摘要:
In a powder supplying device, a powder container contains powder therein and is provided at a bottom of the powder container with a gas blowout part for ejecting gas to the inside of the powder container. A powder transport unit attracts powder contained in the powder container from a suction opening and transports the powder to a powder receiving device. A first detection unit is provided in the powder container to detect a remaining powder in the powder container.
摘要:
A particle supply apparatus is disclosed that includes a particle accommodating unit that accommodates particles, a gas spouting unit that is arranged at a bottom portion of the particle accommodating unit and is configured to spout gas toward the particles, a conveying mechanism that applies suction to the particles accommodated in the particle accommodating unit and conveys the particles toward a supply destination, and a gas discharge unit that discharges gas contained within the particle accommodating unit toward an exterior side of the particle accommodating unit.
摘要:
In a powder supplying device, a powder container contains powder therein and is provided at a bottom of the powder container with a gas blowout part for ejecting gas to the inside of the powder container. A powder transport unit attracts powder contained in the powder container from a suction opening and transports the powder to a powder receiving device. A first detection unit is provided in the powder container to detect a remaining powder in the powder container.
摘要:
Disclosed is a high-temperature solder material which is composed of tin, zinc and silver, or of 0.01 to 2 wt % germanium or aluminum and the balance tin, or tin and zinc at a ratio of 80/20 to 70/30. The tin/zinc/silver solder has a composition ratio that the ratio of till to zinc is within a range of 97/3 to 79/21 by weight, and the ratio of the sum of tin and zinc to silver is within a range of 88/12 to 50/50 by weight, or that the ratio of tin to zinc is within a range of 70/30 to 5/95 by weight, and the ratio of silver to the sum of tin, zinc and silver is 15% by weight or less. The solder material is used for producing electric or electronic devices and equipments.
摘要:
A heat-sensitive stencil including a porous support, and a thermoplastic resin film laminated on the support and having a surface smoothness of at least 10,000 seconds. The stencil is fabricated by bonding a thermoplastic resin film to a porous support with an adhesive having a specific viscosity and a specific volatile matter content, while maintaining each of the support and the film under a specific tension. The stencil may also be fabricated by applying a coating composition containing a resin and first and second solvents having a specific solubility and specific evaporation rates, and drying the applied composition to form a porous support. A printing master is produced by heating the above stencil imagewise by a thermal head with a heating energy of not greater than 0.05 mJ/dot.
摘要:
A stencil base sheet includes a thermoplastic resin film, with a surface of the stencil base sheet on the side of the thermoplastic resin film having a surface smoothness of at least 6000 seconds. From this stencil base sheet, a printing master is prepared by use of a heat-emitting resistor with the application of electric signals thereto with pulse modulation corresponding to image recording density, thereby forming perforations of a different size corresponding to recording image density in the stencil base sheet by thermal fusing. Furthermore, a monochrome or multi-color stencil printing is performed by using the printing master.
摘要:
A heat-sensitive stencil is disclosed which includes a porous substrate having opposing first and second surfaces, and a thermoplastic resin film bonded to the first surface of the substrate with an adhesive, wherein the second surface of the substrate is negative to a wax No. 6 pick test defined in the specification herein so that the fibers constituting the substrate are not picked off during its contact with a platen roller in the master forming stage.
摘要:
There is proposed a molten carbonate fuel cell of high performance and long life which is provided with an oxidizing gas side-collector plate having on its surface a non-stoichiometric composite oxide layer excellent in electric conductivity and corrosion resistance, and hardly attracting electrolyte. This molter carbonate fuel cell comprises a unit cell comprising an electrolyte body formed of a porous body impregnated therein with a carbonate, a cathode disposed on one main surface of the electrolyte body, and an anode disposed on the other main surface of the electrolyte body, corrugated collector plates, disposed alternatively on a surface of the anode and on a surface of the cathode, and interconnectors, each being disposed on a surface of each of the collector plates, wherein the collector plate disposed on the cathode comprises a main body made of austenitic stainless steel, an Fe-Cr-Ni alloy layer covering a surface of the main body and consisting of 23 to 45 wt % of Fe, 12 to 27 wt % of Cr, the balance of Ni and not more than 1 wt % of unavoidable impurities, and a nickel-ferrite-based non-stoichiometric composite oxide layer formed on a surface of the Fe-Cr-Ni alloy layer.
摘要:
A particle supply apparatus is disclosed that includes a particle accommodating unit that accommodates particles, a gas spouting unit that is arranged at a bottom portion of the particle accommodating unit and is configured to spout gas toward the particles, and a conveying mechanism that applies suction to the particles accommodated in the particle accommodating unit and conveys the particles toward a supply destination.
摘要:
A semiconductor device, comprising a frame including a die pad and a lead portion; a semiconductor element; a wire including one end connected to the semiconductor element and another end connected to the lead portion; at least one first bonding portion formed of a solder material and bonding a part of an upper surface of the die pad to a part which is on a lower surface of the semiconductor element and which is opposed to the part of the upper surface of the die pad; and at least one second bonding portion formed of a thermosetting resin and bonding another part of the upper surface of the die pad to another part which is on the lower surface of the semiconductor element and which is opposed to said another part of the upper surface of the die pad.