公开(公告)号：US5581195A

公开(公告)日：1996-12-03

申请号：US345447

申请日：1994-11-21

申请人： Kyu J. Lee ,  Hyeon J. Jeong

发明人： Kyu J. Lee ,  Hyeon J. Jeong

IPC分类号： G01R31/26 ,  G01R1/04 ,  G01R31/28 ,  H01L21/326 ,  H01L21/66 ,  G01R31/02

CPC分类号： G01R1/0483 ,  G01R31/2863

摘要： An appartus for testing bare semiconductor chips, especially for burn-in testing, includes a chip holding socket which comprises a substrate portion having at least one pair of opposing grooves formed along respective edges thereof. A pair of resilient elongate members are inserted into the grooves, and act to hold a respective bare chip in the holding socket. Preferably, a plurality of such holding sockets are mounted and electrically connected to a main test board, by which test signals are provided to test the bare semiconductor chips. A method for manufacturing such a testing apparatus is also disclosed herein.

摘要翻译： 用于测试裸露的半导体芯片的特别用于老化测试的配件包括：芯片保持插座，其包括具有沿其相应边缘形成的至少一对相对的沟槽的衬底部分。 一对弹性细长构件插入槽中，并且用于将相应的裸芯片保持在保持插座中。 优选地，多个这样的保持插座安装并电连接到主测试板，由此提供测试信号以测试裸半导体芯片。 本文还公开了一种用于制造这种测试装置的方法。

公开(公告)号：US5468991A

公开(公告)日：1995-11-21

申请号：US158740

申请日：1993-11-30

申请人： Joon K. Lee ,  Hyeon J. Jeong

发明人： Joon K. Lee ,  Hyeon J. Jeong

IPC分类号： H01L21/56 ,  H01L23/28 ,  H01L23/495 ,  H01L23/50 ,  H01L23/48 ,  H01L29/43 ,  H01L29/54

CPC分类号： H01L23/4951 ,  H01L2924/0002

摘要： A lead frame for a semiconductor device used in a vertically surface-mounted package which has internal leads gathered on one side thereof includes separately formed dummy leads attached to a semiconductor chip on the opposite side of the lead frame to avoid an inconsistent inflow pressure of a molding material during a package molding process caused by gathering of the internal leads on only one side, thereby enhancing reliability of the semiconductor package. There is also no need to separately form a heat sink structure for eliminating heat of the semiconductor chip since the dummy leads function as the heat sink.

摘要翻译： 用于垂直表面安装封装的半导体器件的引线框架，其具有聚集在其一侧上的内部引线，包括附接到引线框架相对侧上的半导体芯片的单独形成的虚拟引线，以避免引线框架的不一致的流入压力 在封装成型过程中由内部引线聚集在一侧引起的成型材料，从而提高半导体封装的可靠性。 由于虚设引线用作散热器，因此也不需要分开形成用于消除半导体芯片的热量的散热器结构。

公开(公告)号：US5250840A

公开(公告)日：1993-10-05

申请号：US6202

申请日：1993-01-19

申请人： Dong Y. Oh ,  Hyeon J. Jeong ,  Heung K. Kwon

发明人： Dong Y. Oh ,  Hyeon J. Jeong ,  Heung K. Kwon

IPC分类号： H01L23/495 ,  H01L23/48

CPC分类号： H01L23/4951 ,  H01L23/49541 ,  H01L2224/451 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/14

摘要： A semiconductor lead frame is disclosed to improve the characteristics and reliability of a semiconductor device using lines of bonding pads in a cross-arrangement. The semiconductor lead frame comprises a rectangular semiconductor chip with a plurality of output terminals of associated circuits, a plurality of leads having inner and outer ends, bus bars extending around the inner ends of the leads, at least one insulator disposed between the semiconductor chip and the inner ends of the leads for electrically insulating the chip and the leads, metal wires electrically connecting the inner ends of the leads to selected and respective bonding pads and the bus bars to the pads in common. The leads are inclined relative to the lines of pads to form a line of outer terminals for the lead frame which extend over a distance exceeding the length of the chip. The semiconductor device can thereby accommodate a great number of bonding pads in response to the high density demand without increasing the size of the chip.

摘要翻译： 公开了一种半导体引线框架，以改善使用交叉布置的焊盘线的半导体器件的特性和可靠性。 半导体引线框架包括具有多个相关电路的输出端的矩形半导体芯片，具有内端和外端的多个引线，围绕引线的内端延伸的汇流条，设置在半导体芯片和 用于使芯片和引线电绝缘的引线的内端，将引线的内端电连接到选定的和相应的焊盘和母线的金属线共同地焊接到焊盘。 引线相对于焊盘线倾斜，以形成引线框架的外部端子线，其延伸超过芯片的长度。 因此，半导体器件可以响应于高密度需求而容纳大量的焊盘，而不增加芯片的尺寸。

公开(公告)号：US5349235A

公开(公告)日：1994-09-20

申请号：US111518

申请日：1993-08-25

申请人： Joon K. Lee ,  Hyeon J. Jeong ,  Kyung S. Kim ,  Oh-Sik Kwon

发明人： Joon K. Lee ,  Hyeon J. Jeong ,  Kyung S. Kim ,  Oh-Sik Kwon

IPC分类号： H01L21/56 ,  H01L23/00 ,  H01L23/04 ,  H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H05K1/18 ,  H05K3/30 ,  H01L23/16

CPC分类号： H01L23/562 ,  H01L23/3107 ,  H01L23/49555 ,  H05K3/303 ,  H01L2924/0002 ,  H05K2201/10454 ,  H05K2201/10522 ,  H05K2201/10568 ,  H05K2201/10696 ,  Y02P70/613

摘要： A semiconductor chip package comprises leads which protrude from one side of a package body, and support portions which are formed at both ends of the package body on either side of the leads for firmly mounting the package on a printed circuit board (PCB). The support portions are made of a same material as the package body. At the package body, a slot is formed to further protect the leads, and the leads are alternately formed to mount the packages close by. Thus, there is no additional process step for forming holes in the PCB to mount the support portions of the semiconductor package, so the mounting process of the package becomes simpler. The support portions which protrude from the package body permit the package to be mounted on the PCB firmly. The slot and support portions protect the leads and prevent the leads from being deformed by external forces, thereby improving the reliability of the semiconductor package. Also, since the leads are alternately formed and the packages can be mounted near to each other, the package occupies only a small area of the PCB, thereby improving the packing density.

摘要翻译： 半导体芯片封装包括从封装主体的一侧突出的引线，以及在引线的两侧形成在封装主体的两端的支撑部分，用于将封装牢固地安装在印刷电路板（PCB）上。 支撑部分由与包装体相同的材料制成。 在封装主体上，形成一个槽以进一步保护引线，并且引线交替地形成为将封装安装在靠近处。 因此，没有用于在PCB中形成孔以安装半导体封装的支撑部分的附加工艺步骤，因此封装的安装过程变得更简单。 从包装体突出的支撑部分使得包装件能够牢固地安装在PCB上。 槽和支撑部分保护引线并防止引线由于外力而变形，从而提高半导体封装的可靠性。 此外，由于引线交替形成并且封装可以彼此靠近地安装，所以封装仅占用PCB的小面积，从而提高封装密度。