-
1.Semiconductor chip module, semiconductor package having the same and package module 有权
标题翻译: 半导体芯片模块,半导体封装与封装模块相同公开(公告)号:US08736075B2
公开(公告)日:2014-05-27
申请号:US13249569
申请日:2011-09-30
申请人: Hyung Ju Choi , Mun Aun Hyun , Jong Hyun Kim , Hyeon Ji Baek
发明人: Hyung Ju Choi , Mun Aun Hyun , Jong Hyun Kim , Hyeon Ji Baek
CPC分类号: H01L25/00 , H01L23/3128 , H01L23/49816 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L2224/0401 , H01L2224/04042 , H01L2224/0603 , H01L2224/131 , H01L2224/1403 , H01L2224/16145 , H01L2224/1703 , H01L2224/24011 , H01L2224/24051 , H01L2224/24226 , H01L2224/245 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73209 , H01L2224/73253 , H01L2224/81193 , H01L2225/0651 , H01L2225/06513 , H01L2225/06562 , H01L2225/1052 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/014 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor module comprising a plurality of semiconductor chips where at least one semiconductor chip is laterally offset with respect to a second semiconductor chip, and substantially aligned with a third semiconductor chip such that an electrical connection can be made between an electrical contact in the first semiconductor chip and an electrical contact in the third semiconductor chip.
摘要翻译: 一种半导体模块,包括多个半导体芯片,其中至少一个半导体芯片相对于第二半导体芯片横向偏移,并且基本上与第三半导体芯片对齐,使得可以在第一半导体中的电接触之间形成电连接 芯片和第三半导体芯片中的电接触。
-
2.SEMICONDUCTOR CHIP MODULE, SEMICONDUCTOR PACKAGE HAVING THE SAME AND PACKAGE MODULE 有权
标题翻译: 半导体芯片模块,具有相同模块和封装模块的半导体封装公开(公告)号:US20120187560A1
公开(公告)日:2012-07-26
申请号:US13249569
申请日:2011-09-30
申请人: Hyung Ju CHOI , Mun Aun HYUN , Jong Hyun KIM , Hyeon Ji BAEK
发明人: Hyung Ju CHOI , Mun Aun HYUN , Jong Hyun KIM , Hyeon Ji BAEK
IPC分类号: H01L23/485
CPC分类号: H01L25/00 , H01L23/3128 , H01L23/49816 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L2224/0401 , H01L2224/04042 , H01L2224/0603 , H01L2224/131 , H01L2224/1403 , H01L2224/16145 , H01L2224/1703 , H01L2224/24011 , H01L2224/24051 , H01L2224/24226 , H01L2224/245 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73209 , H01L2224/73253 , H01L2224/81193 , H01L2225/0651 , H01L2225/06513 , H01L2225/06562 , H01L2225/1052 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/014 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor module comprising a plurality of semiconductor chips where at least one semiconductor chip is laterally offset with respect to a second semiconductor chip, and substantially aligned with a third semiconductor chip such that an electrical connection can be made between an electrical contact in the first semiconductor chip and an electrical contact in the third semiconductor chip.
摘要翻译: 一种半导体模块,包括多个半导体芯片,其中至少一个半导体芯片相对于第二半导体芯片横向偏移,并且基本上与第三半导体芯片对齐,使得可以在第一半导体中的电接触之间形成电连接 芯片和第三半导体芯片中的电接触。
-