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316 条记录 (耗时 0.028 秒)

    Flatulence cleaning apparatus
    1.
    发明申请
    Flatulence cleaning apparatus 有权

    公开(公告)号：US20220133936A1

    公开(公告)日：2022-05-05

    申请号：US16974174

    申请日：2020-11-03

    申请人： Hong Min Kim

    发明人： Hong Min Kim

    IPC分类号： A61L9/014 ,  B08B5/04 ,  B08B3/08 ,  B01D53/04 ,  A61L9/14

    摘要： An apparatus is for cleaning flatulence of obnoxious odor, infectious virus and/or bacteria, and other contaminants. It can be mounted underneath a seat or bed provided with a flatulence collecting means. Flatulence is drawn through a series of chambers with charcoal provided in a first chamber for removing the obnoxious odor, copper wool provided in a second chamber having plurality of maze-like chambers for capturing and exterminating virus and/or bacteria; and a final chamber having sanitizing mist for eliminating contaminants.

    Semiconductor packages
    4.
    发明授权
    Semiconductor packages 有权

    公开(公告)号：US10090278B2

    公开(公告)日：2018-10-02

    申请号：US15393754

    申请日：2016-12-29

    申请人： Sang-Sick Park ,  Geol Nam ,  Tae Hong Min ,  Jihwan Hwang

    发明人： Sang-Sick Park ,  Geol Nam ,  Tae Hong Min ,  Jihwan Hwang

    IPC分类号： H01L25/065 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L25/00

    摘要： A semiconductor package includes a plurality of semiconductor chips on a substrate. The semiconductor chips include a first semiconductor chip, a second semiconductor chip, and a third semiconductor chip that are sequentially stacked on the substrate. The semiconductor package further includes a plurality of non-conductive layers between the substrate and the first semiconductor chip and between adjacent semiconductor chips among the semiconductor chips. The semiconductor chips include smaller widths as a distance from the substrate increases. Each of the non-conductive layers includes an extension protruding outward from a side surface of an overlying one of the semiconductor chips.

    Method of determining touch coordinate and touch panel assembly for performing the same
    7.
    发明授权
    Method of determining touch coordinate and touch panel assembly for performing the same 有权
    确定触摸坐标和触摸面板组件执行相同的方法

    公开(公告)号：US09507457B2

    公开(公告)日：2016-11-29

    申请号：US13016122

    申请日：2011-01-28

    申请人： Won-Ki Hong ,  Jee-Hong Min ,  Seong-Mo Hwang ,  Il-Ho Lee

    发明人： Won-Ki Hong ,  Jee-Hong Min ,  Seong-Mo Hwang ,  Il-Ho Lee

    IPC分类号： G06F3/045 ,  G06F3/041

    CPC分类号： G06F3/0416 ,  G06F3/045 ,  G06F2203/04104

    摘要： A method of determining a touch coordinate in a touch panel includes detecting a touch cell among a plurality of touch cells, wherein the plurality of touch cells are defined by a plurality of areas in the touch panel in which a first touch electrode and a second touch electrode overlap with each other, detecting a touch position in the detected touch cell based on a first electrical signal measured at least one of a plurality of terminals of the first and second touch electrodes, determining a number of touches based on a distance between a first touch and a second touch, determining expected touch coordinates corresponding to the number of touches, and determining the touch coordinate based on a second electrical signal measured at least one of the plurality of terminals of the first and second touch electrodes and the expected touch coordinates.

    摘要翻译： 一种确定触摸面板中的触摸坐标的方法包括检测多个触摸单元中的触摸单元，其中多个触摸单元由触摸面板中的多个区域限定，其中第一触摸电极和第二触摸 电极彼此重叠，基于测量到第一和第二触摸电极的多个端子中的至少一个端子的第一电信号来检测检测到的触摸单元中的触摸位置，基于第一和第二触摸电极之间的距离来确定触摸的数量 触摸和第二触摸，确定对应于触摸次数的预期触摸坐标，以及基于测量到第一和第二触摸电极的多个终端中的至少一个的第二电信号和预期触摸坐标来确定触摸坐标。

    CHIP-STACKED SEMICONDUCTOR PACKAGE
    8.
    发明申请
    CHIP-STACKED SEMICONDUCTOR PACKAGE 有权
    芯片堆叠半导体封装

    公开(公告)号：US20160056101A1

    公开(公告)日：2016-02-25

    申请号：US14818682

    申请日：2015-08-05

    申请人： Young-kun JEE ,  Tae-hong MIN ,  Sun-kyoung SEO

    发明人： Young-kun JEE ,  Tae-hong MIN ,  Sun-kyoung SEO

    IPC分类号： H01L23/498 ,  H01L25/065 ,  H01L23/31

    CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/3178 ,  H01L23/481 ,  H01L2224/16145 ,  H01L2224/73204 ,  H01L2225/06513

    摘要： A chip-stacked semiconductor package including a first chip having a plurality of first real bump pads and a plurality of first dummy bump pads, a second chip on the first chip, the second chip including a plurality of real bumps and a plurality of bridge dummy bumps, the plurality of real bumps electrically connected to the plurality of first real bump pads, the plurality of bridge dummy bumps connected to the plurality of first dummy bump pads, and a sealing member sealing the first chip and the second chip may be provided.

    摘要翻译： 一种芯片堆叠半导体封装，包括具有多个第一实际凸块焊盘和多个第一虚拟凸块焊盘的第一芯片，第一芯片上的第二芯片，所述第二芯片包括多个实际凸块和多个桥模 可以提供电连接到多个第一真实凸块焊盘的多个真实凸块，连接到多个第一虚拟凸块焊盘的多个桥接虚拟凸起以及密封第一芯片和第二芯片的密封构件。

    System and method for an efficient query sort of a data stream with duplicate key values
    9.
    发明授权
    System and method for an efficient query sort of a data stream with duplicate key values 有权
    具有重复键值的数据流的高效查询排序的系统和方法

    公开(公告)号：US09235622B2

    公开(公告)日：2016-01-12

    申请号：US12394572

    申请日：2009-02-27

    申请人： Yefim Shuf ,  Hong Min ,  Hubertus Franke ,  Allan B. Lebovitz

    发明人： Yefim Shuf ,  Hong Min ,  Hubertus Franke ,  Allan B. Lebovitz

    IPC分类号： G06F17/30

    CPC分类号： G06F17/30486

    摘要： An apparatus and method for efficiently performing a query sort on a data set with duplicate key values is disclosed. The method includes identifying unique key values for a key in a data set after determining that a number of duplicate key values for the key exceed a predefined threshold. The method also includes recording an association of each unique key value with a record in the data set and sorting unique key values. The method further includes storing the unique key values in a sorted order, wherein each unique key value is associated with an appropriate record in the data set.

    摘要翻译： 公开了一种用于对具有重复键值的数据集有效执行查询排序的装置和方法。 该方法包括在确定密钥的重复密钥值的数量超过预定阈值之后，识别数据集中的密钥的唯一密钥值。 该方法还包括记录每个唯一密钥值与数据集中的记录的关联并排序唯一密钥值。 该方法还包括以排序顺序存储唯一键值，其中每个唯一键值与数据集中的适当记录相关联。

    Multilayer optical sheet module
    10.
    发明授权
    Multilayer optical sheet module 有权
    多层光学片模块

    公开(公告)号：US09052498B2

    公开(公告)日：2015-06-09

    申请号：US13708930

    申请日：2012-12-08

    申请人： Jee Hong Min ,  Young Il Kim ,  Sung Sik Cho ,  Woo Jong Lee ,  Tae Jun Lee ,  Hee Jeong Kim ,  Joon Hwan Hwang ,  Sung Min Cho ,  Oh Hyun Kwon ,  Jin Gil Jeong

    发明人： Jee Hong Min ,  Young Il Kim ,  Sung Sik Cho ,  Woo Jong Lee ,  Tae Jun Lee ,  Hee Jeong Kim ,  Joon Hwan Hwang ,  Sung Min Cho ,  Oh Hyun Kwon ,  Jin Gil Jeong

    IPC分类号： G02B27/28 ,  G02B27/00 ,  B32B3/30 ,  G02B5/02 ,  G02B5/04 ,  F21V8/00

    CPC分类号： G02B27/00 ,  B32B3/30 ,  G02B5/0231 ,  G02B5/0278 ,  G02B5/045 ,  G02B6/0053 ,  G02B27/28 ,  Y10T428/24562

    摘要： There is disclosed a multilayer optical sheet module including an upper optical sheet comprising a first structural pattern projected upward; a lower optical sheet disposed under the upper optical sheet, the lower optical sheet comprising a second structural pattern projected toward the upper optical sheet; and an adhesion layer provided between the upper optical sheet and the lower optical sheet, wherein the second structural pattern includes a light transmitting part having a traverse cross section getting smaller along an upward direction; and an embedded part continuously connected to an upper portion of the light transmitting part, with a predetermined portion embedded in the adhesion layer, and a circumference of a cross section possessed by the embedded part, contacting with the adhesion layer, is larger than a circumference of a virtual cross section locus formed by extending the light transmitting part upward, with a continuous slope.

    摘要翻译： 公开了一种多层光学片模块，其包括上部光学片，其包括向上突出的第一结构图案; 下部光学片，设置在上部光学片下方，下部光学片包括向上部光学片突出的第二结构图案; 以及设置在上部光学片和下部光学片之间的粘合层，其中第二结构图案包括具有横向横截面沿着向上方向变小的透光部分; 以及嵌入部，其与所述透光部的上部连续地连接，所述预定部嵌入所述粘接层，所述嵌入部所具有的与所述粘接层接触的截面的周长大于圆周 通过以连续的斜率向上延伸透光部而形成的虚拟横截面轨迹。