang
Inventor： Steve S. Hongkham , Eric A. Englhardt , Michael R. Rice , Helen R. Armer , Chongyang Chris Wang
IPC: G06F7/00
CPC classification number: H01L21/67745 , H01L21/67173 , H01L21/67178 , H01L21/67276
Abstract: Methods and apparatus for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput and repeatable wafer processing history are provided. In one embodiment a first substrate is transferred from a first position to a second position and then the first substrate is transferred from the second position to a third position using a first robot. A second substrate is transferred from a first position to a second position and then the second substrate is transferred from the second position to a third position using a second robot. The movement of the first and second robots is synchronized so that the movement from the first position to the second position by the first and second robot is performed within a first time interval.
Abstract translation: 提供了使用具有增加的系统吞吐量和可重复的晶片处理历史的多室处理系统（例如，集群工具）处理衬底的方法和装置。 在一个实施例中，第一衬底从第一位置转移到第二位置，然后使用第一机器人将第一衬底从第二位置转移到第三位置。 第二基底从第一位置转移到第二位置，然后使用第二机器人将第二基底从第二位置转移到第三位置。 第一机器人和第二机器人的移动被同步，使得在第一时间间隔内执行由第一和第二机器人从第一位置到第二位置的移动。
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公开(公告)号：US07522968B2
公开(公告)日：2009-04-21
申请号：US11775365
申请日：2007-07-10
Applicant: Steve S. Hongkham , Eric A. Englhardt , Michael R. Rice , Helen R. Armer , Chongyang Chris Wang
Inventor： Steve S. Hongkham , Eric A. Englhardt , Michael R. Rice , Helen R. Armer , Chongyang Chris Wang
IPC: G06F19/00
CPC classification number: H01L21/67276
Abstract: Methods and apparatus for increasing the processing throughput of multiple lots of semiconductor wafers through a cluster tool while maintaining a constant wafer history for each lot are provided. A first lot of wafers containing one through n-th wafers is introduced into a cluster tool containing one or more processing chambers. The first lot of wafers is processed for a first time period. A second lot of wafers containing one through n-th wafers is introduced into the cluster tool prior to completion of the first time period, wherein the second lot is introduced so as to minimize a time gap between the n-th wafer of the first lot of wafers and the first wafer of the second lot of wafers while maintaining a first constant wafer history for each wafer within the first lot and maintaining a second constant wafer history for each wafer in the second lot.
Abstract translation: 提供了通过集群工具增加多批半导体晶片的处理能力的方法和装置，同时保持每批的恒定的晶片历史。 包含一个至第n个晶片的第一批晶片被引入到包含一个或多个处理室的簇工具中。 第一批晶圆首次处理。 在第一时间段完成之前，将包含一个至第n个晶片的第二批晶片引入到该簇工具中，其中引入第二批以最小化第一批第n个晶片之间的时间间隔 的晶片和第二批晶片的第一晶片，同时保持第一批内的每个晶片的第一恒定晶片历史，并为第二批中的每个晶片保持第二恒定的晶片历史。
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公开(公告)号：US07018941B2
公开(公告)日：2006-03-28
申请号：US10830203
申请日：2004-04-21
Applicant: Zhenjiang Cui , Josephine J. Chang , Alexandros T. Demos , Reza Arghavani , Derek R. Witty , Helen R. Armer , Girish A. Dixit , Hichem M'Saad
Inventor： Zhenjiang Cui , Josephine J. Chang , Alexandros T. Demos , Reza Arghavani , Derek R. Witty , Helen R. Armer , Girish A. Dixit , Hichem M'Saad
IPC: H01L21/31 , H01L21/461
CPC classification number: H01L21/31633 , H01L21/02126 , H01L21/02216 , H01L21/02274 , H01L21/02348 , H01L21/02351
Abstract: A method of depositing a low dielectric constant film on a substrate and post-treating the low dielectric constant film is provided. The post-treatment includes rapidly heating the low dielectric constant film to a desired high temperature and then rapidly cooling the low dielectric constant film such that the low dielectric constant film is exposed to the desired high temperature for about five seconds or less. In one aspect, the post-treatment also includes exposing the low dielectric constant film to an electron beam treatment and/or UV radiation.
Abstract translation: 提供了一种在衬底上沉积低介电常数膜并对低介电常数膜进行后处理的方法。 后处理包括将低介电常数膜快速加热到期望的高温，然后快速冷却低介电常数膜，使得低介电常数膜暴露于所需的高温约5秒或更短。 一方面，后处理还包括将低介电常数膜暴露于电子束处理和/或UV辐射。
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公开(公告)号：US20120320361A1
公开(公告)日：2012-12-20
申请号：US13524854
申请日：2012-06-15
Applicant: Tetsuya Ishikawa , Rick J. Roberts , Helen R. Armer , Leon Volfovski , Jay D. Pinson , Michael Rice , David H. Quach , Mohsen S. Salek , Robert Lowrance , John A. Backer , William Tyler Weaver , Charles Carlson , Chongyang Wang , Jeffrey Hudgens , Harald Herchem , Brian Lue
Inventor： Tetsuya Ishikawa , Rick J. Roberts , Helen R. Armer , Leon Volfovski , Jay D. Pinson , Michael Rice , David H. Quach , Mohsen S. Salek , Robert Lowrance , John A. Backer , William Tyler Weaver , Charles Carlson , Chongyang Wang , Jeffrey Hudgens , Harald Herchem , Brian Lue
IPC: G03B27/58
CPC classification number: H01L21/67225 , G03B27/32 , G03D13/006 , G03F7/40 , G05B19/41825 , G05B2219/40476 , G05B2219/45031 , G05B2219/49137 , H01L21/67109 , H01L21/6715 , H01L21/67161 , H01L21/67173 , H01L21/67178 , H01L21/67184 , H01L21/6719 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67754 , H01L21/6831 , H01L21/6838 , H01L21/68707 , H01L22/26 , Y02P90/087 , Y10S414/135 , Y10S414/136 , Y10T29/53187 , Y10T29/5323
Abstract: Embodiments of the invention generally include a robot assembly comprising a robot operable to position a substrate at one or more points within a plane, and a motion assembly having a motor operable to position the robot in a direction generally parallel to a first direction. The motion assembly comprises a robot support interface having the robot coupled thereto, and one or more walls that form an interior region in which the motor is enclosed. The walls define an elongated opening through which the robot support interface travels, and the motor is operable to move the robot support interface laterally in the elongated opening. The motion assembly further comprises one or more fan assemblies that are in fluid communication with the interior region. The fan assemblies are operable to create a subatmospheric pressure in the interior region thereby causing gas to flow through the elongated opening into the interior region.
Abstract translation: 本发明的实施例通常包括机器人组件，其包括可操作以在平面内的一个或多个点处定位衬底的机器人，以及具有可操作以将机器人沿大致平行于第一方向的方向定位的电动机的运动组件。 运动组件包括机器人支撑接口，其具有耦合到其上的机器人，以及一个或多个壁，其形成电机被封闭的内部区域。 壁限定了机器人支撑接口行进的细长开口，电动机可操作以在细长的开口中横向移动机器人支撑界面。 运动组件还包括与内部区域流体连通的一个或多个风扇组件。 风扇组件可操作以在内部区域中产生低于大气压的压力，从而使气体通过细长的开口流入内部区域。
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公开(公告)号：US08181596B2
公开(公告)日：2012-05-22
申请号：US12254750
申请日：2008-10-20
Applicant: Tetsuya Ishikawa , Rick J. Roberts , Helen R. Armer , Leon Volfovski , Jay D. Pinson , Michael Rice , David H. Quach , Mohsen S. Salek , Robert Lowrance , John A. Backer , William Tyler Weaver , Charles Carlson , Chongyang Wang , Jeffrey Hudgens , Harald Herchen , Brian Lu
Inventor： Tetsuya Ishikawa , Rick J. Roberts , Helen R. Armer , Leon Volfovski , Jay D. Pinson , Michael Rice , David H. Quach , Mohsen S. Salek , Robert Lowrance , John A. Backer , William Tyler Weaver , Charles Carlson , Chongyang Wang , Jeffrey Hudgens , Harald Herchen , Brian Lu
IPC: B05C13/02 , C23C14/00 , H01L21/677
CPC classification number: H01L21/67225 , G03B27/32 , G03D13/006 , G03F7/40 , G05B19/41825 , G05B2219/40476 , G05B2219/45031 , G05B2219/49137 , H01L21/67109 , H01L21/6715 , H01L21/67161 , H01L21/67173 , H01L21/67178 , H01L21/67184 , H01L21/6719 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67754 , H01L21/6831 , H01L21/6838 , H01L21/68707 , H01L22/26 , Y02P90/087 , Y10S414/135 , Y10S414/136 , Y10T29/53187 , Y10T29/5323
Abstract: An apparatus for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, a smaller system footprint, and a more repeatable wafer history. Embodiments provide for a cluster tool comprising first and second processing racks, each having two or more vertically stacked substrate processing chambers, a first robot assembly able to access the first processing rack from a first side, a second robot assembly able to access the first processing rack from a second side and the second processing rack from a first side, a third robot assembly able to access the second processing rack from a second side, and a fourth robot assembly able to access the first and second processing racks and to load substrates in a cassette.
Abstract translation: 一种使用具有增加的系统吞吐量，增加的系统可靠性，更小的系统占用面积和更可重复的晶片历史的多室处理系统（例如，集群工具）处理衬底的设备。 实施例提供了一种集群工具，其包括第一和第二处理机架，每个具有两个或更多个垂直堆叠的衬底处理室，能够从第一侧接近第一处理架的第一机器人组件，能够访问第一处理的第二机器人组件 从第二侧起第二机架和从第二侧起第二处理齿条的第三机器人组件，以及能够从第二侧进入第二处理齿条的第三机器人组件，以及能够接近第一和第二处理机架并将基板装入的第四机器人组件 一个盒子。
