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公开(公告)号：US08482931B2
公开(公告)日：2013-07-09
申请号：US12632270
申请日：2009-12-07
CPC分类号： H05K1/144 , H05K2201/042 , H05K2201/10189 , H05K2201/10515 , H05K2201/2036
摘要： A package structure includes a first printed wiring board having mounted on a top surface a plurality of electronic components including at least one first electronic component, a second printed wiring board stacked on the top surface side of the first printed wiring board, and a plurality of connecting members for mechanically connecting the first and second printed wiring boards while maintaining a constant gap therebetween, the connecting members including a first cured resin for bonding a top surface of the at least one first electronic component to a bottom surface of the second printed wiring board.
摘要翻译： 封装结构包括：第一印刷线路板，其安装在顶表面上，多个电子部件包括至少一个第一电子部件，堆叠在第一印刷线路板的顶面侧的第二印刷线路板，以及多个 连接构件，用于机械地连接第一和第二印刷线路板，同时保持它们之间的恒定的间隙，所述连接构件包括用于将至少一个第一电子部件的顶表面接合到第二印刷线路板的底表面的第一固化树脂 。
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2.发明授权Surface mount adhesive, mounting structure including the same, and method for producing mounting structure 失效表面贴装粘合剂，包括其的安装结构以及安装结构的制造方法公开(公告)号：US08481629B2
公开(公告)日：2013-07-09
申请号：US12431303
申请日：2009-04-28
CPC分类号： H05K3/305 , C08K3/34 , C09J163/00 , H05K2201/0209 , H05K2201/0266 , H05K2201/10689 , Y02P70/613
摘要： A surface mount adhesive includes an epoxy resin, a curing agent, an accelerator, a first filler, and a second filler. The second filler has a specific gravity 1.1 to 3 times that of the first filler, and the second filler has a hardness higher than that of the first filler. The first filler has a largest particle size of 1 to 100 μm, and the second filler has a largest particle size of 1 to 100 μm, a specific gravity of 1.7 to 4.5, and a revised Mohs hardness of 2 to 12. The weight ratio of the first filler to the second filler is from 1:3 to 3:1, and the surface mount adhesive has a specific gravity of 1.2 to 1.5. When the surface mount adhesive is dispensed, dispensing failures are suppressed, and dispensing stability is improved.
摘要翻译： 表面贴装粘合剂包括环氧树脂，固化剂，促进剂，第一填料和第二填料。 第二填料的比重为第一填料的比重为1.1〜3倍，第二填料的硬度比第一填料的硬度高。 第一填料的最大粒度为1-100μm，第二填料的最大粒径为1-100μm，比重为1.7〜4.5，修饰的莫氏硬度为2〜12。重量比 的第一填料与第二填料的比例为1:3至3:1，表面粘合剂的比重为1.2至1.5。 当表面贴装粘合剂被分配时，抑制分配故障，并提高分配稳定性。
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公开(公告)号：US08378472B2
公开(公告)日：2013-02-19
申请号：US12738430
申请日：2008-10-16
IPC分类号： H01L23/22
CPC分类号： H01L21/563 , H01L23/13 , H01L23/3121 , H01L24/16 , H01L25/0655 , H01L2224/16 , H01L2224/73203 , H01L2224/83102 , H01L2224/83855 , H01L2224/92125 , H01L2924/01004 , H01L2924/01019 , H01L2924/15311 , H01L2924/15313 , H05K1/0224 , H05K3/28 , H05K3/3452 , H05K2201/0969 , H05K2201/0989 , H05K2201/10977
摘要： In order to easily inject underfill resin and perform molding with reliability, groove sections are formed on a surface of a circuit board such that the ends of the groove sections extend to semiconductor elements. Low-viscosity underfill resin applied dropwise is guided by the groove sections and flows between the circuit board and the semiconductor elements. The underfill resin hardly expands to regions outside the semiconductor elements.
摘要翻译： 为了容易地注入底部填充树脂并且可靠地进行模制，在电路板的表面上形成槽部，使得槽部的端部延伸到半导体元件。 滴下的低粘度底部填充树脂由槽部引导，在电路基板与半导体元件之间流动。 底部填充树脂几乎不扩展到半导体元件外部的区域。
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4.发明申请公开(公告)号：US20110110050A1
公开(公告)日：2011-05-12
申请号：US12675080
申请日：2008-10-21
CPC分类号： H05K3/305 , H01L21/563 , H01L23/295 , H01L25/0657 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2225/06517 , H01L2225/0652 , H01L2225/06572 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/12044 , H01L2924/15151 , H01L2924/18301 , H05K2201/09036 , H05K2201/09072 , H05K2201/10545 , H05K2201/10674 , H05K2201/10734 , H05K2201/10977 , Y02P70/613 , Y10T29/49139 , H01L2924/00
摘要： A structure with electronic component mounted therein includes a wiring board on which an electronic component is mounted at least on its first face, resin provided at least between the electronic component and the wiring board, and a plurality of holes formed in the wiring board at region corresponding to a mounting position of the electronic component. The holes are filled with the resin. This suppresses warpage of the structure with electronic component mounted therein, and also improves reliability by reducing a stress applied to a bonding section between the wiring board and the electronic component.
摘要翻译： 安装有电子部件的结构包括：至少在其第一面上安装有电子部件的布线基板，至少设置在电子部件和布线基板之间的树脂，以及在布线基板上形成的多个孔 对应于电子部件的安装位置。 孔用树脂填充。 这抑制了安装有电子部件的结构的翘曲，并且还通过减小施加到布线板和电子部件之间的接合部的应力来提高可靠性。
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5.发明申请ELECTRICALLY CONDUCTIVE PASTE, AND ELECTRICAL AND ELECTRONIC DEVICE COMPRISING THE SAME 有权电导电胶，以及包括其的电气和电子设备公开(公告)号：US20110049439A1
公开(公告)日：2011-03-03
申请号：US12744994
申请日：2008-11-21
CPC分类号： H05K3/321 , H01B1/22 , H05K2201/0272 , H05K2203/0425 , Y10T29/49128 , Y10T29/4913
摘要： Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.
摘要翻译： 公开了一种导电性糊剂，其能够通过使用导电性糊料，在电路板的电子部件的实施中使导电性糊剂固化后的接合部中形成的导电路径中的空隙生长水平降低， 其含有减少量的粘度调节/触变性添加剂。 选择具有不同熔点和不同平均粒径的两种含Sn的低熔点合金颗粒作为用于导电浆料的导电填料组分，并将两种合金颗粒以预定的比例混合使用。
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公开(公告)号：US07785500B2
公开(公告)日：2010-08-31
申请号：US12092453
申请日：2006-10-31
CPC分类号： C09J9/02 , H01B1/22 , H05K3/321 , H05K2201/0218 , H05K2201/0272 , H05K2203/0425
摘要： The present invention provides an electrically conductive adhesive which prevents migration and sulfuration of a metal component in electronic component mounting. The electrically conductive adhesive includes a thermosetting resin and metal filler particles dispersed in the thermosetting resin. It is possible to use, as the metal filler particles, metal filler particles having a composition including an alloy of Ag with at least one metal selected from the group consisting of Sn, Cu, In, Bi and Ni, a mixture of such metal filler particles and Ag filler particles, and metal filler particles including Ag filler particles and a coating layer formed on the surface of the Ag filler particles using a metal such as Sn.
摘要翻译： 本发明提供一种导电粘合剂，其防止电子部件安装中的金属成分的迁移和硫化。 导电粘合剂包括热固性树脂和分散在热固性树脂中的金属填料颗粒。 作为金属填料颗粒，可以使用包含Ag合金和至少一种选自Sn，Cu，In，Bi和Ni的金属的组成的金属填料颗粒，将这种金属填料 颗粒和Ag填料颗粒，以及包括Ag填料颗粒的金属填料颗粒和使用Sn等金属在Ag填料颗粒的表面上形成的涂层。
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7.发明申请公开(公告)号：US20100002401A1
公开(公告)日：2010-01-07
申请号：US12496017
申请日：2009-07-01
CPC分类号： H05K3/288 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K3/284 , H05K2201/09872 , H05K2201/0989 , H05K2203/0783 , H05K2203/1322 , Y10T29/49146 , H01L2224/0401
摘要： The electronic component packaging structure having, as the moisture-proof coating layer, a polymer material that has sufficient moisture-proof performance and can be relatively easily peeled off from a circuit board and/or electronic components when repairing can be provided.The electronic component packaging structure of the invention comprises a circuit board, electronic components mounted on the circuit board and a moisture-proof coating layer covering the electronic components. The moisture-proof coating layer is constituted from a polymer material coating having at least two layers of a lower layer and an upper layer, and the polymer material forming the lower layer has higher swelling property and/or volubility to a repairing solvent that is selected from among hydrocarbon-based solvents than the polymer material forming the upper layer.
摘要翻译： 作为防湿涂层的电子部件包装结构体可以提供具有充分的防潮性能并且在修理时可以相对容易地从电路板和/或电子部件剥离的聚合物材料。 本发明的电子部件封装结构包括电路板，安装在电路板上的电子部件和覆盖电子部件的防湿涂层。 防潮涂层由具有至少两层下层和上层的聚合物材料涂层构成，并且形成下层的聚合物材料对于所选择的修补溶剂具有较高的溶胀性和/或挥发性 与烃类溶剂相比，形成上层的聚合物材料。
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公开(公告)号：US20090116203A1
公开(公告)日：2009-05-07
申请号：US12261368
申请日：2008-10-30
CPC分类号： H05K3/3436 , H01L24/16 , H01L2224/10175 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/30105 , H05K1/111 , H05K3/3452 , H05K3/3489 , H05K2201/09036 , H05K2201/09781 , H05K2201/09809 , H05K2201/0989 , H05K2201/10977 , Y02P70/611 , Y02P70/613
摘要： A mounting structure is provided that can suppress flux from spreading, secure a connecting strength between a circuit board and an electronic component with underfill, and achieve a stable electrical connection between lands and terminals. The mounting structure is configured with a flat electronic component and a circuit board, and a plurality of lands provided on the undersurface of the electronic component and a plurality of terminals provided on the mounting surface of the circuit board so as to correspond to the plurality of lands are bonded with solder. The circuit board includes a means for holding flux separated from the solder in the proximity of at least one of the plurality of terminals.
摘要翻译： 提供了一种可以抑制磁通扩散的安装结构，通过底部填充确保电路板和电子部件之间的连接强度，并实现焊盘和端子之间的稳定的电连接。 安装结构具有扁平的电子部件和电路板，以及设置在电子部件的下表面上的多个焊盘以及设置在电路基板的安装面上的多个端子，以对应于多个 焊盘用焊料粘合。 电路板包括用于保持在焊料分离的焊剂在至少一个端子附近的装置。
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公开(公告)号：US08450859B2
公开(公告)日：2013-05-28
申请号：US13000391
申请日：2009-10-27
CPC分类号： H01L23/49894 , H01L21/563 , H01L23/49816 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/10126 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13566 , H01L2224/16058 , H01L2224/16225 , H01L2224/73203 , H01L2224/812 , H01L2224/81801 , H01L2224/83192 , H01L2224/83194 , H01L2224/83855 , H01L2224/83856 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/3436 , H05K3/3452 , H05K3/3463 , H05K3/3484 , H05K2201/10977 , H05K2201/10992 , Y02P70/613 , H01L2924/01083 , H01L2924/00014 , H01L2924/0105
摘要： A semiconductor device mounted structure includes a semiconductor device having a plurality of first electrodes, a circuit board having a plurality of second electrodes, a plurality of bumps respectively formed on the plurality of first electrodes, a plurality of bonding members respectively positioned between the bumps and the second electrodes to electrically connect the first electrodes to the second electrodes via the bumps, and a plurality of reinforcing resin members respectively positioned around the bonding members so as to cover at least the bonding members and bonding regions between the bonding members and the bumps. Adjacent reinforcing resin members are spaced away from each other so as not to have contact with each other without being in contact with the semiconductor device. This semiconductor device mounted structure enhances the reliability of joints in impact resistance and makes it easy to repair it.
摘要翻译： 半导体器件安装结构包括具有多个第一电极的半导体器件，具有多个第二电极的电路板，分别形成在多个第一电极上的多个凸块，分别位于凸块之间的多个接合部件和 所述第二电极经由所述凸块将所述第一电极与所述第二电极电连接，以及分别位于所述接合部件周围的多个增强树脂部件，以至少覆盖所述接合部件和所述凸块之间的接合部件和接合部。 相邻的增强树脂构件彼此间隔开，以便不与半导体器件接触而彼此不接触。 该半导体器件安装结构提高了接头在耐冲击性方面的可靠性，并且使其易于修复。
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公开(公告)号：US08293370B2
公开(公告)日：2012-10-23
申请号：US12376370
申请日：2007-08-03
CPC分类号： H05K3/321 , B23K35/025 , B23K35/26 , B23K35/262 , B23K35/264 , B23K35/3613 , B23K35/3618 , B23K35/362 , H01B1/22 , H05K3/3484 , Y10T403/479 , Y10T428/31678
摘要： Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. A solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. A conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material.
摘要翻译： 公开了一种焊接材料，其能够在安装电子部件时实现较低的安装温度。 还公开了焊膏和导电粘合剂。 具体公开了具有由Sn，Bi和In构成的基本组成的焊料。 该焊料材料还可含有选自Cu，Ge和Ni中的至少一种金属。 可以通过将助焊剂成分混合到焊料材料中来获得能够实现低温安装的焊膏。 可以通过将树脂成分混合到焊料材料中来获得能够实现低温安装的导电粘合剂。
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