Assembly comprising a container and a cap

    公开(公告)号:US12116174B2

    公开(公告)日:2024-10-15

    申请号:US17155839

    申请日:2021-01-22

    IPC分类号: B65D41/04 B65D47/18

    摘要: An assembly consisting of a container (1) having a nozzle (17) for dispensing a substance contained in the container (1), and a cap (19) for covering the nozzle (17), the container having a first connection region (14) which can be connected to a corresponding second connection region (25) of the cap (19), the connection regions (14, 25) being selected such that the container (1) and the cap (19) are connected at least partially by a rotational movement of the container (1) and the cap (19) relative to one another, the cap (19) having an inner chamber (20) surrounded by a casing (22), which chamber is open at one end so as to receive the nozzle (17), the casing (22) having an end face (21) at its open end, and the container (1) having a cover face (12) which points toward the cap and has a cover edge (11), the connection regions (14, 25) being selected and the end face (21) being adapted to the cover face (12) and the cover edge (11) thereof such that, when the container (1) and the cap (19) are connected, the end face (21) comes into contact with the cover face (12) when the cap (19) is in a first intermediate position and, when the container (1) and the cap (19) are rotated further relative to one another, the end face (21) is pressed against the cover face (12) and the cap (19) ultimately reaches a second end position, the end face (21) passing over the cover edge (11).

    EMI SHIELDING ADHESIVE COMPOSITION AND ITS USE

    公开(公告)号:US20240318053A1

    公开(公告)日:2024-09-26

    申请号:US18436560

    申请日:2024-02-08

    发明人: Yukari Kikuchi

    摘要: An object of the present invention is to provide an acrylic resin-containing adhesive composition having high EMI shielding performance, wherein the composition provides an EMI shielding cured product that has high impact resistant and is sufficiently cured at a low temperature, and when the composition is applied to a metal surface, the adhesion surface has high pull strength. The present invention relates to an EMI shielding adhesive composition comprising (a) a conductive filler, (b) a (meth)acrylic resin, (c) a tackifier, (d) a bismaleimide and (e) a radical initiator.