公开(公告)号：US08558460B2

公开(公告)日：2013-10-15

申请号：US13146086

申请日：2010-01-25

申请人： Masaru Nonomura ,  Hiroshi Haji ,  Kiyoshi Arita

发明人： Masaru Nonomura ,  Hiroshi Haji ,  Kiyoshi Arita

IPC分类号： H01J7/24

CPC分类号： H01J37/32935

摘要： A plasma processing apparatus includes: a vacuum chamber; a plasma processing execution portion; a discharge state detecting unit; a window portion; a camera; a first storing portion; a second storing portion; and an image data extracting unit. The image data extracting unit extracts at least moving image data, which show the generation state of the abnormal discharge, from the first storing portion and stores the extracted moving image data in the second storing portion when the discharge state detecting unit detects the abnormal discharge.

摘要翻译： 一种等离子体处理装置，包括：真空室; 等离子体处理执行部分; 放电状态检测单元; 窗口部分; 相机; 第一存储部分; 第二存储部分; 和图像数据提取单元。 当排出状态检测单元检测到异常放电时，图像数据提取单元至少从第一存储部分中提取表示异常放电的生成状态的运动图像数据并将提取的运动图像数据存储在第二存储部分中。

公开(公告)号：US07629228B2

公开(公告)日：2009-12-08

申请号：US11193487

申请日：2005-08-01

申请人： Hiroshi Haji ,  Kiyoshi Arita ,  Teruaki Nishinaka

发明人： Hiroshi Haji ,  Kiyoshi Arita ,  Teruaki Nishinaka

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2223/54473 ,  H01L2924/0002 ,  H01L2924/00

摘要： On a mask placement-side surface of a semiconductor wafer in which a plurality of semiconductor devices are formed, a mask is placed, while dicing lines for dicing the semiconductor wafer into the respective separate semiconductor devices are defined and a surface of a flawed semiconductor device among the respective semiconductor devices is partially exposed, and then plasma etching is applied to the mask placement-side surface of the semiconductor wafer so as to dice the semiconductor wafer into the respective semiconductor devices along the defined dicing lines, and an exposed portion of the flawed semiconductor device is removed so as to form a removed portion as a flawed semiconductor device distinguishing mark.

摘要翻译： 在其中形成有多个半导体器件的半导体晶片的掩模放置侧表面上，设置掩模，同时定义用于将半导体晶片切割成各自的分离的半导体器件的切割线和有缺陷的半导体器件的表面 在各个半导体器件中部分曝光，然后将等离子体蚀刻施加到半导体晶片的掩模放置侧表面，以便沿着限定的切割线将半导体晶片切割成各个半导体器件，并且将暴露部分 去除有缺陷的半导体器件，以形成作为有缺陷的半导体器件区分标记的去除部分。

公开(公告)号：US20080104831A1

公开(公告)日：2008-05-08

申请号：US10571289

申请日：2005-04-08

申请人： Hiroshi Haji ,  Mitsuru Ozono

发明人： Hiroshi Haji ,  Mitsuru Ozono

IPC分类号： H05K13/04 ,  H05K13/00 ,  H05K3/30

CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H01L21/681 ,  H01L21/6838 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/53039 ,  Y10T29/53174 ,  Y10T29/53178

摘要： In an electronic component mounting process for mounting electronic components (6) to a substrate, each of the electronic components having an adhesive layer on a surface to be bonded to the substrate is picked up with suction nozzle provided with individual heater, and a time taken for the mounting operation is so allotted that a first heating time of a duration from a moment when the suction nozzle comes into contact with the electronic component for picking it up till another moment immediately before it begins a mounting motion to the substrate is longer than a second heating time of a duration from the moment when the suction nozzle begins the mounting motion till another moment when it leaves the electronic component mounted to the substrate.

摘要翻译： 在将电子部件（6）安装到基板的电子部件安装工序中，将具有粘接于基板的表面上的粘接层的各电子部件用设置有各个加热器的吸嘴进行拾取， 因为安装操作被分配成使得从吸嘴与电子部件接触的时刻的持续时间的第一加热时间直到其开始向基板的安装运动之前的另一时刻长于 从吸嘴开始安装运动的时刻到其离开安装在基板上的电子部件的另一时刻的持续时间的第二加热时间。

公开(公告)号：US07074720B2

公开(公告)日：2006-07-11

申请号：US10178444

申请日：2002-06-21

申请人： Kiyoshi Arita ,  Tetsuhiro Iwai ,  Hiroshi Haji ,  Shoji Sakemi

发明人： Kiyoshi Arita ,  Tetsuhiro Iwai ,  Hiroshi Haji ,  Shoji Sakemi

IPC分类号： H01L21/302 ,  H01L21/3065

CPC分类号： H01L21/6835 ,  H01J37/3244 ,  H01J37/32532 ,  H01L21/304 ,  H01L21/3065 ,  H01L21/67092 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834

摘要： In a plasma treating apparatus, a ceramic porous substance having a three-dimensional network structure in which a frame portion 18a formed of ceramic containing alumina is provided continuously like a three-dimensional network is used for the material of an electrode member 17 for the plasma treating apparatus to be attached to the front surface of a gas supplying port of an electrode for plasma generation, and a gas for plasma generation is caused to pass through a hole portion 18b formed irregularly in the three-dimensional network structure. Consequently, the distribution of the gas to be supplied is made uniform to prevent an abnormal discharge so that uniform etching having no variation can be carried out.

摘要翻译： 在等离子体处理装置中，将具有三维网状结构的陶瓷多孔物质用于电极部件17的材料，其中三维网状结构的三维网状连续地设置有由含有氧化铝的陶瓷构成的框架部分18a， 等离子体产生用电极的气体供给口的前表面的等离子体处理装置和等离子体产生用气体通过三维网状结构中不规则形成的孔部18b。 因此，供给气体的分布均匀，以防止异常放电，从而可以进行不变化的均匀蚀刻。

公开(公告)号：US07025244B2

公开(公告)日：2006-04-11

申请号：US10774239

申请日：2004-02-06

申请人： Hiroshi Haji

发明人： Hiroshi Haji

IPC分类号： B23K20/00

CPC分类号： H01L24/81 ,  H01L24/75 ,  H05K13/0812 ,  Y10T29/49131

摘要： In an electronic component mounting method in which electronic components are sucked/held by plural respective nozzles provided on a mounting head so as to be mounted on electronic component mounting portions of a board, such a mounting operation is sequentially carried out as to all of the electronic components, in which the electronic components are sucked/held by the plural nozzles; an electronic component sucked/held by one of the plural nozzles is provisionally positioned above one electronic component mounting portion; both this electronic component and the electronic component mounting portion are observed by an observation head which is located between the board and the mounting head; a relative position detecting operation for detecting a relative positional relationship between this electronic component and the electronic component mounting portion is carried out as to all of the electronic components held by the mounting head; and the electronic component is positioned with respect to the electronic component mounting portion so as to be mounted thereon while the detected relative positional relationship is reflected.

公开(公告)号：US20060019416A1

公开(公告)日：2006-01-26

申请号：US11183739

申请日：2005-07-19

申请人： Kiyoshi Arita ,  Hiroshi Haji ,  Kazuhiro Noda ,  Akira Nakagawa ,  Teruaki Nishinaka

发明人： Kiyoshi Arita ,  Hiroshi Haji ,  Kazuhiro Noda ,  Akira Nakagawa ,  Teruaki Nishinaka

IPC分类号： H01L21/66 ,  G01R31/26

CPC分类号： G03F7/70433 ,  H01L21/78

摘要： With use of a length-dimension of a second-line-segment of a unit-device-formation-region as an arrangement interval, a plurality of parallel lines are disposed in a device-formation-effective-region on a wafer so as to form a plurality of parallel-line-partition-regions, the unit-device-formation-regions are arranged in each of the parallel-line-partition-regions independently of and separately from other parallel-line-partition-regions so that the acquisition number of the unit-device-formation-regions is maximized, and an arrangement of the respective unit-device-formation-regions in the respective parallel-line-partition-regions is determined as an arrangement of the entire device-formation-effective-region.

公开(公告)号：US20050072831A1

公开(公告)日：2005-04-07

申请号：US10774239

申请日：2004-02-06

申请人： Hiroshi Haji

发明人： Hiroshi Haji

IPC分类号： H05K13/04 ,  H05K13/08 ,  B23K31/12 ,  B23K37/04

CPC分类号： H01L24/81 ,  H01L24/75 ,  H05K13/0812 ,  Y10T29/49131

摘要： In an electronic component mounting method in which electronic components are sucked/held by plural respective nozzles provided on a mounting head so as to be mounted on electronic component mounting portions of a board, such a mounting operation is sequentially carried out as to all of the electronic components, in which the electronic components are sucked/held by the plural nozzles; an electronic component sucked/held by one of the plural nozzles is provisionally positioned above one electronic component mounting portion; both this electronic component and the electronic component mounting portion are observed by an observation head which is located between the board and the mounting head; a relative position detecting operation for detecting a relative positional relationship between this electronic component and the electronic component mounting portion is carried out as to all of the electronic components held by the mounting head; and the electronic component is positioned with respect to the electronic component mounting portion so as to be mounted thereon while the detected relative positional relationship is reflected.

摘要翻译： 在电子部件安装方法中，电子部件由设置在安装头上的多个喷嘴吸引/保持以安装在电路板的电子部件安装部上，这样的安装操作依次执行于所有 电子部件，其中电子部件被多个喷嘴吸住/保持; 由多个喷嘴中的一个吸引/保持的电子部件临时定位在一个电子部件安装部上方; 通过位于板和安装头之间的观察头来观察该电子部件和电子部件安装部分; 对于由安装头保持的所有电子部件，执行用于检测该电子部件与电子部件安装部之间的相对位置关系的相对位置检测动作。 并且电子部件相对于电子部件安装部被定位成安装在其上，同时反映检测到的相对位置关系。

公开(公告)号：US06784112B2

公开(公告)日：2004-08-31

申请号：US10114320

申请日：2002-04-03

申请人： Kiyoshi Arita ,  Tetsuhiro Iwai ,  Hiroshi Haji ,  Shoji Sakemi

发明人： Kiyoshi Arita ,  Tetsuhiro Iwai ,  Hiroshi Haji ,  Shoji Sakemi

IPC分类号： H01L21302

CPC分类号： H01L21/3065

摘要： A surface treatment method for thinning a silicon based substrate obtains a milky-dull color on an overall surface uniformly of the silicon based substrate. To be more specific, a surface opposite to a circuit-formed surface is mechanically polished, then the surface is etched using inert gas such as argon gas for producing plasma. This etching forms micro dimples uniformly on the surface. Next, the surface is further etched using fluorine based gas for producing plasma. This etching obtains a milky-dull color uniformly on the surface. As a result, printed marks on the surface can be read with ease, and pick-up errors in die-bonding can be reduced.

摘要翻译： 用于使硅基衬底变薄的表面处理方法在硅基衬底的整个表面上均匀地获得乳白色的颜色。 更具体地说，与电路形成表面相对的表面被机械抛光，然后使用诸如氩气的惰性气体蚀刻表面，以产生等离子体。 该蚀刻在表面上均匀地形成微凹坑。 接下来，使用氟基气体进一步蚀刻表面以产生等离子体。 该蚀刻在表面上均匀地获得乳白色的颜色。 结果，可以容易地读取表面上的印刷标记，并且可以降低芯片接合中的拾取误差。

公开(公告)号：US5823416A

公开(公告)日：1998-10-20

申请号：US680523

申请日：1996-07-09

申请人： Hiroshi Haji

发明人： Hiroshi Haji

IPC分类号： B23K1/20 ,  B23K20/00 ,  H05K13/00 ,  B23K37/00 ,  B01J19/08 ,  C23F1/07

CPC分类号： H01L24/85 ,  B23K1/20 ,  B23K20/004 ,  H01L24/78 ,  H05K13/0061 ,  B23K2201/36 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48644 ,  H01L2224/7865 ,  H01L2224/85013 ,  H01L2224/85444 ,  H01L24/45 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041

摘要： There are disclosed a surface treatment device and a wire bonding device which are compact in size, have a high processing ability, are simple in construction, and achieve a low cost. The surface treatment device includes a base having a transfer path for transferring an object, a lid provided above the base for movement into and out of contact with an upper surface of the base, the lid contacting the base to form a sealed space on the upper surface of the base, an engagement and disengagement mechanism for moving the lid into and out of contact with the base, a transfer mechanism for feeding the object, disposed on the transfer path, into and out of a position beneath the lid when the lid is out of contact with the base, and a treatment portion for surface treating electrodes of the object disposed in the sealed space. A wire bonding mechanism is provided at a downstream portion of the transfer path.

摘要翻译： 公开了一种尺寸紧凑，处理能力强，结构简单，成本低的表面处理装置和引线接合装置。 表面处理装置包括具有用于传送物体的传送路径的基座，设置在基座上方的盖，用于与基座的上表面移动和离开接触，盖接触基部，以在上部形成密封空间 基座的表面，用于将盖移动到与底座接触和脱离接触的接合和分离机构，用于将设置在传送路径上的物体进入和离开盖的下方的位置的传送机构 与基座不接触，以及用于处理设置在密封空间中的物体的表面处理电极的处理部分。 引线接合机构设置在传送路径的下游部分。

公开(公告)号：US5288008A

公开(公告)日：1994-02-22

申请号：US983026

申请日：1992-11-30

申请人： Hiroshi Haji ,  Kiyoshi Arita

发明人： Hiroshi Haji ,  Kiyoshi Arita

IPC分类号： H01L21/60

CPC分类号： H01L24/86 ,  H01L2224/16 ,  H01L2224/7965 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14

摘要： A process for manufacturing electronic components known as TAB method comprises a process employing a single apparatus for forming bumps in a chip, a process of inner lead bonding for bonding said bumps to leads of a film carrier, and a process of outer lead bonding for bonding the leads to a circuit board after punching said film carrier. The bumps are formed by plating means or by stud bump means using a capillary tool. In another aspect of the invention there is provided an apparatus by which it is possible to form the bumps and to perform the inner lead bonding in a single apparatus. The capillary tool for forming the inner lead bonding and a pressing tool for the inner lead bonding are replaceably and selectively mounted to be held on a horn. Also, there are provided a pickup head for moving the chip furnished in a chip feeding unit to the chip stage and a moving table for moving the chip stage. The capillary tool is held by the horn, and the bumps are formed in the chip on the chip stage while pulling out a wire from the capillary tool. Next, the pressing tool is manually mounted to be held by the horn in place of the capillary tool, and the leads of the film carrier on the chip stage are bonded to the bumps formed in the chip.

摘要翻译： 用于制造称为TAB方法的电子部件的方法包括使用单个装置在芯片中形成凸块的工艺，用于将所述凸块接合到薄膜载体的引线的内部引线接合的工艺，以及用于接合的外部引线接合 在冲压所述胶片载体之后导向电路板。 凸块由电镀装置或使用毛细管工具的螺柱凸块形成。 在本发明的另一方面，提供了一种可以在单个装置中形成凸块并执行内引线接合的装置。 用于形成内部引线接合的毛细管工具和用于内部引线接合的按压工具可更换和选择性地安装以保持在喇叭上。 此外，还提供了一种用于将设置在芯片馈送单元中的芯片移动到芯片级的拾取头和用于移动芯片级的移动台。 毛细管工具由喇叭保持，并且在从毛细管工具拉出线材时，在芯片台上的芯片中形成凸块。 接下来，代替毛细管工具手动地安装按压工具以由喇叭保持，并且芯片台上的胶片载体的引线接合到芯片中形成的凸块。