利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

76 条记录 (耗时 0.026 秒)

    FUNCTIONAL PANEL AND METHOD FOR JOINING SAME
    1.
    发明申请
    FUNCTIONAL PANEL AND METHOD FOR JOINING SAME 失效
    功能面板及其接合方法

    公开(公告)号：US20110214903A1

    公开(公告)日：2011-09-08

    申请号：US13128928

    申请日：2009-11-19

    申请人： Takahiko Sawada ,  Hiroshi Aoyama

    发明人： Takahiko Sawada ,  Hiroshi Aoyama

    IPC分类号： H05K1/02 ,  B32B37/02 ,  B32B37/14 ,  B32B38/10 ,  B23K1/20 ,  B23K31/02

    CPC分类号： H05K1/0366 ,  B29C70/202 ,  B29C70/865 ,  B29K2707/04 ,  H05K1/142 ,  H05K3/403 ,  H05K2201/0323 ,  H05K2201/09118 ,  H05K2201/10287

    摘要： There is provided a functional panel that can be joined and disassembled with ease by solving problems with a functional panel including electrical conductors integrally molded therewith, causing occurrence of cracking on the surface thereof, or cracking of a molded unit around the periphery of the electrical conductor, thereby rendering the electrical conductor susceptible to a break when a flexural load, an impact load, and so forth, acts on the functional panel. The functional panel comprises a main body of a panel member, an electrical conductor coated with a semi-cured resin having heat resistance and insulation properties, and a reinforcing fiber having a continuous filament, for fixing the electrical conductor to the main body of the panel member to thereby provide enhancement, and the functional panel is formed by exposing one end, and the other end of the electrical conductor from respective end faces of the panel member formed by integral molding.

    摘要翻译： 提供了一种功能面板，其可以通过解决包括与其一体模制的电导体的功能面板的问题而容易地连接和拆卸，从而在其表面上产生开裂或者围绕电导体的周边的模制单元的开裂 从而当弯曲载荷，冲击载荷等作用在功能面板上时，电导体易于断裂。 功能面板包括面板构件的主体，涂覆有具有耐热性和绝缘性的半固化树脂的电导体和具有连续细丝的增强纤维，用于将电导体固定到面板的主体 构件，从而提供增强功能，并且功能面板通过一端形成，并且通过一体成型形成的面板构件的相应端面露出电导体的另一端。

    Random-period chip transfer method
    3.
    发明授权
    Random-period chip transfer method 有权
    随机片式传输方法

    公开(公告)号：US07643904B2

    公开(公告)日：2010-01-05

    申请号：US11849806

    申请日：2007-09-04

    申请人： Hiroshi Aoyama ,  Ryoichi Nishigawa

    发明人： Hiroshi Aoyama ,  Ryoichi Nishigawa

    IPC分类号： B65G17/00 ,  B65G29/02 ,  B65G23/00 ,  B65G47/90

    CPC分类号： B65G47/848 ,  B65G29/00 ,  G06K19/07718 ,  G06K19/07749 ,  G06K19/0775 ,  H01L21/67132 ,  H01L21/67144 ,  H05K13/02 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/53039 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

    摘要： A chip transfer apparatus includes a first carrier for feeding chips and a second carrier for carrying works on it. The transfer apparatus also includes a transfer engine including two or more coaxial revolvers, which can revolve coaxially with each other. Each of the coaxial revolvers includes an end-effector for receiving a chip from the first carrier and transferring the received chip onto a work on the second carrier. The end-effectors of the coaxial revolvers are arranged in a circle coaxial with the revolvers. The end-effectors sequentially receive chips from the first carrier at substantially zero speed relative to the first carrier and transfer the received chips onto works on the second carrier at substantially zero speed relative to the second carrier. While the end-effectors are revolving, they undergo periodic speed change control for timing adjustment and speed adjustment for the chip reception and transfer.

    摘要翻译： 芯片传送装置包括用于馈送芯片的第一载体和用于在其上承载作品的第二载体。 传送装置还包括一个传送引擎，该传送引擎包括两个或更多个可同轴旋转的同轴旋转轮。 每个同轴旋转器包括用于从第一载体接收芯片并将接收的芯片传送到第二载体上的工件的端部执行器。 同轴罗拉的末端执行器布置成与左轮手枪同轴的圆周。 端部执行器相对于第一载体以基本上零速的顺序地从第一载体接收芯片，并将接收到的芯片相对于第二载体以基本上零速度传送到第二载体上的工件。 当端部执行器旋转时，它们进行周期性的速度变化控制，用于芯片接收和传输的定时调整和速度调节。

    Laser Machining Apparatus
    5.
    发明申请
    Laser Machining Apparatus 审中-公开
    激光加工设备

    公开(公告)号：US20080223839A1

    公开(公告)日：2008-09-18

    申请号：US12033932

    申请日：2008-02-20

    申请人： Shigenobu Maruyama ,  Hiroshi Aoyama ,  Masayuki Shiga ,  Goichi Ohmae

    发明人： Shigenobu Maruyama ,  Hiroshi Aoyama ,  Masayuki Shiga ,  Goichi Ohmae

    IPC分类号： B23K26/02

    CPC分类号： B23K26/043 ,  B23K26/03 ,  B23K26/032 ,  B23K26/04 ,  B23K26/042 ,  B23K26/066 ,  B23K26/0738 ,  B23K26/0861 ,  B23K2101/40 ,  B23K2101/42

    摘要： A laser machining apparatus capable of accurately projecting mask patterns onto a work piece and superior in machining accuracy. An auto-focusing unit is provided. The auto-focusing unit includes a television camera for observing alignment marks formed on the surface of the work piece so as to be able to measure the focal length of a projection lens. A main-scanning direction expansion/contraction ratio Ex of the work piece to its design value and a sub-scanning direction expansion/contraction ratio Ey of the work piece to its design value are obtained. The imaging magnification M of the projection lens is corrected to compensate the expansion/contraction ratio Ex. The moving speed of a mask and/or the moving speed of the work piece are corrected in consideration of the imaging magnification M of the projection lens so as to compensate the expansion/contraction ratio Ey.

    摘要翻译： 一种激光加工装置，其能够将掩模图案精确地投影到工件上，并且加工精度优异。 提供自动对焦单元。 自动对焦单元包括用于观察形成在工件表面上的对准标记以便能够测量投影透镜的焦距的电视摄像机。 将工件的主扫描方向伸缩比Ex与其设计值和工件的副扫描方向扩大/缩小比Ey相对应的设计值。 校正投影透镜的成像倍率M以补偿膨胀/收缩比Ex。 考虑到投影透镜的成像倍率M来校正工件的移动速度和/或工件的移动速度，以补偿膨胀/收缩比Ey。

    Laser Machining Method for Printed Circuit Board
    6.
    发明申请
    Laser Machining Method for Printed Circuit Board 审中-公开
    印刷电路板激光加工方法

    公开(公告)号：US20080145567A1

    公开(公告)日：2008-06-19

    申请号：US11950859

    申请日：2007-12-05

    申请人： Goichi OHMAE ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

    发明人： Goichi OHMAE ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

    IPC分类号： B05D3/06

    CPC分类号： H05K3/465 ,  B23K26/364 ,  B23K26/389 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/107 ,  H05K2203/0557 ,  H05K2203/108

    摘要： A printed circuit board manufacturing method by which the manufacturing time can be shortened and the manufacturing cost can be reduced. A printed circuit board has an insulating layer on its surface. Positions (first positions) of the printed circuit board where lands are disposed are irradiated with a CO2 laser beam (first laser beam) so as to form holes with a depth h from the surface. The printed circuit board is then scanned with an excimer laser beam (second laser beam) through a mask. The beam shape of the excimer laser beam is rectangular. Thus, holes reaching the lands are formed in the positions where the lands are disposed, and grooves for forming lines are formed (second positions). In this case, the holes reaching the lands may be formed by the CO2 laser beam.

    摘要翻译： 可以缩短制造时间并且可以降低制造成本的印刷电路板制造方法。 印刷电路板在其表面上具有绝缘层。 用CO 2激光束（第一激光束）照射布置有焊盘的印刷电路板的位置（第一位置），以形成距表面深度为h的孔。 然后用准分子激光束（第二激光束）通过掩模扫描印刷电路板。 准分子激光束的光束形状是矩形的。 因此，在设置焊盘的位置形成到达焊盘的孔，形成用于形成线的槽（第二位置）。 在这种情况下，到达焊盘的孔可以由CO 2激光束形成。

    Random-period chip transfer apparatus
    7.
    发明授权
    Random-period chip transfer apparatus 有权
    随机片式传输装置

    公开(公告)号：US07278203B2

    公开(公告)日：2007-10-09

    申请号：US10677180

    申请日：2003-10-02

    申请人： Hiroshi Aoyama ,  Ryoichi Nishigawa

    发明人： Hiroshi Aoyama ,  Ryoichi Nishigawa

    IPC分类号： B23P19/00

    CPC分类号： B65G47/848 ,  B65G29/00 ,  G06K19/07718 ,  G06K19/07749 ,  G06K19/0775 ,  H01L21/67132 ,  H01L21/67144 ,  H05K13/02 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/53039 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

    摘要： A chip transfer apparatus includes a first carrier for feeding chips and a second carrier for carrying works on it. The transfer apparatus also includes a transfer engine including two or more coaxial revolvers, which can revolve coaxially with each other. Each of the coaxial revolvers includes an end-effector for receiving a chip from the first carrier and transferring the received chip onto a work on the second carrier. The end-effectors of the coaxial revolvers are arranged in a circle coaxial with the revolvers. The end-effectors sequentially receive chips from the first carrier at substantially zero speed relative to the first carrier and transfer the received chips onto works on the second carrier at substantially zero speed relative to the second carrier. While the end-effectors are revolving, they undergo periodic speed change control for timing adjustment and speed adjustment for the chip reception and transfer.

    摘要翻译： 芯片传送装置包括用于馈送芯片的第一载体和用于在其上承载作品的第二载体。 传送装置还包括一个传送引擎，该传送引擎包括两个或更多个可同轴旋转的同轴旋转轮。 每个同轴旋转器包括用于从第一载体接收芯片并将接收的芯片传送到第二载体上的工件的端部执行器。 同轴罗拉的末端执行器布置成与左轮手枪同轴的圆周。 端部执行器相对于第一载体以基本上零速的顺序地从第一载体接收芯片，并将接收到的芯片以相对于第二载体的基本零速度传送到第二载体上的工件。 当端部执行器旋转时，它们进行周期性的速度变化控制，用于芯片接收和传输的定时调整和速度调节。

    Method of producing laminated food and a device thereof and laminated cheese food thereby produced
    8.
    发明授权
    Method of producing laminated food and a device thereof and laminated cheese food thereby produced 有权
    生产层压食品的方法及其装置以及由此制得的层压干酪食品

    公开(公告)号：US07005153B1

    公开(公告)日：2006-02-28

    申请号：US09675671

    申请日：2000-09-29

    申请人： Yoshito Shibauchi ,  Hiroshi Kondo ,  Hiroshi Aoyama ,  Masayuki Goda

    发明人： Yoshito Shibauchi ,  Hiroshi Kondo ,  Hiroshi Aoyama ,  Masayuki Goda

    IPC分类号： A23C19/09

    CPC分类号： A23C19/0908 ,  A23P20/20

    摘要： Fluid food materials which solidify when cooled are quantitatively supplied successively at a certain thickness in a plate form on cooling and carrying sides; of two cooling and carrying devices, cooled while being carried to form two monolayer platy food materials, and the two platy food materials are bonded and united making use of the surface not yet completely cooled and solidified of the monolayer platy food materials, and thereby producing a layered laminated cheese food and the like consisting of two layers. In order to obtain a three-or-more-layer laminated structure, the fluid food materials which solidify when cooled are quantitatively supplied successively at a certain thickness in a plate form on the cooling and carrying sides of the cooling and carrying devices, cooled while being carried to form monolayer platy food materials, or if necessary, more fluid food materials which solidify when cooled are quantitatively supplied successively at a certain thickness in a plate form over the platy food materials, cooled while being carried, thereby forming multilayer platy food materials, and/or the platy food materials are bonded and united to form multilayer platy food materials, and the fluid food materials are quantitatively supplied successively between the two monolayer and/or multilayer platy food materials in order to unite the two platy food materials and the fluid food materials comprising the layers between the two platy food materials.

    摘要翻译： 在冷却时固化的流体食品材料在冷却和携带侧面以板形式依次定量供应; 的两个冷却和携带装置，在被携带以形成两个单层片状食品材料的同时冷却，并且使用两个平板状食品材料，使用单层片状食品的表面尚未完全冷却和固化，从而产生 由两层组成的分层层压干酪食品等。 为了获得三层或更多层的层压结构，冷却时固化的流体食品材料以冷却和携带装置的冷却和携带侧面依次以一定厚度连续地供应，冷却和冷却 被携带以形成单层板状食品材料，或者如果需要，在冷却时固化的更流动的食品材料以片状形式连续地以板形式连续地供应在板状食品材料上，在被携带时冷却，从而形成多层片状食品材料 和/或板状食品材料结合并结合以形成多层板状食品材料，并且流体食品材料在两个单层和/或多层板状食品材料之间相继定量供应，以便将两种板状食品材料和 流体食品材料包括两片平板状食品之间的层。