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    APPARATUS AND METHOD FOR MONITORING GLASS PLATE POLISHING STATE
    2.
    发明申请
    APPARATUS AND METHOD FOR MONITORING GLASS PLATE POLISHING STATE 有权
    用于监控玻璃板抛光状态的装置和方法

    公开(公告)号：US20110223834A1

    公开(公告)日：2011-09-15

    申请号：US13045273

    申请日：2011-03-10

    申请人： Won-Jae MOON ,  Hyung-Young Oh ,  Dae-Yeon Lee ,  Jae-Ik Song ,  Young-Kuk Kim ,  Kyu-Chul Chung ,  Hyun-Chul Chung

    发明人： Won-Jae MOON ,  Hyung-Young Oh ,  Dae-Yeon Lee ,  Jae-Ik Song ,  Young-Kuk Kim ,  Kyu-Chul Chung ,  Hyun-Chul Chung

    IPC分类号： B24B49/10

    CPC分类号： B24B49/10 ,  B24B7/24 ,  B24B13/015

    摘要： Disclosed are an apparatus and a method for monitoring a glass plate polishing state. The apparatus may include a location measuring unit for measuring a location on a glass plate being polished by a polishing machine, a current measuring unit for measuring an electric current flowing into the polishing machine, a memory unit for storing a reference value of the electric current flowing into the polishing machine for each polishing location of the glass plate, and a control unit for determining whether a polishing state is faulty, by comparing a value of the electric current measured by the current measuring unit for each polishing location measured by the location measuring unit with a corresponding reference value of the electric current stored in the memory unit for each polishing location.

    摘要翻译： 公开了一种用于监测玻璃板研磨状态的装置和方法。 该装置可以包括位置测量单元，用于测量由抛光机抛光的玻璃板上的位置，用于测量流入抛光机的电流的电流测量单元，用于存储电流参考值的存储单元 流入玻璃板的每个抛光位置的抛光机，以及用于通过比较由测量位置测量的每个抛光位置由当前测量单元测量的电流的值来确定抛光状态是否有故障的控制单元 单元，其具有针对每个抛光位置存储在存储器单元中的对应的电流参考值。

    Apparatus and method for monitoring glass plate polishing state
    4.
    发明授权
    Apparatus and method for monitoring glass plate polishing state 有权
    监控玻璃板抛光状态的装置和方法

    公开(公告)号：US09028294B2

    公开(公告)日：2015-05-12

    申请号：US13045273

    申请日：2011-03-10

    申请人： Won-Jae Moon ,  Hyung-Young Oh ,  Dae-Yeon Lee ,  Jae-Ik Song ,  Young-Kuk Kim ,  Kyu-Chul Chung ,  Hyun-Chul Chung

    发明人： Won-Jae Moon ,  Hyung-Young Oh ,  Dae-Yeon Lee ,  Jae-Ik Song ,  Young-Kuk Kim ,  Kyu-Chul Chung ,  Hyun-Chul Chung

    IPC分类号： B24B49/00 ,  B24B49/10 ,  B24B7/24 ,  B24B13/015

    CPC分类号： B24B49/10 ,  B24B7/24 ,  B24B13/015

    摘要： Disclosed are an apparatus and a method for monitoring a glass plate polishing state. The apparatus may include a location measuring unit for measuring a location on a glass plate being polished by a polishing machine, a current measuring unit for measuring an electric current flowing into the polishing machine, a memory unit for storing a reference value of the electric current flowing into the polishing machine for each polishing location of the glass plate, and a control unit for determining whether a polishing state is faulty, by comparing a value of the electric current measured by the current measuring unit for each polishing location measured by the location measuring unit with a corresponding reference value of the electric current stored in the memory unit for each polishing location.

    摘要翻译： 公开了一种用于监测玻璃板研磨状态的装置和方法。 该装置可以包括位置测量单元，用于测量由抛光机抛光的玻璃板上的位置，用于测量流入抛光机的电流的电流测量单元，用于存储电流参考值的存储单元 流入玻璃板的每个抛光位置的抛光机，以及用于通过比较由测量位置测量的每个抛光位置由当前测量单元测量的电流的值来确定抛光状态是否有故障的控制单元 单元，其具有针对每个抛光位置存储在存储器单元中的对应的电流参考值。