摘要:
A gas processing device is disclosed that makes it possible to appropriately control the frictional resistance between a holding mat and a casing. A gas processing device (1) includes a processing structure (20), a casing (40) made of a metal and housing the processing structure (20), and a holding mat (10) formed of inorganic fibers and placed between the processing structure (20) and the casing (40), an inner surface (41) of the casing (40) and an outer surface (11) of the holding mat (10) coming in contact with each other through an adhesive layer (12) that includes a compound that includes a structural unit represented by a general formula (I). wherein R1 are independently a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a phenyl group, or a hydroxyl group, and n is an integer equal to or larger than 1.
摘要:
A gas processing device is disclosed that makes it possible to appropriately control the frictional resistance between a holding mat and a casing. A gas processing device (1) includes a processing structure (20), a casing (40) made of a metal and housing the processing structure (20), and a holding mat (10) formed of inorganic fibers and placed between the processing structure (20) and the casing (40), an inner surface (41) of the casing (40) and an outer surface (11) of the holding mat (10) coming in contact with each other through an adhesive layer (12) that includes a compound that includes a structural unit represented by a general formula (I). wherein R1 are independently a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a phenyl group, or a hydroxyl group, and n is an integer equal to or larger than 1.
摘要:
The object to provide a highly-integrated SGT-based SRAM is achieved by forming an SRAM using an inverter which comprises a first island-shaped semiconductor layer, a first gate dielectric film in contact with a periphery of the first island-shaped semiconductor layer, a first gate electrode having one surface in contact with the first gate dielectric film, a second gate dielectric film in contact with another surface of the first gate electrode, a first arc-shaped semiconductor layer in contact with the second gate dielectric film, a first first-conductive-type high-concentration semiconductor layer arranged on a top of the first island-shaped semiconductor layer, a second first-conductive-type high-concentration semiconductor layer arranged underneath the first island-shaped semiconductor layer, a first second-conductive-type high-concentration semiconductor layer arranged on a top of the first arc-shaped semiconductor layer, and a second second-conductive-type high-concentration semiconductor layer arranged underneath the first arc-shaped semiconductor layer.
摘要:
The object to provide a semiconductor device comprising a highly-integrated SGT-based CMOS inverter circuit is achieved by forming an inverter which comprises: a first transistor including; an first island-shaped semiconductor layer; a first gate insulating film; a gate electrode; a first first-conductive-type high-concentration semiconductor layer arranged above the first island-shaped semiconductor layer; and a second first-conductive-type high-concentration semiconductor layer arranged below the first island-shaped semiconductor layer, and a second transistor including; a second gate insulating film surrounding a part of the periphery of the gate electrode; a second semiconductor layer in contact with a part of the periphery of the second gate insulating film; a first second-conductive-type high-concentration semiconductor layer arranged above the second semiconductor layer; and a second second-conductive-type high-concentration semiconductor layer arranged below the second semiconductor layer.
摘要:
It is an object to provide an SGT production method capable of obtaining a structure for reducing a resistance of a gate, a desired gate length, desired source and drain configurations and a desired diameter of a pillar-shaped semiconductor. The object is achieved by a semiconductor device production method which comprises the steps of: forming a pillar-shaped first-conductive-type semiconductor layer; forming a second-conductive-type semiconductor layer underneath the pillar-shaped first-conductive-type semiconductor layer; forming a gate dielectric film and a gate electrode around the pillar-shaped first-conductive-type semiconductor layer; forming a sidewall-shaped dielectric film on an upper region of a sidewall of the pillar-shaped first-conductive-type semiconductor layer and in contact with a top of the gate; forming a sidewall-shaped dielectric film on a sidewall of the gate; and forming a second-conductive-type semiconductor layer in an upper portion of the pillar-shaped first-conductive-type semiconductor layer and on the second-conductive-type semiconductor layer formed underneath the pillar-shaped first-conductive-type semiconductor layer.
摘要:
A nonvolatile semiconductor memory transistor includes an island-shaped semiconductor having a source region, a channel region, and a drain region formed in this order from the Si substrate side, a floating gate surrounding the outer periphery of the channel region with a tunnel insulating film interposed therebetween, a control gate surrounding the outer periphery of the floating gate with an inter-polysilicon insulating film interposed therebetween, and a control gate line connected to the control gate and extending in a predetermined direction. The floating gate extends to regions below and above the control gate and to a region below the control gate line. The inter-polysilicon insulating film is interposed between the floating gate and the upper surface, lower surface, and inner side surface of the control gate and between the control gate line and a portion of the floating gate that extends to the region below the control gate line.
摘要:
The present invention provides a gaming machine including gaming terminals having high payout rate without increasing loss on the management side. When a result of a base game associated with a payout is obtained, the gaming machine determines whether at least a competing game condition associated with the payout is satisfied or not and, when it is determined that the competing game condition is satisfied, sets neighboring gaming terminals as opponents. When the opponent participates in a competing game, a competing game for winning a payout by competing against the opponent is run. According to a result of the competing game, at least a part of the payout is given to the winner of the competing game, and no payout is given to the loser of the competing game.
摘要:
A semiconductor device includes: a SOI substrate including a support layer, a first insulation film and a SOI layer; a first circuit; a second circuit; and a trench separation element. The SOI substrate further includes a first region and a second region. The first region has the support layer, the first insulation film and the SOI layer, which are stacked in this order, and the second region has only the support layer. The trench separation element penetrates the support layer, the first insulation film and the SOI layer. The trench separation element separates the first region and the second region. The first circuit is disposed in the SOI layer of the first region. The second circuit is disposed in the support layer of the second region.
摘要:
The method includes the steps of: forming a planar semiconductor layer on an oxide film formed on a substrate and then forming a pillar-shaped first-conductive-type semiconductor layer on the planar semiconductor layer; forming a second-conductive-type semiconductor layer in a portion of the planar semiconductor layer underneath the pillar-shaped first-conductive-type semiconductor layer; forming a gate dielectric film and a gate electrode made of a metal, around the pillar-shaped first-conductive-type semiconductor layer; forming a sidewall-shaped dielectric film on an upper region of a sidewall of the pillar-shaped first-conductive-type semiconductor layer and in contact with a top of the gate electrode; forming a sidewall-shaped dielectric film on a sidewall of the gate electrode; forming a second-conductive-type semiconductor layer in an upper portion of the pillar-shaped first-conductive-type semiconductor layer.