摘要:
An optical pickup device comprises a semiconductor laser that causes outgoing of laser beam used for reproduction and recording of information on an optical disk, and an objective lens that conducts the laser beam outgoing from the semiconductor laser to the optical disk. The objective lens is driven by a yoke, a focusing coil, a tracking coil, etc. These elements are accommodated in a pickup housing. First and second bearing portions supporting the pickup housing to make the same movable are attached to the pickup housing and arranged on both sides with the objective lens therebetween. The yoke is thermally connected to the first bearing portion positioned on an opposite side of the yoke to the semiconductor laser.
摘要:
In a recording disk apparatus, a pickup element and an electric element for at lease one of supplying an electric power to at least one of a recording disk driving motor and the pickup and processing a signal to be recorded into the recording disk and/or the signal read from the recording disk are prevented from overlapping each other as seen in a thickness direction of the recording disk to restrain a thermal conduction between the pickup element and the electric element so that a thermal conduction restraining area extending along an imaginary directional line crossing an imaginary straight line passing the pickup element and the electric element as seen in the thickness direction is formed between the pickup element and the electric element as seen in the thickness direction.
摘要:
An ultrasonic sensor includes an ultrasonic element. The ultrasonic element includes an ultrasonic oscillator for sending, receiving or transceiving ultrasonic waves, an element body having an opening for passage of ultrasonic waves formed on one surface, the ultrasonic oscillator being arranged within the element body, and terminal portions protruding from the element body to feed an electric current to the ultrasonic oscillator. The ultrasonic sensor further includes a housing having an opening formed on one surface for communication with the opening of the element body. The housing includes a receiving portion for receiving the ultrasonic element and a positioning portion integrally formed with the receiving portion to position the ultrasonic element in place. The ultrasonic sensor includes a printed wiring board arranged to interpose the ultrasonic element between the printed wiring board and the receiving portion. The terminal portions of the ultrasonic element are mounted to the printed wiring board.
摘要:
The ultrasonic element includes an ultrasonic oscillator for sending, receiving or transceiving ultrasonic waves, an element body having an opening for passage of ultrasonic waves formed on one surface, the ultrasonic oscillator being arranged within the element body, and terminal portions protruding from the element body to feed an electric current to the ultrasonic oscillator. The ultrasonic sensor further includes a housing having an opening formed on one surface for communication with the opening of the element body. The housing includes a receiving portion for receiving the ultrasonic element and a positioning portion integrally formed with the receiving portion to position the ultrasonic element in place. The ultrasonic sensor includes a printed wiring board arranged to interpose the ultrasonic element between the printed wiring board and the receiving portion. The terminal portions of the ultrasonic element are mounted to the printed wiring board.
摘要:
The storage case has a structure in which a sample storage case (S) contained in a storage case is cooled and held at a low temperature by a Stirling refrigerator. A detection element is disposed in a room-temperature area of the storage case. The chemical or physical property of the detection element varies when a contaminant adheres to the detection element. Entrance of a contaminant into the storage case can be checked by contactlessly checking the detection element from the outside of the storage case. The storage case includes a server for receiving the result of the check from the detection device, storing the result, and setting up connection via a communication line to at least two out of a terminal operable by the forwarder, a terminal operable by the carrier, and a terminal operable by the recipient to transmit the result to the two.
摘要:
A cooling system applying a thermo siphon therein, being superior in energy saving and/or ecology, with an effective cooling, and also an electronic apparatus applying that therein, in particular, for cooling a CPU 200 mounted on a printed circuit board 100 within a housing thereof, comprises a heat-receiving jacket 310, being thermally connected with a surface of the CPU generating heats therein, and for evaporating liquid refrigerant stored in a pressure-reduced inner space with heat generation thereof, a condenser 320 for receiving refrigerant vapor from the heat-receiving jacket within a pressure-reduced inner space thereof and for condensing the refrigerant vapor into a liquid by transferring the heats into an outside of the apparatus, a vapor tube 331, and a liquid return tube 332, with applying the thermo siphon for circulating the refrigerant due to phase change thereof, wherein the condenser forms fine grooves on an inner wall surface thereof along a direction of flow of the refrigerant, and is also formed flat in a cross-section thereof, for cooling the refrigerant vapor from the heat-receiving jacket on the inner wall surface thereof, efficiently.
摘要:
An optical pickup device 50 comprising a laser diode 1, a photo detector 2, a housing 3 having an optical system for guiding light from the laser diode 1 to an optical disk and guiding light reflected on the optical disk to the photo detector, a wiring 5 to supply current to the laser diode 1, and a metallic cover 9 provided outside of the housing 3, wherein the laser diode 1 is bonded to the housing 3 by adhesive, a metallic member 10 is mounted on the surface of the laser diode 1 by connecting thermally, and the metallic member 10 is thermally connected to the cover 9 by solder.
摘要:
An electronic device comprises: a housing; blades each of which is detachable from the housing and on each of which at least CPU and a memory are mounted; first cooling devices each of that takes out heat generated in the blade outside the blade, each of said first cooling device having a heat release part in the form of an elongate column to be fixed to the blade; second cooling devices fixed to the housing to discharge heat transported from the first cooling devices outside the housing, each of said second cooling devices having a heat absorbing part, which is capable of containing the heat release part of the first cooling device; medium reservoirs each of which is put in fluid communication with a clearance, which is formed between the heat release part and the heat absorbing part when the heat release part is inserted into the heat absorbing part; a heat conducting medium stored in each of the medium reservoirs; pressurizing devices for pressurizing the heat conducting medium to supply the heat conducting medium to the clearance, and a detachable connecting part formed between the heat release part and the heat absorbing part.
摘要:
In an optical disk apparatus for recording and/or reading information with respect to an optical disk, comprising, a chassis for containing the optical disk, and a tray being movable with respect to the chassis and adapted to support the optical disk thereon so that the optical disk is movable with respect to the chassis, the chassis has an opening for discharging an air from an inside of the chassis to an outside of the chassis through the opening.
摘要:
An optical pickup device 50 comprising a laser diode 1, a photo detector 2, a housing 3 having an optical system for guiding light from the laser diode 1 to an optical disk and guiding light reflected on the optical disk to the photo detector, a wiring 5 to supply current to the laser diode 1, and a metallic cover 9 provided outside of the housing 3, wherein the laser diode 1 is bonded to the housing 3 by adhesive, a metallic member 10 is mounted on the surface of the laser diode 1 by connecting thermally, and the metallic member 10 is thermally connected to the cover 9 by solder.