公开(公告)号：US06818097B2

公开(公告)日：2004-11-16

申请号：US10199465

申请日：2002-07-22

申请人： Akira Yamaguchi ,  Hideshi Tomita

发明人： Akira Yamaguchi ,  Hideshi Tomita

IPC分类号： H05H100

CPC分类号： H01J37/3255 ,  C08K3/04 ,  C08L79/08 ,  C08L2666/20 ,  C09J163/00 ,  H01J37/32009

摘要： A plasma etching electrode for dry etching devices for production of semiconductor devices. The plasma etching electrode is prevented from contamination with impurities, provides good thermal and electrical conductance and heat resistance at the joint between the electrode plate and pedestal (or supporting ring), and hence improves etching characteristics and silicon wafer yield. The highly heat-resistant plasma etching electrode includes an electrode plate of silicon which is supported by and uniformly joined to a pedestal by an adhesive. The pedestal is made of graphite. The adhesive includes an epoxy resin containing polycarbodiimide resin and carbon powder. A dry etching device including the electrode is also described.

摘要翻译： 一种用于制造半导体器件的干蚀刻装置的等离子体蚀刻电极。 防止等离子体蚀刻电极被杂质污染，在电极板和基座（或支撑环）之间的接合处提供良好的导热性和耐热性，因此提高了蚀刻特性和硅晶片的产量。 高耐热等离子体蚀刻电极包括由粘合剂支撑并均匀地接合到基座的硅的电极板。 基座由石墨制成。 粘合剂包括含有聚碳二亚胺树脂和碳粉末的环氧树脂。 还描述了包括电极的干蚀刻装置。

公开(公告)号：US06524711B2

公开(公告)日：2003-02-25

申请号：US09953190

申请日：2001-09-17

申请人： Yasuo Imashiro ,  Takahiko Ito ,  Hideshi Tomita ,  Norimasa Nakamura

发明人： Yasuo Imashiro ,  Takahiko Ito ,  Hideshi Tomita ,  Norimasa Nakamura

IPC分类号： B32B2738

CPC分类号： C08G18/025 ,  C08L79/00 ,  C09J7/22 ,  C09J7/28 ,  C09J7/35 ,  C09J2463/00 ,  C09J2479/08 ,  H05K1/0326 ,  H05K3/4626 ,  Y10T428/249994 ,  Y10T428/2896 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31529 ,  Y10T428/31721 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/04

摘要： A thermosetting resin composition comprising: a polycarbodiimide obtained from organic polyisocyanates containing at least one kind of aromatic polyisocyanate, an epoxy resin, a curing agent for epoxy resin, and a rubber component, wherein the proportions of the individual components are 100 parts by weight of the polycarbodiimide, 30 to 150 parts by weight of the epoxy resin, 1.0 equivalent or less, relative to the epoxy resin, of the curing agent for epoxy resin, and 0.1 to 20 parts by weight of the rubber component which is, in a semi-cured state (a B-stage), free from resin cracking or powder detaching when bent and therefore easy to handle and, after curing, has good electrical properties and heat resistance.

摘要翻译： 一种热固性树脂组合物，其包含：由含有至少一种芳族多异氰酸酯的有机多异氰酸酯，环氧树脂，环氧树脂固化剂和橡胶组分得到的聚碳化二亚胺，其中各组分的比例为100重量份 聚环氧树脂30〜150重量份，环氧树脂用固化剂1.0当量以下，环氧树脂用固化剂1.0当量，0.1〜20重量份的橡胶成分， 固化状态（B阶段），弯曲时无树脂破裂或粉末分离，易于处理，固化后具有良好的电气性能和耐热性。

公开(公告)号：US6140454A

公开(公告)日：2000-10-31

申请号：US292004

申请日：1999-04-15

申请人： Satoshi Amano ,  Hideshi Tomita

发明人： Satoshi Amano ,  Hideshi Tomita

IPC分类号： C08G18/02 ,  C08G59/62 ,  C08L61/06 ,  C08L63/00 ,  C08L79/00 ,  C09J161/06 ,  C09J163/00 ,  C09J179/00 ,  C09K3/10 ,  H01L23/29 ,  H01L23/31 ,  C08G18/58

CPC分类号： H01L23/293 ,  C08L61/06 ,  C08L63/00 ,  C08L79/00 ,  C09J161/06 ,  C09J163/00 ,  C09J179/00 ,  C09K3/10 ,  C09K2200/0247 ,  C09K2200/0647 ,  C09K2200/0667 ,  C09K2200/067 ,  H01L2924/0002

摘要： The present invention provides an adhesive resin composition including an epoxy resin, a phenolic resin and a polycarbodiimide resin, wherein the proportion of the polycarbodiimide resin is 0.5 to 20 parts by weight per 100 parts by weight of the total of the epoxy resin and the phenolic resin, and a sealing resin composition including an epoxy resin, a phenolic resin, a polycarbodiimide resin and an inorganic filler, wherein the proportion of the polycarbodiimide resin is 0.5 to 20 parts by weight per 100 parts by weight of the total of the epoxy resin and the phenolic resin and the proportion of the inorganic filler is 60 to 95 parts by weight of the total weight of the composition. The resin compositions of the present invention are superior in heat resistance and long-term stability and, moreover, have excellent adhesivity even to new materials such as Ni alloys and the like.

摘要翻译： 本发明提供了包含环氧树脂，酚醛树脂和聚碳二亚胺树脂的粘合剂树脂组合物，其中聚碳二亚胺树脂的比例为每100重量份环氧树脂和酚醛树脂总量的0.5-20重量份 树脂，以及包含环氧树脂，酚醛树脂，聚碳化二亚胺树脂和无机填料的密封树脂组合物，其中聚碳二亚胺树脂的比例为每100重量份总共的环氧树脂的0.5〜20重量份 酚醛树脂和无机填料的比例为组合物总重量的60〜95重量份。 本发明的树脂组合物的耐热性和长期稳定性优异，而且即使对于Ni合金等新材料也具有优异的粘接性。

公开(公告)号：US06485833B1

公开(公告)日：2002-11-26

申请号：US09692423

申请日：2000-10-20

申请人： Yasuo Imashiro ,  Takahiko Ito ,  Hideshi Tomita ,  Norimasa Nakamura

发明人： Yasuo Imashiro ,  Takahiko Ito ,  Hideshi Tomita ,  Norimasa Nakamura

IPC分类号： B32B2738

CPC分类号： B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B27/34 ,  B32B27/38 ,  B32B2363/00 ,  B32B2379/08 ,  B32B2457/08 ,  H05K3/4626 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/31511 ,  Y10T428/31522 ,  Y10T428/31678 ,  Y10T428/31681

摘要： A resin-coated metal foil comprising: a metal foil, and a resin layer formed on the metal foil by coating and semi-curing, on the metal foil, a composition containing a polycarbodiimide resin having a number-average molecular weight of 3,000 to 50,000, an epoxy resin, the proportions of the polycarbodiimide resin and the epoxy resin being 100 parts by weight and 20 to 2000 parts by weight, respectively. In the resin-coated metal foil, the resin is superior in handleability and storage stability in a semi-cured state and, after complete cure, high in heat resistance and superior in dielectric properties.

摘要翻译： 1.一种树脂被覆金属箔，其特征在于，在金属箔上含有金属箔和在该金属箔上形成的树脂层，所述组合物含有数均分子量为3,000〜50,000的聚碳化二亚胺树脂， 环氧树脂，聚碳化二亚胺树脂和环氧树脂的比例分别为100重量份和20至2000重量份。 在树脂被覆金属箔中，树脂在半固化状态下的处理性和保存稳定性优异，完全固化后，耐热性高，介电性优异。

公开(公告)号：US06333101B1

公开(公告)日：2001-12-25

申请号：US08141359

申请日：1993-10-28

申请人： Yasuo Imashiro ,  Kazuo Saito ,  Satoshi Amano ,  Takahiko Itoh ,  Hideshi Tomita ,  Ikuo Takahashi

发明人： Yasuo Imashiro ,  Kazuo Saito ,  Satoshi Amano ,  Takahiko Itoh ,  Hideshi Tomita ,  Ikuo Takahashi

IPC分类号： B32B300

CPC分类号： C09J163/00 ,  C08L63/00 ,  C08L75/04 ,  C09J179/00 ,  Y10S525/907 ,  Y10T428/249967 ,  Y10T428/249982 ,  Y10T428/31515

摘要： The present invention provides a method of adhering adherends, including (i) providing at least two adherends at least one of which is made of a flexible material, and (ii) joining the adherends together to form a structure using a heat-resistant adhesive composition containing mainly 1) a polycarbodiimide resin and an epoxy resin, or 2) a polycarbodiimide resin, an epoxy resin and a curing agent for the polycarbodiimide resin, or 3) a polycarbodiimide resin, an epoxy resin and a curing agent for the epoxy resin. The heat-resistant adhesive composition can be applied under mild conditions, and the resultant structure has excellent heat resistance and chemical resistance, and has superior adhesion strength particularly at high temperatures.

摘要翻译： 本发明提供一种附着被粘物的方法，包括（i）提供至少两个被粘物，其至少一个由柔性材料制成，以及（ii）将被粘物结合在一起以形成使用耐热粘合剂组合物的结构 主要含有1）聚碳化二亚胺树脂和环氧树脂，或2）聚碳化二亚胺树脂，环氧树脂和聚碳二亚胺树脂的固化剂，或3）聚碳二亚胺树脂，环氧树脂和环氧树脂的固化剂。 耐热粘合剂组合物可以在温和条件下使用，所得结构具有优异的耐热性和耐化学性，并且特别是在高温下具有优异的粘合强度。

公开(公告)号：US07253246B2

公开(公告)日：2007-08-07

申请号：US11133343

申请日：2005-05-20

申请人： Ikuo Takahashi ,  Hideshi Tomita

发明人： Ikuo Takahashi ,  Hideshi Tomita

IPC分类号： C08G64/00

CPC分类号： C08G18/10 ,  C08G18/44 ,  C08G18/4854 ,  H05K1/0346 ,  H05K1/0393 ,  Y10T428/31504 ,  C08G18/095 ,  C08G18/025

摘要： A thermosetting polycarbodiimide copolymer of the present invention comprises in a molecule thereof, a soft segment containing at least one residue formed by removing opposite functional end groups of polytetramethylene ether glycol, polyether block amide and polyalkylene carbonate diol having at least two mixed alkylene chains selected from the group consisting of hexamethylene, pentamethylene and tetramethylene; and a hard segment made of polycarbodiimide bonded to the soft segment through at least one bond selected from the group consisting of an urethane bond, a urea bond and an amide bond. The thermosetting polycarbodiimide copolymer can exhibit not only a high heat resistance and a good flexibility, but also an excellent flexing resistance (resistance to 180° bending),and can be, therefore, suitably used in applications of various electronic parts, for example, as materials of base films or cover-lay films for flexible wiring boards, or adhesive films.

摘要翻译： 本发明的热固性聚碳化二亚胺共聚物在其分子中包含含有至少一个残基的软链段，其通过除去具有至少两个混合亚烷基链的聚四亚甲基醚二醇，聚醚嵌段酰胺和聚亚烷基碳酸酯二醇的相对官能端基形成， 由六亚甲基，五亚甲基和四亚甲基组成的组; 以及由通过选自氨基甲酸酯键，脲键和酰胺键的至少一个键与软链段结合的聚碳化二亚胺制成的硬链段。 热固性聚碳化二亚胺共聚物不仅具有高的耐热性和良好的柔软性，而且还具有优异的抗弯曲性（抗弯曲性为180°），因此可以适用于各种电子部件的应用，例如 用于柔性布线板或粘合膜的基膜或覆盖膜的材料。

公开(公告)号：US06486266B2

公开(公告)日：2002-11-26

申请号：US09924305

申请日：2001-08-08

申请人： Satoshi Amano ,  Hideshi Tomita

发明人： Satoshi Amano ,  Hideshi Tomita

IPC分类号： C08L7900

CPC分类号： C08L79/00 ,  C08G18/025 ,  C08G59/4042 ,  C08L63/00 ,  C09D163/00 ,  C08L2666/04

摘要： A modified carbodiimide resin obtainable by reacting a carbodiimide resin comprising a repeating unit represented by the general formula: —(NCN—R1)- wherein R1 represents a divalent organic group, with an aromatic diamine represented by the general formula: H2N—R2—NH2 wherein R2 represents a divalent organic group having a benzene ring, and a thermosetting resin composition comprising the modified carbodiimide resin and an epoxy resin.

摘要翻译： 通过使包含由以下通式表示的重复单元的碳二亚胺树脂与其中由通式H2N-R2-NH2表示的芳族二胺反应得到的改性碳化二亚胺树脂： - （NCN-R1） - 其中R 1表示二价有机基团 其中R2表示具有苯环的二价有机基团，和包含改性碳二亚胺树脂和环氧树脂的热固性树脂组合物。

公开(公告)号：US06440258B1

公开(公告)日：2002-08-27

申请号：US09400970

申请日：1999-09-22

申请人： Yasuo Imashiro ,  Takahiko Ito ,  Hideshi Tomita ,  Norimasa Nakamura

发明人： Yasuo Imashiro ,  Takahiko Ito ,  Hideshi Tomita ,  Norimasa Nakamura

IPC分类号： C09J16310

CPC分类号： H01L24/29 ,  C08L63/00 ,  C08L79/08 ,  C08L2666/20 ,  C09J7/10 ,  C09J163/00 ,  C09J179/00 ,  C09J2203/326 ,  C09J2463/00 ,  C09J2479/08 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15787 ,  H01L2924/19042 ,  H05K3/305 ,  H05K2201/0154 ,  H05K2201/0209 ,  Y02P70/613 ,  Y10T428/2817 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/2878 ,  Y10T428/2896 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/0532 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention provides an adhesive film for semiconductor package, which comprises a polycarbodiimide resin, an epoxy resin and an inorganic filler, wherein the polycarbodiimide resin has a polystyrene-reduced number-average molecular weight of 3,000 to 50,000 as measured by gel permeation chromatography, the epoxy resin is contained in an amount of 20 to 150 parts by weight per 100 parts by weight of the polycarbodiimide resin, and the inorganic filler is contained in an amount of 30 to 70% by weight based on the total resin content.

摘要翻译： 本发明提供了一种半导体封装用粘合膜，其包含聚碳二亚胺树脂，环氧树脂和无机填料，其中聚碳二亚胺树脂通过凝胶渗透色谱法测定的聚苯乙烯换算的数均分子量为3,000〜50,000， 相对于100重量份聚碳二亚胺树脂，环氧树脂的含量为20〜150重量份，相对于总树脂含量，含有30〜70重量％的无机填料。

公开(公告)号：US06387505B1

公开(公告)日：2002-05-14

申请号：US09399151

申请日：1999-09-20

申请人： Yasuo Imashiro ,  Takahiko Ito ,  Hideshi Tomita ,  Norimasa Nakamura

发明人： Yasuo Imashiro ,  Takahiko Ito ,  Hideshi Tomita ,  Norimasa Nakamura

IPC分类号： B32B2738

CPC分类号： H05K1/0346 ,  C08G18/025 ,  C08G59/4042 ,  C08L79/00 ,  Y10S428/901 ,  Y10T428/24994 ,  Y10T428/249994 ,  Y10T428/31511 ,  C08L63/00

摘要： The present invention provides a prepreg which is composed of a mixture of a polycarbodiimide resin and an epoxy resin and which has a film shape; a prepreg composed of (1) a mixture of a polycarbodiimide resin and an epoxy resin and (2) a base material; a multilayer printed wiring board obtained by alternately laminating an internal substrate and an insulating adhesive layer and adhering them to each other, wherein the above prepreg is used as the insulating adhesive; and a process for producing a multilayer printed wiring board, which comprises alternately laminating an internal substrate and the above prepreg, adhering them to each other, and allowing all the internal substrates to communicate with each other at the required portions. The above prepreg has high flexibility at room temperature, causes neither chipping nor peeling of resin, and is superior in heat resistance and electrical insulation after press molding.

摘要翻译： 本发明提供一种由聚碳化二亚胺树脂和环氧树脂的混合物构成并具有膜状的预浸料坯; 预浸料，其由（1）聚碳化二亚胺树脂和环氧树脂的混合物组成，（2）基材; 通过交替层叠内部基板和绝缘粘合剂层并将它们彼此粘合而获得的多层印刷线路板，其中使用上述预浸料作为绝缘粘合剂; 以及制造多层印刷线路板的方法，其包括交替层叠内部基板和上述预浸料，将它们彼此粘合，并允许所有内部基板在所需部分彼此连通。 上述预浸料在室温下具有高柔性，不会造成树脂的脱落或剥离，并且在压制成型后的耐热性和电绝缘性优异。

公开(公告)号：US06172143B2

公开(公告)日：2001-01-09

申请号：US09228389

申请日：1999-01-12

申请人： Satoshi Amano ,  Hideshi Tomita

发明人： Satoshi Amano ,  Hideshi Tomita

IPC分类号： C08K529

CPC分类号： C09K3/10 ,  C09K2200/0647 ,  C09K2200/0667

摘要： A resin composition for use in a liquid sealant, which is composed mainly of an epoxy compound, an epoxy resin curing agent and a polycarbodiimide resin, the proportion of the polycarbodiimide resin being 0.1 to 10 parts by weight relative to 100 parts by weight of the epoxy compound, and which is liquid or fluid at ordinary temperature. The liquid sealant comprises a resin composition which is composed mainly of an epoxy compound and a polycarbodiimide resin, the proportion of the polycarbodiimide resin being 0.1 to 10 parts by weight relative to 100 parts by weight of the epoxy compound, an epoxy resin curing agent, an epoxy resin curing accelerator and an inorganic powder. The sealant is liquid or fluid at ordinary temperature.

摘要翻译： 用于液体密封剂的树脂组合物，其主要由环氧化合物，环氧树脂固化剂和聚碳二亚胺树脂组成，聚碳二亚胺树脂的比例相对于100重量份的比例为0.1〜10重量份 环氧化合物，在常温下为液体或液体。 液体密封剂包括主要由环氧化合物和聚碳化二亚胺树脂组成的树脂组合物，相对于100重量份的环氧化合物，环氧树脂固化剂，聚碳化二亚胺树脂的比例为0.1〜10重量份， 环氧树脂固化促进剂和无机粉末。 密封剂在常温下为液体或液体。