公开(公告)号：US07648775B2

公开(公告)日：2010-01-19

申请号：US11291965

申请日：2005-12-02

申请人： Hisashi Wakako ,  Makoto Nagai ,  Atsushi Uchida ,  Masahito Morita ,  Kazuo Kimura

发明人： Hisashi Wakako ,  Makoto Nagai ,  Atsushi Uchida ,  Masahito Morita ,  Kazuo Kimura

IPC分类号： B32B15/00

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/1301 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/183 ,  H05K3/246 ,  H05K3/403 ,  H05K2201/0347 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T428/12361 ,  Y10T428/12528 ,  Y10T428/12576 ,  Y10T428/12611 ,  Y10T428/12639 ,  Y10T428/12806 ,  Y10T428/12819 ,  Y10T428/12826 ,  Y10T428/1284 ,  Y10T428/12861 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/12944 ,  Y10T428/131 ,  Y10T428/1317 ,  Y10T428/26 ,  Y10T428/265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A ceramic substrate comprising a metallic layer on its surface, wherein said metallic layer includes: a silver layer containing silver; a gold layer containing gold; and a nickel layer containing nickel, in this order from an outermost layer of said metallic layer.

摘要翻译： 一种陶瓷基板，其表面上具有金属层，其中所述金属层包括：含有银的银层; 金层含金; 以及从所述金属层的最外层依次包含镍的镍层。

公开(公告)号：US5798566A

公开(公告)日：1998-08-25

申请号：US976501

申请日：1997-11-24

申请人： Kazuhisa Sato ,  Masanori Kitou ,  Hisashi Wakako ,  Kazuo Kimura

发明人： Kazuhisa Sato ,  Masanori Kitou ,  Hisashi Wakako ,  Kazuo Kimura

IPC分类号： H01L23/367 ,  H01L23/373 ,  H01L23/34 ,  H01L23/06 ,  H01L23/10 ,  H01L23/15

CPC分类号： H01L23/3735 ,  H01L23/367 ,  H01L23/3672 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/09701 ,  H01L2924/15174

摘要： In accordance with the present invention, there is provided a ceramic IC package base which comprises a ceramic substrate, and a heat radiating member adhered to a side surface of the ceramic substrate and made of copper or copper alloy. The heat radiating member has an adhering portion at which it is adhered to the ceramic substrate. The adhering portion, when the heat radiating member is observed in a plan view, has one side which is equal to or larger than 8 mm. The adhering portion is of the thickness within the range from 0.25 mm to 0.76 mm. A ceramic IC package cover is also provided.

摘要翻译： 根据本发明，提供了一种陶瓷IC封装基座，其包括陶瓷基板和粘附到陶瓷基板的侧表面并由铜或铜合金制成的散热构件。 散热构件具有粘附到陶瓷基板上的粘附部分。 当在平面图中观察散热构件时，粘附部分具有等于或大于8mm的一侧。 粘合部分的厚度在0.25mm至0.76mm的范围内。 还提供陶瓷IC封装盖。

公开(公告)号：US20070095565A1

公开(公告)日：2007-05-03

申请号：US11410195

申请日：2006-04-25

申请人： Makoto Nagai ,  Hisashi Wakako ,  Atsushi Uchida ,  Masahito Morita

发明人： Makoto Nagai ,  Hisashi Wakako ,  Atsushi Uchida ,  Masahito Morita

IPC分类号： H05K1/11 ,  H01L29/04 ,  H01R12/04

CPC分类号： H05K3/403 ,  H01L33/52 ,  H01L33/60 ,  H01L2924/0002 ,  H05K1/183 ,  H05K3/244 ,  H05K3/28 ,  H05K2201/09981 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2201/2072 ,  H05K2203/0594 ,  H01L2924/00

摘要： A wiring board (1, 1a, 20, 20a) having: a board body (2, 22) including an insulating material and having a front surface (3, 23), a back surface (4, 24), a cavity (5, 25) having an opening in the front surface (3, 23) of the board body (2, 22) and having a bottom surface (6, 26) and a side surface (7, 27), and a projection which is provided on a front surface side of the side surface (7, 27) of the cavity and projects toward a center of the opening; a metal layer (11) provided on the side surface (7, 27) of the cavity; and an insulating portion which is provided on a back surface (9, 29) of the projection (8, 28) so as to define an obtuse angle (θ) with the metal layer (11), or which covers at least a top end portion of the metal layer (11).

摘要翻译： 一种布线板（1,1a，20,20a），具有：具有绝缘材料并具有前表面（3,23），背面（4,24），空腔 （5,25），其具有在所述板体（2,22）的前表面（3,33）中的开口并具有底表面（6,26）和侧表面（7,27）的突起，所述突起 设置在空腔的侧面（7,27）的前表面侧，朝向开口的中心突出; 设置在空腔的侧面（7,27）上的金属层（11） 以及设置在所述突起（8,28）的后表面（9,29）上以便与所述金属层（11）形成钝角（θ）的绝缘部分，或者至少覆盖顶端 金属层（11）的一部分。

公开(公告)号：US06495211B2

公开(公告)日：2002-12-17

申请号：US09882016

申请日：2001-06-18

申请人： Masahiro Iba ,  Hisashi Wakako ,  Kazuhisa Sato ,  Hiroyuki Hashimoto ,  Yasuo Doi

发明人： Masahiro Iba ,  Hisashi Wakako ,  Kazuhisa Sato ,  Hiroyuki Hashimoto ,  Yasuo Doi

IPC分类号： B05D310

CPC分类号： H05K3/187 ,  H01L21/288 ,  H01L21/67028 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/244 ,  H01L2924/00

摘要： A process for producing a substrate 1 having a base-metal plating layer, which includes an immersion step for immersing the substrate 1 in a plating solution contained in a plating tank 33, to thereby form a base-metal plating layer; a washing step for removing the substrate 1 from the plating tank 33, transferring the substrate 1 to a washing tank, and washing the substrate 1; and a cooling step for applying a cooling liquid to the substrate 1 during at least a portion of the period during which the substrate is transferred to a position where the washing step is carried out after completing the immersion step, to thereby cool the substrate 1. An apparatus for carrying out the above process is also disclosed.

摘要翻译： 一种具有基底金属镀层的基板1的制造方法，其包括将基板1浸渍在镀槽33中所含的镀液中的浸渍工序，从而形成基底金属镀层; 洗涤步骤，用于从电镀槽33去除衬底1，将衬底1转移到洗涤槽中，并洗涤衬底1; 以及在完成浸渍步骤之后将衬底转移到进行洗涤步骤的位置的至少一部分时间内将冷却液施加到衬底1从而冷却衬底1的冷却步骤。 还公开了一种用于执行上述过程的装置。

公开(公告)号：US06472609B2

公开(公告)日：2002-10-29

申请号：US09866999

申请日：2001-05-25

申请人： Hisashi Wakako ,  Masahiro Iba ,  Kazuhisa Sato ,  Kazuo Kimura

发明人： Hisashi Wakako ,  Masahiro Iba ,  Kazuhisa Sato ,  Kazuo Kimura

IPC分类号： H05K103

CPC分类号： H05K3/244 ,  H01L23/49811 ,  H01L2924/0002 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49156 ,  H01L2924/00

摘要： A printed-wiring substrate 1 has main-face-side connection terminals 33 for solder-bonding to connection terminals 83 of an IC chip 81 on a main face 1A thereof and back-face-side connection terminals 41 for connecting, through mechanical contact, to connection terminals 93 of a motherboard 91 on a back face 1B thereof. The surface of each of the main-face-side connection terminals 33 is covered with a main-face-side displacement Au plating layer 45 having a thickness of 0.03 to 0.12 &mgr;m, and the surface of each of the back-face-side connection terminals 41 is covered with a back-face-side displacement Au plating layer 55, which is thicker than the main-face-side displacement Au plating layer 45 and has a thickness of 0.2 &mgr;m or greater.

摘要翻译： 印刷布线基板1具有用于焊接到其主面1A上的IC芯片81的连接端子83的主面侧连接端子33和用于通过机械接触连接的背面侧连接端子41， 连接到母板91的背面1B上的连接端子93。 每个主面侧连接端子33的表面被厚度为0.03至0.12μm的主面侧位移Au镀层45覆盖，并且每个背面侧连接 端子41覆盖有比主面侧位移Au镀层45厚的厚度为0.2μm以上的背面侧位移Au镀层55。

公开(公告)号：US07700885B2

公开(公告)日：2010-04-20

申请号：US11410195

申请日：2006-04-25

申请人： Makoto Nagai ,  Hisashi Wakako ,  Atsushi Uchida ,  Masahito Morita

发明人： Makoto Nagai ,  Hisashi Wakako ,  Atsushi Uchida ,  Masahito Morita

IPC分类号： H02G3/18

CPC分类号： H05K3/403 ,  H01L33/52 ,  H01L33/60 ,  H01L2924/0002 ,  H05K1/183 ,  H05K3/244 ,  H05K3/28 ,  H05K2201/09981 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2201/2072 ,  H05K2203/0594 ,  H01L2924/00

摘要： A wiring board (1, 1a, 20, 20a) having: a board body (2, 22) including an insulating material and having a front surface (3, 23), a back surface (4, 24), a cavity (5, 25) having an opening in the front surface (3, 23) of the board body (2, 22) and having a bottom surface (6, 26) and a side surface (7, 27), and a projection which is provided on a front surface side of the side surface (7, 27) of the cavity and projects toward a center of the opening; a metal layer (11) provided on the side surface (7, 27) of the cavity; and an insulating portion which is provided on a back surface (9, 29) of the projection (8, 28) so as to define an obtuse angle (θ) with the metal layer (11), or which covers at least a top end portion of the metal layer (11).

摘要翻译： 一种布线板（1,1a，20,20a），具有：具有绝缘材料并具有前表面（3,23），背面（4,24），空腔（5）的基板主体（2,22） ，25），其具有在所述板体（2,22）的前表面（3,23）中的开口，并且具有底表面（6,26）和侧表面（7,27），并且设置有突起 在空腔的侧面（7,27）的前表面侧上朝向开口的中心突出; 设置在空腔的侧面（7,27）上的金属层（11） 以及设置在所述突起（8,28）的后表面（9,29）上以与所述金属层（11）形成钝角（“所述”）的绝缘部分，或者至少覆盖顶部 金属层（11）的端部。

公开(公告)号：US20060147746A1

公开(公告)日：2006-07-06

申请号：US11291965

申请日：2005-12-02

申请人： Hisashi Wakako ,  Makoto Nagai ,  Atsushi Uchida ,  Masahito Morita ,  Kazuo Kimura

发明人： Hisashi Wakako ,  Makoto Nagai ,  Atsushi Uchida ,  Masahito Morita ,  Kazuo Kimura

IPC分类号： B28B11/00 ,  C03C17/32 ,  B32B15/04 ,  F16L9/10

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/1301 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/183 ,  H05K3/246 ,  H05K3/403 ,  H05K2201/0347 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T428/12361 ,  Y10T428/12528 ,  Y10T428/12576 ,  Y10T428/12611 ,  Y10T428/12639 ,  Y10T428/12806 ,  Y10T428/12819 ,  Y10T428/12826 ,  Y10T428/1284 ,  Y10T428/12861 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/12944 ,  Y10T428/131 ,  Y10T428/1317 ,  Y10T428/26 ,  Y10T428/265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A ceramic substrate comprising a metallic layer on its surface, wherein said metallic layer includes: a silver layer containing silver; a gold layer containing gold; and a nickel layer containing nickel, in this order from an outermost layer of said metallic layer.

摘要翻译： 一种陶瓷基板，其表面上具有金属层，其中所述金属层包括：含有银的银层; 金层含金; 以及从所述金属层的最外层依次包含镍的镍层。

公开(公告)号：US06887512B2

公开(公告)日：2005-05-03

申请号：US10214727

申请日：2002-08-09

申请人： Hisashi Wakako ,  Masahiro Iba ,  Kazuhisa Sato ,  Kazuo Kimura

发明人： Hisashi Wakako ,  Masahiro Iba ,  Kazuhisa Sato ,  Kazuo Kimura

IPC分类号： H05K3/34 ,  H01L23/12 ,  H01L23/498 ,  H05K3/24 ,  B05D5/12

CPC分类号： H05K3/244 ,  H01L23/49811 ,  H01L2924/0002 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49156 ,  H01L2924/00

摘要： A method for fabricating a component board which includes forming a first main-face-side Au plating layer on surfaces of main-face-side connection terminals and a first back-face-side Au plating layer on surfaces of back-face-side connection terminals of the component board; covering the first main-face-side Au plating layer with a protection layer; forming a second back-face-side Au plating layer on the first back-face-side Au plating layer; and removing the protection layer after completing the second Au plating step. Alternatively, the first back-face-side Au plating layer may be removed after completing the masking step. Displacement Au plating is used as the first and second Au plating.

摘要翻译： 一种部件板的制造方法，其包括在背面侧连接面的主面侧连接端子和第一背面侧Au镀层的表面上形成第一主面侧Au镀层 组件板端子; 用保护层覆盖第一主面Au镀层; 在所述第一背面侧Au镀层上形成第二背面侧Au镀层; 以及在完成第二Au镀层步骤之后去除保护层。 或者，可以在完成掩模步骤之后去除第一背面侧Au镀层。 使用位移Au电镀作为第一和第二Au镀层。

公开(公告)号：US06546622B2

公开(公告)日：2003-04-15

申请号：US09808980

申请日：2001-03-16

申请人： Masahiro Iba ,  Hisashi Wakako ,  Kazuhisa Sato ,  Haruhiko Murata ,  Kazuyuki Takahashi ,  Kenzo Kawaguchi

发明人： Masahiro Iba ,  Hisashi Wakako ,  Kazuhisa Sato ,  Haruhiko Murata ,  Kazuyuki Takahashi ,  Kenzo Kawaguchi

IPC分类号： H05K302

CPC分类号： H01L23/5383 ,  H01L2224/16225 ,  H05K1/0266 ,  H05K3/28 ,  H05K3/381 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2203/107 ,  H05K2203/122 ,  H05K2203/161 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158

摘要： A printed-wiring substrate 1 includes internal dielectric resin layers 12 and 14. A main-surface-side external dielectric resin layer 13 is formed on the internal dielectric resin layer 12 such that the surface thereof serves as a substrate main-surface 1A. A back-surface-side external dielectric resin layer 15 is formed on the internal dielectric resin layer 14 such that the surface thereof serves as a substrate back-surface 1B. A surface 12A of the main-surface-side internal dielectric resin layer 12 and a surface 14A of the back-surface-side internal dielectric resin layer 14 are roughened. The substrate main-surface 1A and the substrate back-surface 1B are roughened such that surface roughness thereof is lower than that of the surfaces 12A and 14A.

摘要翻译： 印刷布线基板1包括内部电介质树脂层12和14.主表面侧外部电介质树脂层13形成在内部电介质树脂层12上，使得其表面用作基板主表面1A。 在内部电介质树脂层14上形成背面侧外部电介质树脂层15，使其表面作为基板背面1B。 主表面侧内部电介质树脂层12的表面12A和背面侧内部电介质树脂层14的表面14A被粗糙化。 基板主表面1A和基板背面1B被粗糙化，使得表面粗糙度低于表面12A和14A的表面粗糙度。