TAPE FOR ELECTRONIC DEVICES WITH REINFORCED LEAD CRACK
    2.
    发明申请
    TAPE FOR ELECTRONIC DEVICES WITH REINFORCED LEAD CRACK 审中-公开
    带有加强导线突起的电子设备带

    公开(公告)号:US20130308289A1

    公开(公告)日:2013-11-21

    申请号:US13982658

    申请日:2011-10-12

    Abstract: Provided is a tape for electronic devices with lead crack and a method of manufacturing the tape. According to the present invention, by forming a bending portion on a narrow circuit pattern to be connected from an inner lead to an outer lead and further forming the bending portion within a resin application portion, crack occurred in a narrow wiring width can be avoided. The tape may include a first lead and a second lead formed on a dielectric substrate and a bending portion formed on one of the first lead and the second lead wherein the bending portion is formed within a resin application portion.

    Abstract translation: 提供了一种具有铅裂的电子设备的带子和一种制造带子的方法。 根据本发明,通过在从内引线到外引线连接的窄电路图案上形成弯曲部,并且在树脂施加部内进一步形成弯曲部,可以避免窄布线宽度的裂纹。 带可以包括形成在电介质基板上的第一引线和第二引线以及形成在第一引线和第二引线之一上的弯曲部分,其中弯曲部分形成在树脂施加部分内。

    CARRIER TAPE FOR TAB-PACKAGE AND MANUFACTURING METHOD THEREOF
    4.
    发明申请
    CARRIER TAPE FOR TAB-PACKAGE AND MANUFACTURING METHOD THEREOF 有权
    用于包装及其制造方法的载体带

    公开(公告)号:US20120186862A1

    公开(公告)日:2012-07-26

    申请号:US13188882

    申请日:2011-07-22

    Abstract: The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.

    Abstract translation: 本发明涉及一种制造TAB龙头的方法。 该方法包括在基膜上形成具有输入/输出端子图案的电路图案区域,并且在具有用于露出基底膜的链轮孔的输送区域处形成曝光区域。 因此,本发明提供一种TAB带,其通过基本上防止金属颗粒的产生而形成暴露区域,从而通过选择性地蚀刻和去除在 TAB带,并且具有链轮孔,并且通过在不具有通过蚀刻形成在其上的电路图案的预定区域部分地去除基底膜来防止短路。

    Carrier tape for tab-package and manufacturing method thereof
    9.
    发明授权
    Carrier tape for tab-package and manufacturing method thereof 有权
    用于片状包装的载带及其制造方法

    公开(公告)号:US09480152B2

    公开(公告)日:2016-10-25

    申请号:US13188882

    申请日:2011-07-22

    Abstract: The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.

    Abstract translation: 本发明涉及一种制造TAB龙头的方法。 该方法包括在基膜上形成具有输入/输出端子图案的电路图案区域,并且在具有用于露出基底膜的链轮孔的输送区域处形成曝光区域。 因此,本发明提供一种TAB带,其通过基本上防止金属颗粒的产生而形成暴露区域,从而通过选择性地蚀刻和去除在 TAB带,并且具有链轮孔,并且通过在不具有通过蚀刻形成在其上的电路图案的预定区域部分地去除基底膜来防止短路。

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