Abstract:
A transistor includes first and second pairs of vertically overlaid source/drain regions on a substrate. Respective first and second vertical channel regions extend between the overlaid source/drain regions of respective ones of the first and second pairs of overlaid source/drain regions. Respective first and second insulation regions are disposed between the overlaid source/drain regions of the respective first and second pairs of overlaid source/drain regions and adjacent respective ones of the first and second vertical channel regions. Respective first and second gate insulators are disposed on respective ones of the first and second vertical channel regions. A gate electrode is disposed between the first and second gate insulators. The first and second vertical channel regions may be disposed near adjacent edges of the overlaid source/drain regions.
Abstract:
A semiconductor device having a field effect transistor and a method of fabricating the same. In-situ doped epitaxial patterns are respectively formed at both sidewalls of a protruded channel pattern from a substrate by performing an in-situ doped epitaxial growth process. The in-situ doped epitaxial pattern has a conformal impurity concentration throughout. Accordingly, source/drain regions with a conformal impurity concentration are connected throughout a channel width of a channel region including both sidewalls of a protruded channel pattern. As a result, it is possible to maximize a driving current of the filed effect transistor, and an on-off characteristic can be highly stabilized.
Abstract:
A non-volatile memory device for 2-bit operation and a method of fabricating the same are provided. The non-volatile memory device includes an active region and a gate extending in a word line direction on a semiconductor substrate, and crossing each other repeatedly; a charge storage layer disposed below the gate, and confined at a portion where the gate and the active region cross; a charge blocking layer formed on the charge storage layer; a tunnel dielectric layer formed below the charge storage layer; first and second source/drain regions formed in the active region exposed by the gate; and first and second bit lines crossing the word line direction. The active region may be formed in a first zigzag pattern and/or the gate may be formed in a second zigzag pattern in symmetry with the first zigzag pattern.
Abstract:
Provided is a nonvolatile memory device having a three dimensional structure. The nonvolatile memory device includes a plurality of stacked semiconductor layers and a plurality of memory cell transistors which is formed on each of a plurality of semiconductor layers and serially connected. Memory cell transistors disposed on different semiconductor layers are serially connected to include one cell string forming a current path in a plurality of semiconductor layers, a first selection transistor serially connected to one edge portion of the cell string and a second selection transistor serially connected to the other edge portion of the cell string.
Abstract:
A method for manufacturing cover lay of printed circuit board is disclosed. With a method that includes preparing a board on which a circuit pattern is formed, and jetting a protecting ink selectively on the board by inkjet printing, a cover lay of a complicated shape may be formed easily with high accuracy and high productivity, as a polymer ink is jetted by inkjet printing to form the cover lay for a flexible circuit board.
Abstract:
The present invention relates to a metal ink composition for inkjet printing, more particularly to a metal ink composition which includes 20 to 85 weight % of metal nanoparticles and 15 to 80 weight % of organic solvent, where the organic solvent is made of an ethylene glycol-based ether or a mixed solvent including an ethylene glycol-based ether. The invention provides a metal ink composition in which an organic solvent suited for an inkjet head is used to improve the ejection, storage, and viscosity properties of the ink.
Abstract:
A semiconductor device includes a semiconductor substrate having a first conductivity type and having an upper portion, a pair of bit lines extending in a first direction and doped with an impurity of a second conductivity type opposite to the first conductivity type and spaced from one another in the upper portion of the semiconductor substrate, a first line formed between the pair of bit lines having a plurality of alternating recessed device isolation regions and channel regions, with each of the channel regions contacting each bit line of the at least one pair of bit lines, and word lines formed at right angles to the first lines and covering the channel regions.
Abstract:
The present invention provides a method of producing metal nanoparticles, having a high yield rate and uniform size achieved by employing a heterologous reducing agent that considerably reduces unreactant, and using ethylene glycol that allows effective separation of desired metal nanoparticles. In addition, the present invention provides metal nanoparticles having high dispersion stability achieved by capping with polyvinyl pyrrolidone(PVP) and conductive ink including these metal nanoparticles. One aspect of the invention may provide a method of producing nanoparticles comprising, (a) mixing ethylene glycol, capping molecules and a reducing agent, (b) mixing a metal precursor with alcohol-based compound and reacting it with the mixture of (a), and (c) finishing the reaction by adding acetone and ethylene glycol to the reaction solution (b).
Abstract:
A unit cell of a metal oxide semiconductor (MOS) transistor is provided including an integrated circuit substrate and a MOS transistor on the integrated circuit substrate. The MOS transistor has a source region, a drain region and a gate. The gate is between the source region and the drain region. First and second spaced apart buffer regions are provided beneath the source region and the drain region and between respective ones of the source region and integrated circuit substrate and the drain region and the integrated circuit substrate.
Abstract:
The PCB manufactured by spraying conductive ink dispersed with Ag—Pd alloy nanoparticles and curing to form wiring according to the present invention provides reduced migration of Ag ions. Further, the present invention provides a method for manufacturing PCB which exhibits competitive price, and excellent conductivity and anti-migration. As one aspect of the present invention, a conductive ink comprising Ag—Pd alloy nanoparticles, wherein the Ag—Pd alloy nanoparticles includes Pd in the range of from 5 weight % to 40 weight %.